The XC2S200-6FGG564C is a powerful field-programmable gate array (FPGA) from AMD’s renowned Spartan-II family, delivering exceptional performance and reliability for demanding digital design applications. This versatile programmable logic device combines 200,000 system gates with advanced I/O capabilities in a compact BGA package, making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded system designs.

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XC2S200-6FGG564C Key Features and Benefits

The XC2S200-6FGG564C offers engineers a comprehensive feature set that balances performance with cost-effectiveness. As a member of the proven Spartan-II Xilinx FPGA family, this device provides the flexibility needed for both prototyping and high-volume production environments.

High-Density Logic Resources

The XC2S200-6FGG564C integrates substantial programmable logic resources suitable for complex digital designs:

• 200,000 System Gates for implementing sophisticated logic functions
• 5,292 Logic Cells providing ample design capacity
• 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 × 42 array
• Four Delay-Locked Loops (DLLs) for precise clock management

Flexible Memory Architecture

This FPGA features a dual-memory architecture combining distributed and block RAM:

• 75,264 bits of Distributed RAM for localized data storage
• 56 Kbits of Dedicated Block RAM for larger memory requirements
• Dual-port 4,096-bit RAM blocks with independent control signals
• Configurable data widths for optimized memory utilization

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XC2S200-6FGG564C Technical Specifications

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XC2S200-6FGG564C Package Information

Fine Pitch BGA Package Details

The XC2S200-6FGG564C utilizes a 564-ball Fine Pitch Ball Grid Array (FGG564) package, offering several advantages for PCB design and manufacturing:

Package Characteristics

• Pb-Free Construction: RoHS-compliant lead-free packaging (indicated by “G” in part number)
• Compact Footprint: Optimized board space utilization
• Excellent Thermal Performance: Enhanced heat dissipation through BGA substrate
• Superior Signal Integrity: Short interconnect paths minimize parasitic effects
• 1.0 mm Ball Pitch: Industry-standard spacing for reliable assembly

I/O Configuration

The Fine Pitch BGA package provides access to all 284 user I/O pins, plus four dedicated global clock/user input pins. This comprehensive I/O availability makes the XC2S200-6FGG564C suitable for designs requiring extensive peripheral connectivity.

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XC2S200-6FGG564C Speed Grade and Performance

Understanding the -6 Speed Grade

The “-6” designation indicates this is the higher-performance speed grade within the Spartan-II XC2S200 family:

• Maximum Operating Frequency: 263 MHz
• Optimized for Speed-Critical Applications: Faster propagation delays and setup times
• Commercial Temperature Operation: Available exclusively in commercial range (0°C to +85°C)

Clock Distribution Network

The XC2S200-6FGG564C features a robust clock management system:

• Four Delay-Locked Loops (DLLs), one at each die corner
• Primary and secondary global clock networks
• DLL-based clock mirroring for board-level clock deskewing
• Multiple clock domains supported for complex system designs

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XC2S200-6FGG564C Architecture Overview

Configurable Logic Block (CLB) Structure

Each CLB in the XC2S200-6FGG564C contains programmable logic elements optimized for implementing combinatorial and sequential functions:

• Look-Up Tables (LUTs) for function generation
• Dedicated fast carry logic for arithmetic operations
• Multiple flip-flops per slice
• Distributed RAM capability within CLB structure

Input/Output Block (IOB) Features

The IOBs surrounding the FPGA core provide flexible interfacing:

• Multiple I/O standards support
• Individually programmable output drive strength
• Optional input delay elements
• Selectable pull-up/pull-down resistors
• Hot-swap compliance capabilities

Block RAM Organization

Block RAM in the XC2S200-6FGG564C is organized in two columns:

• Positioned along opposite vertical edges of the die
• Each block provides 4,096 bits of dual-port RAM
• Fully synchronous operation with independent port control
• Flexible port width configurations from 1-bit to 16-bit

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XC2S200-6FGG564C Application Areas

Telecommunications Equipment

The XC2S200-6FGG564C excels in telecommunications applications requiring high-speed data processing and protocol implementation, including network interface cards, channel banks, and base station equipment.

Industrial Automation

With its robust commercial temperature range and reliable programmable logic, this FPGA serves motor control systems, PLC modules, and industrial networking equipment effectively.

Consumer Electronics

Cost-effective programmability makes the XC2S200-6FGG564C suitable for consumer products including set-top boxes, gaming peripherals, and audio/video processing systems.

Embedded Systems

The combination of logic density and memory resources supports embedded controllers, co-processors, and custom peripheral interfaces in various embedded applications.

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XC2S200-6FGG564C vs. ASIC Solutions

Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG564C provides compelling benefits compared to traditional ASIC implementations:

In-Field Reprogrammability

Unlike mask-programmed ASICs, the XC2S200-6FGG564C supports in-system reprogramming, enabling:

• Hardware bug fixes without board redesign
• Feature additions post-deployment
• Design optimization based on field data
• Product line variations from single hardware platform

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XC2S200-6FGG564C Development Tools and Resources

Design Software Support

AMD provides comprehensive development tool support for the XC2S200-6FGG564C:

• ISE Design Suite: Complete FPGA development environment
• Schematic Entry: Graphical design capture
• HDL Synthesis: VHDL and Verilog support
• Simulation Tools: Functional and timing verification
• Implementation Tools: Place, route, and timing optimization

Configuration Options

Multiple configuration modes support various system requirements:

• Master/Slave Serial modes
• Slave Parallel mode
• JTAG/Boundary Scan configuration
• Compatible with standard configuration PROMs

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XC2S200-6FGG564C Ordering Information

Part Number Breakdown

Understanding the XC2S200-6FGG564C part number structure:

Quality and Reliability

All XC2S200-6FGG564C devices undergo comprehensive testing ensuring:

• Full production qualification
• Pb-free/RoHS compliance
• Moisture Sensitivity Level (MSL) compliance
• Electrostatic Discharge (ESD) protection

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Summary: Why Choose XC2S200-6FGG564C

The XC2S200-6FGG564C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. With 200,000 system gates, 284 user I/Os, comprehensive memory resources, and high-speed -6 grade performance, this Spartan-II FPGA delivers the flexibility needed for diverse applications ranging from telecommunications to industrial automation.

Key reasons to specify the XC2S200-6FGG564C:

• Proven Spartan-II architecture reliability
• High-density 200K gate capacity
• Fast -6 speed grade for performance-critical designs
• Pb-free BGA package for RoHS compliance
• Comprehensive development tool ecosystem
• Cost-effective alternative to custom ASIC solutions
• Field-upgradeable programmable logic

For engineering teams seeking a versatile, high-performance FPGA solution with extensive I/O capability and proven reliability, the XC2S200-6FGG564C delivers the programmable logic resources needed for successful product development.