Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG592C: High-Performance AMD Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG592C is a powerful field-programmable gate array (FPGA) from AMD’s proven Spartan-II family, engineered to deliver exceptional performance and reliability for demanding digital design applications. This cost-effective programmable logic device combines 200,000 system gates with advanced routing architecture, making it an ideal solution for telecommunications, industrial automation, automotive systems, and embedded computing projects. Whether you’re prototyping complex digital circuits or deploying production-ready hardware, the XC2S200-6FGG592C offers the flexibility and performance that engineers demand.


XC2S200-6FGG592C Technical Specifications Overview

The XC2S200-6FGG592C features a comprehensive set of technical specifications that position it as a versatile solution for diverse electronic design requirements. Built on proven 0.18µm CMOS technology, this FPGA delivers outstanding price-to-performance ratio while maintaining the quality standards expected from AMD semiconductor products.

Core Architecture Specifications

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Maximum User I/O 284
Block RAM 56 Kbits
Distributed RAM 75,264 bits
Delay-Locked Loops (DLLs) 4
Maximum Clock Frequency 263 MHz

Electrical Characteristics

Parameter Specification
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V to 3.3V
Process Technology 0.18µm CMOS
Speed Grade -6 (Highest Performance)
Temperature Range Commercial (0°C to +85°C)

Package Information

Parameter Specification
Package Type Fine-Pitch Ball Grid Array (FBGA)
Pin Count 592
Package Code FGG592
RoHS Status Pb-Free Compliant

Key Features of the XC2S200-6FGG592C Spartan-II FPGA

High-Density Configurable Logic Blocks (CLBs)

The XC2S200-6FGG592C incorporates an advanced CLB architecture that serves as the foundation for implementing complex digital logic. Each Configurable Logic Block contains four Logic Cells (LCs), with each LC featuring a 4-input function generator, carry logic, and a storage element. This architecture enables efficient implementation of arithmetic functions, state machines, and data path elements.

The function generators within the CLBs can be configured as 4-input look-up tables (LUTs), providing maximum flexibility for combinatorial logic design. Additionally, these LUTs can function as 16×1 synchronous RAM or 16-bit shift registers, offering designers multiple implementation options without consuming additional resources.

Flexible Block RAM Memory

One of the standout features of the XC2S200-6FGG592C is its integrated Block RAM capability. With 56 Kbits of dedicated block memory organized into multiple 4,096-bit blocks, designers can implement efficient data buffering, FIFO structures, and lookup tables without consuming valuable distributed logic resources.

Each Block RAM cell operates as a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port. The configurable data width options allow port widths from 1 to 16 bits, enabling optimization for specific application requirements. This flexibility makes the XC2S200-6FGG592C particularly suitable for applications requiring significant on-chip memory resources.

Advanced I/O Capabilities

The XC2S200-6FGG592C supports 16 different single-ended I/O standards, providing exceptional interface flexibility for connecting to various external components and systems. Supported standards include:

  • LVTTL (Low-Voltage TTL)
  • LVCMOS (Low-Voltage CMOS) – 2V and 3.3V
  • PCI (33 MHz and 66 MHz compliant)
  • GTL and GTL+
  • HSTL (High-Speed Transceiver Logic)
  • SSTL (Stub Series Terminated Logic)
  • AGP-2X (Accelerated Graphics Port)

The programmable I/O banking architecture divides the device into two banks, each capable of supporting different voltage standards simultaneously. This feature enables direct interfacing between logic operating at different voltage levels without external level translation components.

Four Delay-Locked Loops (DLLs)

Clock management is critical in high-performance digital systems, and the XC2S200-6FGG592C addresses this with four integrated Delay-Locked Loops. Located at each corner of the die, these DLLs provide:

  • Clock deskewing – Eliminates clock distribution delays between the input pad and internal clock pins
  • Clock multiplication and division – Generates frequencies at 2X, 4X, 1.5X, 2.5X or divided versions of the input clock
  • Phase shifting – Provides precise phase control for timing-critical applications
  • Clock mirroring – Enables board-level clock deskewing across multiple devices

XC2S200-6FGG592C Applications and Use Cases

Telecommunications Equipment

The XC2S200-6FGG592C excels in telecommunications applications where high-speed data processing and flexible protocol handling are essential. Common implementations include channel coding/decoding, protocol conversion, and baseband signal processing for wireless infrastructure equipment.

Industrial Automation and Control

For industrial control systems, this Spartan-II FPGA provides the real-time processing capability and I/O flexibility required for motor control, PLC replacement, sensor interfacing, and machine vision applications. The device’s commercial temperature rating ensures reliable operation in factory floor environments.

Automotive Electronics

The XC2S200-6FGG592C supports automotive applications including infotainment systems, advanced driver assistance systems (ADAS) preprocessing, and vehicle network gateways. Its reprogrammability allows manufacturers to implement field upgrades and customize functionality for different vehicle platforms.

Consumer Electronics

Cost-sensitive consumer applications benefit from the XC2S200-6FGG592C’s competitive pricing and comprehensive feature set. Applications include set-top boxes, gaming peripherals, display controllers, and audio/video processing equipment.


XC2S200-6FGG592C Development Tools and Software Support

ISE Design Suite Compatibility

The XC2S200-6FGG592C is fully supported by the ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can leverage industry-standard HDL languages including VHDL and Verilog for design entry, with integrated simulation and timing analysis tools.

Configuration Options

Multiple configuration modes ensure flexibility in system design. The XC2S200-6FGG592C supports:

  • Master Serial Mode – Device controls configuration from external serial PROM
  • Slave Serial Mode – External controller provides configuration data
  • Master Parallel Mode – 8-bit parallel configuration from PROM
  • Slave Parallel Mode – Processor-controlled parallel configuration
  • JTAG Mode – Boundary scan configuration for development and in-system programming

Why Choose the XC2S200-6FGG592C for Your FPGA Design

Cost-Effective ASIC Alternative

The XC2S200-6FGG592C represents a superior alternative to mask-programmed ASICs. By eliminating NRE (non-recurring engineering) costs and lengthy development cycles, this FPGA enables faster time-to-market while maintaining design flexibility. The ability to implement field upgrades through reprogramming provides ongoing value throughout the product lifecycle.

Proven Reliability

Built on mature 0.18µm process technology with extensive field deployment history, the Spartan-II family delivers the reliability that mission-critical applications demand. The device undergoes comprehensive qualification testing to ensure consistent performance across the specified operating conditions.

Comprehensive Documentation

Engineers working with the XC2S200-6FGG592C have access to extensive technical documentation including detailed datasheets, user guides, application notes, and reference designs. This comprehensive support ecosystem accelerates the learning curve and reduces development risk.

For more Xilinx FPGA products and technical resources, visit our dedicated FPGA solutions page.


XC2S200-6FGG592C Ordering Information

Part Number Breakdown

The XC2S200-6FGG592C part number follows AMD’s standard nomenclature:

  • XC2S – Spartan-II family identifier
  • 200 – Device density (200K system gates)
  • -6 – Speed grade (highest performance)
  • FGG – Fine-pitch Ball Grid Array package (Pb-free)
  • 592 – Pin count
  • C – Commercial temperature range (0°C to +85°C)

Availability and Lead Times

The XC2S200-6FGG592C is available through authorized AMD distributors worldwide. Contact your local distributor for current pricing, inventory availability, and lead time information. Volume pricing programs are available for production quantities.


XC2S200-6FGG592C Frequently Asked Questions

What development tools are required for the XC2S200-6FGG592C?

The XC2S200-6FGG592C is supported by the ISE Design Suite, which includes all necessary tools for design entry, synthesis, place-and-route, timing analysis, and programming. Both schematic and HDL-based design methodologies are supported.

Can the XC2S200-6FGG592C be reconfigured in-system?

Yes, the device supports in-system reconfiguration through multiple configuration modes. This capability enables field upgrades, design modifications, and even dynamic partial reconfiguration in advanced applications.

What is the recommended configuration PROM for the XC2S200-6FGG592C?

The device is compatible with XC18V-series Platform Flash PROMs and various industry-standard serial configuration memories. PROM selection depends on configuration mode and bitstream size requirements.

Is the XC2S200-6FGG592C suitable for new designs?

While the Spartan-II family is a mature product line, the XC2S200-6FGG592C remains available for applications where its specific capabilities and price point offer advantages. For new designs requiring similar functionality, engineers may also consider the Spartan-6 or Artix-7 families for enhanced performance.


Summary

The XC2S200-6FGG592C delivers a compelling combination of performance, flexibility, and value for FPGA-based designs. With 200,000 system gates, 56 Kbits of Block RAM, four DLLs, and support for 16 I/O standards, this Spartan-II device provides the resources needed for complex digital implementations. The -6 speed grade ensures maximum performance for timing-critical applications, while the commercial temperature rating and proven reliability make it suitable for professional product development.

Whether you’re implementing telecommunications equipment, industrial controls, or embedded computing solutions, the XC2S200-6FGG592C offers the programmable logic capabilities to bring your design vision to reality.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.