The XC2S200-6FGG567C is a powerful field-programmable gate array (FPGA) from AMD’s renowned Spartan-II family, engineered to deliver exceptional performance for demanding digital design applications. This programmable logic device combines high-speed processing capabilities with a cost-effective architecture, making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded systems development.

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XC2S200-6FGG567C Key Features and Benefits

The XC2S200-6FGG567C stands out in the FPGA market due to its versatile architecture and robust feature set. Engineers and designers choose this Xilinx FPGA for its ability to handle complex digital logic implementations while maintaining energy efficiency and reliability.

Superior Logic Capacity

The XC2S200-6FGG567C provides substantial programmable resources for implementing sophisticated digital designs. With 200,000 system gates and 5,292 logic cells, this FPGA delivers the computational power required for complex signal processing, data manipulation, and control system applications.

Optimized CLB Architecture

Built around a 28 x 42 CLB (Configurable Logic Block) array containing 1,176 total CLBs, the XC2S200-6FGG567C offers designers maximum flexibility in logic implementation. Each CLB contains look-up tables (LUTs), flip-flops, and multiplexers that can be configured to implement virtually any combinatorial or sequential logic function.

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XC2S200-6FGG567C Technical Specifications

Understanding the complete technical specifications of the XC2S200-6FGG567C helps engineers make informed decisions during the design phase.

Memory Resources

The XC2S200-6FGG567C features dual-ported block RAM organized in columns along the vertical edges of the die. Each 4,096-bit block RAM cell operates as a fully synchronous memory with independent control signals for each port, enabling simultaneous read/write operations essential for high-throughput applications.

I/O Capabilities

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XC2S200-6FGG567C Speed Grade and Performance

High-Speed -6 Grade Designation

The -6 speed grade designation indicates this is the highest-performance variant in the XC2S200 series. Key performance characteristics include:

• Maximum Operating Frequency: Up to 263 MHz internal clock speeds
• Optimized Timing: Faster propagation delays compared to -5 grade
• Commercial Temperature Range: 0°C to +85°C (TJ)

Clock Management with DLL Technology

The XC2S200-6FGG567C incorporates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide:

• Clock deskewing and phase shifting
• Frequency synthesis and multiplication
• Board-level clock synchronization across multiple devices
• Elimination of clock distribution delays

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XC2S200-6FGG567C Package Information

FGG567 Fine-Pitch Ball Grid Array

The XC2S200-6FGG567C utilizes the FGG package format, where:

• FG: Fine-pitch Ball Grid Array substrate
• G: RoHS-compliant Pb-free packaging
• 567: Total ball count
• C: Commercial temperature grade

This package configuration offers:

• High pin density in compact form factor
• Excellent thermal dissipation characteristics
• Superior signal integrity for high-speed designs
• Surface mount compatibility for automated assembly

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XC2S200-6FGG567C Applications

Telecommunications and Networking

The XC2S200-6FGG567C excels in telecommunications applications including protocol conversion, data encryption/decryption, packet processing, and network interface implementations.

Industrial Automation

Industrial control systems benefit from the XC2S200-6FGG567C’s reliability and real-time processing capabilities for motor control, sensor interfaces, and PLC implementations.

Consumer Electronics

From video processing to audio systems, the XC2S200-6FGG567C provides the programmable logic foundation for diverse consumer electronic products.

Prototyping and Development

The field-programmable nature of the XC2S200-6FGG567C makes it invaluable for rapid prototyping, allowing design iterations without hardware modifications.

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XC2S200-6FGG567C Design Support

Development Tools

The XC2S200-6FGG567C is supported by the Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can utilize:

• VHDL and Verilog HDL support
• Schematic capture design entry
• Integrated simulation environment
• Timing analysis and optimization tools

Configuration Options

The XC2S200-6FGG567C supports multiple configuration modes including:

• Serial configuration via Platform Flash PROMs
• JTAG boundary scan configuration
• Slave parallel and SelectMAP modes

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Why Choose the XC2S200-6FGG567C?

The XC2S200-6FGG567C represents an optimal balance of performance, flexibility, and cost-effectiveness. Key advantages include:

• Cost-Effective Alternative to ASICs: Eliminates NRE costs and lengthy development cycles
• Field Upgradability: Design modifications possible without hardware replacement
• Proven Architecture: Based on mature 0.18µm CMOS process technology
• Comprehensive Ecosystem: Extensive documentation, IP cores, and development tools
• RoHS Compliance: Pb-free packaging meets environmental regulations

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XC2S200-6FGG567C Ordering Information

When ordering the XC2S200-6FGG567C, verify specifications with your authorized distributor. The part number decodes as:

• XC2S200: 200K system gate Spartan-II device
• -6: Speed grade (highest performance)
• FGG567: Fine-pitch BGA, Pb-free, 567 balls
• C: Commercial temperature range

Contact authorized AMD/Xilinx distributors for current pricing, availability, and lead time information for the XC2S200-6FGG567C.

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XC2S200-6FGG567C Summary Specifications Table