The XC2S200-6FGG576C is a powerful Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family. This programmable logic device delivers exceptional performance with 200,000 system gates, 5,292 logic cells, and a robust 576-pin Fine-Pitch Ball Grid Array (FGG576) package. Engineered for cost-sensitive applications requiring reliable digital logic implementation, the XC2S200-6FGG576C provides designers with unmatched flexibility and processing capabilities.
XC2S200-6FGG576C Overview and Key Features
The AMD XC2S200-6FGG576C represents the flagship device in the Spartan-II FPGA family. This FPGA combines advanced programmable logic architecture with comprehensive I/O capabilities, making it an ideal solution for embedded systems, telecommunications equipment, and industrial automation applications.
Why Choose the XC2S200-6FGG576C?
Engineers and designers select this FPGA for several compelling reasons:
- Superior Alternative to ASICs: The XC2S200-6FGG576C eliminates the initial cost, lengthy development cycles, and inherent risk of mask-programmed ASICs
- Field Programmability: Design upgrades in the field require no hardware replacement
- Proven Reliability: Built on mature 0.18μm CMOS technology with extensive production history
- Cost-Effective Solution: Delivers excellent price-to-performance ratio for mid-to-high density designs
XC2S200-6FGG576C Technical Specifications
Understanding the detailed specifications helps engineers make informed design decisions. Below are the comprehensive technical parameters for this Spartan-II FPGA.
Logic Resources
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Slices |
2,352 |
| Flip-Flops |
4,704 |
Memory Architecture
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Block RAM Blocks |
14 |
| Maximum RAM Depth |
4,096 × 1 bit |
Package and Electrical Characteristics
| Characteristic |
Value |
| Package Type |
576-Pin Fine-Pitch BGA (FGG576) |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Speed Grade |
-6 (Commercial) |
| Operating Temperature |
0°C to +85°C |
| Process Technology |
0.18μm CMOS |
| Maximum User I/O |
284 |
| RoHS Status |
Compliant (Pb-Free) |
XC2S200-6FGG576C Architecture Deep Dive
The Spartan-II architecture provides a powerful foundation for implementing complex digital designs. Let’s explore the key architectural components.
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG576C features 1,176 CLBs arranged in a 28 × 42 array. Each CLB contains:
- Four Logic Cells (LCs): The fundamental building blocks
- 4-Input Look-Up Tables (LUTs): Function generators for combinatorial logic
- D-Type Flip-Flops: Storage elements configurable as edge-triggered or level-sensitive latches
- Fast Carry Logic: Dedicated routing for high-speed arithmetic operations
- Distributed RAM Capability: Each LUT can function as 16 × 1-bit synchronous RAM
Dual-Port Block RAM
The fourteen block RAM modules in the XC2S200-6FGG576C provide significant on-chip memory resources:
- Fully synchronous dual-port operation
- Independent control signals per port
- Configurable aspect ratios (1 × 4096 to 16 × 256)
- Cascadable for larger memory implementations
Clock Management with DLLs
Four Delay-Locked Loops (DLLs) positioned at each die corner deliver:
- Clock deskewing for optimal timing margins
- Clock multiplication and division capabilities
- Board-level clock synchronization
- Phase-shifted clock generation
Supported I/O Standards on XC2S200-6FGG576C
Versatile I/O support makes the XC2S200-6FGG576C compatible with diverse system architectures. The FPGA supports 16 different signaling standards across eight I/O banks.
Single-Ended Standards
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS (3.3V, 2.5V, 1.8V variants)
- PCI 3.3V (33 MHz and 66 MHz)
- GTL and GTL+
Differential Standards
- LVDS (Low-Voltage Differential Signaling)
- BLVDS (Bus LVDS)
- LVPECL (Low-Voltage Positive ECL)
- SSTL (Stub Series Terminated Logic)
XC2S200-6FGG576C Application Areas
The exceptional flexibility of this Spartan-II FPGA enables deployment across numerous industries and applications.
Telecommunications and Networking
- Protocol bridging and conversion
- Data packet processing
- Interface adaptation
- Channel bonding applications
Industrial Automation
- Motor control systems
- PLC implementations
- Sensor interface aggregation
- Real-time control logic
Embedded Systems
- Microcontroller peripheral expansion
- Custom protocol implementation
- Hardware acceleration
- Legacy interface support
Consumer Electronics
- Video processing and format conversion
- Audio signal processing
- Display controllers
- Gaming peripherals
For more advanced FPGA solutions and product availability, explore our comprehensive Xilinx FPGA catalog featuring the latest programmable logic devices.
Development Tools for XC2S200-6FGG576C
AMD provides comprehensive development support through the ISE Design Suite, ensuring efficient design implementation.
ISE Design Suite Features
- Schematic and HDL design entry (Verilog/VHDL)
- Automated synthesis and implementation
- Timing analysis and constraint management
- Power estimation tools
- In-system debugging with ChipScope
Configuration Options
The XC2S200-6FGG576C supports multiple configuration modes:
- Master Serial Mode: Autonomous boot from serial PROM
- Slave Serial Mode: Configuration from external processor
- Slave Parallel Mode: High-speed byte-wide configuration
- Boundary Scan (JTAG): IEEE 1149.1 compliant programming
XC2S200-6FGG576C Ordering Information
Understanding the part number breakdown ensures correct device selection:
| Code Segment |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200K System Gate Density |
| -6 |
Speed Grade (Fastest Commercial) |
| FGG |
Fine-Pitch BGA, Pb-Free |
| 576 |
Pin Count |
| C |
Commercial Temperature Range |
Design Considerations for XC2S200-6FGG576C
Successful implementation requires attention to several critical factors.
Power Supply Requirements
- Provide clean, well-decoupled 2.5V core voltage
- Configure VCCO banks according to I/O standard requirements
- Follow recommended bypass capacitor placement guidelines
PCB Layout Guidelines
- Utilize all ground and power pins for optimal signal integrity
- Maintain proper impedance control for high-speed interfaces
- Position configuration PROM in close proximity to FPGA
Thermal Management
- Calculate power dissipation based on design utilization
- Ensure adequate airflow for commercial temperature operation
- Consider thermal vias under package for heat dissipation
Conclusion: XC2S200-6FGG576C — A Proven FPGA Solution
The XC2S200-6FGG576C stands as a reliable, cost-effective FPGA solution for applications demanding programmable logic flexibility. With its comprehensive logic resources, abundant memory, versatile I/O capabilities, and proven 0.18μm technology, this Spartan-II device continues to serve designers requiring dependable digital system implementation.
Whether you’re developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG576C delivers the performance and reliability your application demands.
