The XC2S200-6FGG573C is a powerful Field Programmable Gate Array (FPGA) from AMD/Xilinx’s proven Spartan-II family. This device delivers exceptional value for engineers seeking a cost-effective programmable logic solution with 200,000 system gates and advanced clock management features. Whether you’re developing telecommunications equipment, industrial automation systems, or embedded computing platforms, the XC2S200-6FGG573C offers the flexibility and performance your designs demand.
XC2S200-6FGG573C Key Features and Benefits
The XC2S200-6FGG573C combines robust architecture with commercial-grade reliability. This FPGA stands out as a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing initial costs while enabling field upgrades without hardware replacement.
Core Architecture Specifications
The XC2S200-6FGG573C features Xilinx’s advanced Spartan-II architecture built on 0.18μm CMOS technology. Here are the essential specifications:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
| Supply Voltage |
2.5V |
| Speed Grade |
-6 (Commercial) |
| Package Type |
573-Ball Fine Pitch BGA |
| Operating Temperature |
0°C to +85°C |
Configurable Logic Block (CLB) Resources
Each CLB in the XC2S200-6FGG573C contains two slices with four function generators. These function generators implement any 4-input Boolean function or serve as 16-bit distributed RAM elements. Moreover, the CLB structure provides fast carry logic for arithmetic operations and supports both synchronous and asynchronous designs.
Advanced Memory Architecture
The XC2S200-6FGG573C includes dual memory resources for maximum design flexibility:
Block RAM Features
The device incorporates 56 kilobits of dedicated block RAM organized in columns on opposite sides of the die. Each block RAM module offers true dual-port operation with independent read and write ports. Engineers can configure these blocks as FIFOs, content-addressable memories, or standard synchronous RAM.
Distributed RAM Capabilities
Beyond block RAM, the XC2S200-6FGG573C provides 75,264 bits of distributed RAM integrated within the CLB structure. This distributed architecture enables low-latency memory access for register files and small lookup tables.
XC2S200-6FGG573C Clock Management System
Precise timing control is essential for high-performance digital designs. The XC2S200-6FGG573C addresses this requirement with four Delay-Locked Loops (DLLs) positioned at each corner of the die.
Delay-Locked Loop (DLL) Functionality
The DLL circuits provide zero propagation delay and minimal clock skew across the entire device. Key DLL capabilities include:
- Clock frequency synthesis and multiplication
- Phase shifting for precise timing alignment
- Clock mirroring for board-level synchronization
- Automatic startup delay until clock stability is achieved
Global Clock Distribution Network
Four dedicated global clock networks span the entire XC2S200-6FGG573C FPGA. These low-skew networks ensure simultaneous clock arrival at all CLB, IOB, and block RAM clock pins.
XC2S200-6FGG573C Input/Output Capabilities
The programmable I/O structure of the XC2S200-6FGG573C supports diverse interface standards essential for modern system integration.
Supported I/O Standards
This Xilinx FPGA accommodates 16 different signaling standards:
- LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
- GTL and GTL+
- HSTL Class I, II, III, and IV
- SSTL2 Class I and II
- SSTL3 Class I and II
- CTT and AGP
- PCI 3.3V and PCI-X
IOB Register Resources
Every Input/Output Block contains three registers configurable as D-type edge-triggered flip-flops or level-sensitive latches. These registers feature independent clock enable signals and shared set/reset functionality for flexible interface timing.
XC2S200-6FGG573C Configuration Options
The XC2S200-6FGG573C supports multiple configuration modes to suit various system requirements.
Configuration File Size
The complete configuration bitstream requires 1,335,840 bits. Engineers can store this data in serial PROMs, parallel flash memory, or load it dynamically from microprocessors.
Available Configuration Modes
| Mode |
CCLK Direction |
Data Width |
Features |
| Master Serial |
Output |
1-bit |
Autonomous boot from serial PROM |
| Slave Serial |
Input |
1-bit |
Daisy-chain multiple FPGAs |
| Master Parallel |
Output |
8-bit |
Fast configuration from parallel PROM |
| Slave Parallel |
Input |
8-bit |
Processor-controlled loading |
| Boundary Scan |
N/A |
Serial |
JTAG-based configuration |
JTAG Boundary Scan Support
Full IEEE 1149.1 boundary scan compliance enables in-system programming and board-level testing. The JTAG port remains available regardless of selected configuration mode.
XC2S200-6FGG573C Application Areas
The XC2S200-6FGG573C excels across numerous industries and applications.
Telecommunications Infrastructure
Network equipment manufacturers leverage the XC2S200-6FGG573C for protocol bridging, packet processing, and interface adaptation. The device’s high I/O count and flexible clocking support various line rates and signaling standards.
Industrial Automation Systems
Factory automation controllers benefit from the XC2S200-6FGG573C’s deterministic timing and parallel processing capabilities. Motor control, sensor interfaces, and real-time data acquisition represent common industrial applications.
Embedded Computing Platforms
The XC2S200-6FGG573C serves as a versatile peripheral interface controller in embedded systems. Engineers implement custom protocols, hardware acceleration functions, and legacy interface bridges.
Consumer Electronics
Cost-sensitive consumer products utilize the XC2S200-6FGG573C for video processing, audio interfaces, and display controllers. The commercial temperature rating suits typical consumer operating environments.
XC2S200-6FGG573C Package Information
The 573-ball Fine Pitch BGA package provides optimal balance between I/O density and PCB routing ease.
Package Characteristics
- Ball pitch optimized for standard PCB fabrication
- Pb-free (RoHS compliant) solder balls indicated by “G” designation
- Thermal performance suitable for commercial applications
- Compatible with standard BGA assembly processes
Pin Assignment Considerations
Bank-based I/O voltage architecture divides the device into multiple I/O banks. Each bank supports independent VCCO voltages, enabling mixed-voltage interface designs on a single device.
XC2S200-6FGG573C Development Support
AMD/Xilinx provides comprehensive design tools for the XC2S200-6FGG573C.
ISE Design Suite Compatibility
The classic ISE Design Suite fully supports Spartan-II device development. This toolchain includes synthesis, implementation, simulation, and bitstream generation capabilities.
IP Core Availability
Pre-verified IP cores accelerate XC2S200-6FGG573C development for common functions such as:
- UART and SPI communication interfaces
- Memory controllers
- Digital signal processing blocks
- Bus bridges and protocol converters
XC2S200-6FGG573C Ordering Information
Understanding the part number structure helps ensure correct device selection.
Part Number Breakdown
XC2S200-6FGG573C
- XC2S200: Spartan-II device with 200,000 system gates
- -6: Speed grade (fastest commercial grade)
- FG: Fine pitch BGA package type
- G: Pb-free (lead-free) packaging
- 573: Total ball count
- C: Commercial temperature range (0°C to +85°C)
Why Choose the XC2S200-6FGG573C FPGA?
The XC2S200-6FGG573C delivers compelling advantages for design engineers:
- Cost-Effective Performance: 200,000 system gates at competitive pricing
- Proven Architecture: Mature Spartan-II platform with extensive deployment history
- Flexible Clocking: Four DLLs provide advanced clock management
- Rich Memory Resources: Combined block and distributed RAM totaling over 131K bits
- Broad I/O Support: 16 signaling standards for diverse interface requirements
- Environmental Compliance: RoHS-compliant Pb-free packaging option
XC2S200-6FGG573C Technical Documentation
Engineers designing with the XC2S200-6FGG573C should reference these essential documents:
- DS001: Spartan-II FPGA Family Data Sheet (complete specifications)
- Module 1: Introduction and Ordering Information
- Module 2: Functional Description
- Module 3: DC and Switching Characteristics
- Module 4: Pinout Information
Conclusion
The XC2S200-6FGG573C represents an excellent choice for engineers requiring a reliable, cost-effective FPGA solution. With 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and advanced clock management, this Spartan-II device addresses demanding applications across telecommunications, industrial, embedded, and consumer markets. The 573-ball BGA package with Pb-free options ensures modern environmental compliance while maintaining excellent signal integrity for high-speed designs.
