The XC2S200-6FGG571C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s proven Spartan-II family, engineered to deliver exceptional flexibility and reliability for demanding industrial and commercial applications. This programmable logic device combines advanced digital processing capabilities with cost-effective implementation, making it an ideal solution for engineers requiring robust embedded system design.

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XC2S200-6FGG571C Overview and Key Features

The XC2S200-6FGG571C represents the flagship device in the Spartan-II FPGA lineup, offering maximum gate density and I/O capacity for complex digital designs. Built on 0.18μm process technology with a 2.5V core voltage, this FPGA provides an excellent balance between performance, power consumption, and cost efficiency.

Core Architecture Specifications

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Spartan-II FPGA Architectural Highlights

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG571C features a highly flexible CLB architecture that forms the core logic fabric. Each CLB contains four Logic Cells (LCs) arranged in two identical slices, providing:

• Four-input Look-Up Tables (LUTs) for combinational logic implementation
• Dedicated carry logic for high-speed arithmetic operations
• D-type flip-flops with synchronous set/reset capabilities
• Distributed RAM capability for on-chip memory requirements

Input/Output Block (IOB) Features

The programmable IOBs surrounding the CLB array support multiple I/O signaling standards, enabling seamless integration with various system interfaces:

• LVTTL and LVCMOS (3.3V and 2.5V)
• GTL and GTL+
• SSTL2 and SSTL3
• CTT and HSTL
• PCI 3.3V compliant
• AGP 2X compliant

Each IOB contains three registers that can function as edge-triggered D-type flip-flops or level-sensitive latches, with independent clock enable signals for maximum design flexibility.

Block RAM Memory Architecture

The XC2S200-6FGG571C incorporates 56 Kbits of dedicated Block RAM organized in two columns along the die edges. Key Block RAM characteristics include:

• Dual-port memory with independent read/write clocks
• Configurable data widths (1, 2, 4, 8, or 16 bits)
• Synchronous operation up to 200 MHz
• Support for FIFO implementation

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Advanced Clock Management with DLLs

Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide sophisticated clock management capabilities:

• Clock deskewing for zero propagation delay
• Clock multiplication and division (up to 4×)
• Phase shifting in 90° increments
• Board-level clock synchronization across multiple Xilinx FPGA devices

The DLL architecture ensures stable, low-jitter clock distribution essential for high-speed digital design applications.

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XC2S200-6FGG571C Package Information

Fine-Pitch BGA (FGG) Package Details

The FGG package designation indicates a Fine-pitch Ball Grid Array with Pb-free (lead-free) solder balls, compliant with RoHS environmental standards. Package specifications include:

Ordering Code Breakdown

XC2S200-6FGG571C decodes as follows:

• XC2S200: Spartan-II device with 200K system gates
• -6: Fastest speed grade
• FG: Fine-pitch Ball Grid Array
• G: Pb-free (lead-free) packaging
• 571: Pin count designation
• C: Commercial temperature range (0°C to +85°C)

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Configuration Options and Programming

The XC2S200-6FGG571C supports multiple configuration modes for flexible system integration:

Configuration Mode Summary

Configuration File Size: 1,335,840 bits (approximately 163 KB)

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Typical Applications for XC2S200-6FGG571C

The XC2S200-6FGG571C FPGA excels in numerous application domains:

Industrial Automation

• Programmable Logic Controllers (PLCs)
• Motor control systems
• Industrial networking interfaces
• Process automation equipment

Communications Systems

• Protocol conversion bridges
• Data encoding/decoding
• Channel interface controllers
• Baseband signal processing

Consumer Electronics

• Digital video processing
• Audio codec implementation
• Display controllers
• Gaming peripherals

Embedded Computing

• Microcontroller peripherals
• Custom I/O expansion
• Hardware acceleration
• System-on-Chip (SoC) integration

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Development Tools and Design Support

ISE Design Suite Compatibility

AMD provides comprehensive development tool support for the XC2S200-6FGG571C through the ISE Design Suite, including:

• ISE Foundation: Complete FPGA development environment
• IP Core Generator: Pre-verified intellectual property blocks
• ChipScope Pro: On-chip debugging and analysis
• iMPACT: Device programming and configuration

HDL Design Entry

Designers can implement logic using industry-standard Hardware Description Languages:

• Verilog HDL
• VHDL
• Schematic capture
• Mixed design methodologies

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Why Choose the XC2S200-6FGG571C FPGA?

Cost-Effective ASIC Alternative

The XC2S200-6FGG571C eliminates the high NRE (Non-Recurring Engineering) costs associated with custom ASIC development. Benefits include:

• Zero mask costs: No expensive photomask investment
• Rapid prototyping: Immediate design iteration capability
• Field upgradability: In-system reconfiguration support
• Reduced time-to-market: Parallel hardware and software development

Proven Reliability

The Spartan-II FPGA family has demonstrated exceptional reliability across millions of deployed units in industrial, commercial, and consumer applications worldwide.

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Technical Documentation and Resources

For complete specifications, timing parameters, and design guidelines, refer to the following AMD documentation:

• DS001: Spartan-II FPGA Family Data Sheet
• Module 1: Introduction and Ordering Information
• Module 2: Functional Description
• Module 3: DC and Switching Characteristics
• Module 4: Pinout Tables

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Summary

The XC2S200-6FGG571C delivers exceptional value for designers requiring a robust, programmable logic solution with substantial gate count and I/O capacity. With 200,000 system gates, 284 user I/O pins, integrated Block RAM, and advanced clock management through four DLLs, this Spartan-II FPGA provides the performance and flexibility needed for today’s demanding embedded applications. The -6 speed grade ensures maximum operating frequency, while the Pb-free FGG package meets modern environmental compliance requirements.