The XC2S200-6FGG588C is a high-performance Field Programmable Gate Array (FPGA) from the renowned AMD Xilinx Spartan-II family. This cost-effective programmable logic device delivers exceptional processing capabilities with 200,000 system gates and 5,292 logic cells, making it an ideal solution for telecommunications, industrial automation, and embedded system applications.
XC2S200-6FGG588C Key Features and Specifications
The XC2S200-6FGG588C combines advanced programmable logic architecture with industry-leading reliability. As a member of the Xilinx FPGA Spartan-II family, this device offers engineers a superior alternative to mask-programmed ASICs with unlimited in-system reprogrammability.
XC2S200-6FGG588C Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
| Delay-Locked Loops (DLLs) |
4 |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18µm |
| Core Voltage |
2.5V |
| Package Type |
Fine Pitch Ball Grid Array (FBGA) |
| Speed Grade |
-6 (Commercial) |
| Operating Temperature |
0°C to +85°C |
XC2S200-6FGG588C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG588C features 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB contains four logic cells (LCs) organized in two slices, providing the building blocks for implementing complex digital designs. The logic cells include 4-input function generators implemented as look-up tables (LUTs), carry logic for high-speed arithmetic operations, and storage elements for sequential logic.
Block RAM Memory Architecture
This Spartan-II FPGA integrates 14 dedicated block RAM modules providing 56 Kbits of on-chip memory. Each block RAM cell is a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The configurable data widths support flexible memory configurations for data buffering, FIFO implementation, and embedded memory applications.
Distributed RAM Resources
In addition to block RAM, the XC2S200-6FGG588C provides 75,264 bits of distributed RAM implemented through the LUTs in the CLBs. This distributed memory architecture enables shallow memory structures and complements the block RAM for optimized memory utilization.
Delay-Locked Loop (DLL) Technology
Four Delay-Locked Loops positioned at each corner of the die provide advanced clock management capabilities. The DLLs support clock deskewing, frequency synthesis, and clock mirroring for board-level clock distribution, enabling system performance up to 200 MHz.
XC2S200-6FGG588C I/O Standards and Interface Support
Supported I/O Standards
The XC2S200-6FGG588C supports 16 different I/O standards for seamless integration with various system components:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS)
- PCI (Peripheral Component Interconnect)
- GTL (Gunning Transceiver Logic)
- GTL+
- HSTL (High-Speed Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
- CTT (Center Tap Terminated)
- AGP (Accelerated Graphics Port)
I/O Bank Architecture
The device organizes I/Os into banks, allowing multiple voltage standards to coexist on a single device. LVTTL, LVCMOS2, and PCI inputs are 5V tolerant, providing robust interfacing capabilities with legacy systems and mixed-voltage designs.
XC2S200-6FGG588C Package Information
FBGA Package Specifications
The XC2S200-6FGG588C utilizes a Fine Pitch Ball Grid Array (FBGA) package that provides excellent thermal performance, superior signal integrity, and reliable solder joint connections. This surface mount package is optimized for automated assembly processes and high-density PCB designs.
Pin Configuration
The package provides 284 user-programmable I/O pins plus four dedicated global clock input pins. The ball grid array configuration ensures short signal paths and reduced inductance for high-speed digital applications.
XC2S200-6FGG588C Applications
Industrial Automation
The XC2S200-6FGG588C excels in industrial control systems requiring real-time processing, motor control, and programmable logic controller (PLC) replacement applications.
Telecommunications Equipment
This FPGA is well-suited for telecommunications infrastructure including base station equipment, network switches, and protocol conversion applications requiring flexible and reprogrammable hardware.
Embedded Systems
The combination of logic resources, memory, and I/O flexibility makes the XC2S200-6FGG588C ideal for embedded applications including digital signal processing, control systems, and custom peripheral interfaces.
Consumer Electronics
Cost-sensitive consumer applications benefit from the XC2S200-6FGG588C’s combination of performance and value, enabling rapid product development and field-upgradeable designs.
Automotive Applications
Industrial temperature range options support automotive electronics applications requiring reliable operation in harsh environmental conditions.
XC2S200-6FGG588C Development Tools and Software
Xilinx ISE Design Suite
The XC2S200-6FGG588C is fully supported by the Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. The development environment supports both VHDL and Verilog hardware description languages.
Configuration Options
Multiple configuration modes are available including:
- Master Serial Mode
- Slave Serial Mode
- Slave Parallel Mode
- Boundary Scan (JTAG)
Configuration data can be stored in external serial PROMs, flash memory, or delivered from a microprocessor for maximum flexibility.
XC2S200-6FGG588C Ordering Information
Part Number Breakdown
- XC2S200: Device designation (200K system gates)
- -6: Speed grade (fastest, Commercial temperature only)
- FGG: Fine Pitch BGA package with Pb-free option
- 588: Pin count
- C: Commercial temperature range (0°C to +85°C)
Pb-Free Packaging
The “G” in the package designation indicates Pb-free (lead-free) packaging, compliant with RoHS environmental regulations for electronic components.
Why Choose the XC2S200-6FGG588C FPGA
Cost-Effective ASIC Alternative
The XC2S200-6FGG588C eliminates the initial costs, lengthy development cycles, and inherent risks associated with conventional ASICs. FPGA programmability enables design upgrades in the field without hardware replacement.
Fast Time-to-Market
Programmable logic accelerates product development cycles, allowing engineers to implement and verify designs rapidly. Design iterations can be completed in hours rather than weeks.
Design Flexibility
Unlimited in-system reprogrammability supports evolving requirements, standards updates, and bug fixes throughout the product lifecycle.
Proven Reliability
The Spartan-II architecture has been deployed in millions of applications worldwide, demonstrating exceptional reliability and long-term availability.
XC2S200-6FGG588C Technical Documentation
Comprehensive technical documentation supports successful implementation:
- Complete Datasheet (DS001)
- User Guide with implementation guidelines
- Application Notes for common design patterns
- Development board documentation
- Configuration and programming guides
Conclusion
The XC2S200-6FGG588C delivers an optimal balance of performance, features, and cost-effectiveness for FPGA-based designs. With 200,000 system gates, 5,292 logic cells, 56K block RAM, and support for 16 I/O standards, this Spartan-II FPGA provides engineers with a reliable, flexible platform for developing next-generation electronic systems across multiple industries.