The XC2S200-6FGG563C is a high-performance Field-Programmable Gate Array (FPGA) from the AMD Xilinx Spartan-II family. This cost-effective programmable logic device delivers 200,000 system gates, 5,292 logic cells, and exceptional flexibility for digital design applications. With its 456-pin Fine-pitch Ball Grid Array (FBGA) package and -6 speed grade, the XC2S200-6FGG563C provides an ideal solution for engineers seeking reliable, reprogrammable hardware for industrial, consumer, and communication systems.

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XC2S200-6FGG563C Key Features and Benefits

The XC2S200-6FGG563C combines advanced programmable logic architecture with robust I/O capabilities. This Xilinx FPGA delivers superior performance compared to mask-programmed ASICs while eliminating lengthy development cycles and high initial costs.

High-Density Logic Resources

The XC2S200-6FGG563C features an impressive array of configurable logic blocks arranged in a 28 × 42 CLB matrix, providing 1,176 total CLBs for implementing complex digital designs. Each CLB contains four logic cells with 4-input look-up tables (LUTs) and dedicated flip-flops, enabling efficient implementation of sequential and combinational logic circuits.

Flexible Memory Architecture

This Spartan-II FPGA offers dual memory options to meet diverse application requirements:

• Distributed RAM: 75,264 bits of distributed memory using LUT-based RAM
• Block RAM: 56 Kbits (14 dedicated 4,096-bit blocks) of dual-port synchronous RAM

The block RAM cells support configurable aspect ratios from 4096×1 to 256×16, allowing designers to optimize memory width and depth for specific applications.

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XC2S200-6FGG563C Technical Specifications

Core Architecture Specifications

Electrical Characteristics

Package Information

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XC2S200-6FGG563C I/O Capabilities

Versatile Input/Output Standards

The XC2S200-6FGG563C supports 16 selectable I/O standards, providing seamless interfacing with various logic families and voltage levels:

• LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
• GTL and GTL+
• HSTL (Class I, II, III, IV)
• SSTL (2.5V and 3.3V Class I and II)
• PCI 3.3V and PCI-X compliant
• AGP 2X

Input/Output Block (IOB) Features

Each IOB in the XC2S200-6FGG563C provides programmable input delays, output slew rate control, and configurable pull-up/pull-down resistors. The IOBs support both single-ended and differential signaling standards for high-speed data transfer applications.

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XC2S200-6FGG563C Clock Management

Four Delay-Locked Loops (DLLs)

The XC2S200-6FGG563C integrates four DLLs positioned at each corner of the die. These DLLs provide:

• Clock deskewing and phase adjustment
• Clock multiplication (2×) and division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×)
• Clock mirroring for board-level synchronization
• Zero-delay buffering to eliminate clock distribution delays

Global Clock Distribution Network

The device features four dedicated global clock networks and 24 secondary clock lines, ensuring low-skew clock distribution across the entire FPGA fabric.

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XC2S200-6FGG563C Applications

The XC2S200-6FGG563C excels in numerous application domains:

Industrial and Automation

• Programmable Logic Controllers (PLCs)
• Motor control systems
• Industrial networking gateways
• Process control equipment

Communications and Networking

• Protocol conversion bridges
• Network interface cards
• Telecommunications equipment
• Wireless base station controllers

Consumer Electronics

• Display controllers
• Audio/video processing
• Gaming peripherals
• Smart home devices

Embedded Systems

• Microcontroller peripherals
• Custom interface controllers
• Data acquisition systems
• ASIC prototyping platforms

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XC2S200-6FGG563C Configuration Options

In-System Programming

The XC2S200-6FGG563C supports multiple configuration modes for maximum flexibility:

• Serial configuration (Master/Slave)
• Parallel configuration (SelectMAP, 8-bit)
• JTAG boundary scan programming
• Compatible with Xilinx Platform Flash PROMs

Field Upgradability

Unlike traditional ASICs, the XC2S200-6FGG563C allows unlimited in-system reprogramming, enabling field upgrades without hardware replacement.

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XC2S200-6FGG563C Development Tools

Xilinx ISE Design Suite

The XC2S200-6FGG563C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Designers can utilize VHDL, Verilog, or schematic capture for design entry.

IP Core Ecosystem

Xilinx and third-party vendors offer pre-verified IP cores for common functions including:

• Soft processors (MicroBlaze, PicoBlaze)
• Memory controllers
• Communication protocols (UART, SPI, I2C)
• Digital signal processing blocks

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XC2S200-6FGG563C Ordering Information

Part Number Breakdown

XC2S200-6FGG563C

• XC2S200: Spartan-II 200K gate device
• -6: Speed grade (fastest commercial)
• FG: Fine-pitch BGA package
• G: Pb-free (RoHS compliant)
• 456: 456-ball package
• C: Commercial temperature range

Related Part Numbers

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Why Choose the XC2S200-6FGG563C

The XC2S200-6FGG563C offers compelling advantages for your next design project:

1. Cost-Effective Performance: High gate density at competitive pricing
2. Design Flexibility: Unlimited reprogramming eliminates ASIC risk
3. Fast Time-to-Market: Rapid prototyping and iteration capabilities
4. Proven Architecture: Based on the reliable Spartan-II platform
5. Comprehensive Support: Full development tool and IP ecosystem
6. Lead-Free Option: RoHS-compliant packaging available

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XC2S200-6FGG563C Documentation and Resources

For complete technical specifications, pinout tables, and application notes, consult the official Spartan-II FPGA Family Data Sheet (DS001). Additional resources include:

• DC and Switching Characteristics (Module 3)
• Pinout Tables (Module 4)
• Configuration Guide
• PCB Design Guidelines

The XC2S200-6FGG563C represents an excellent balance of performance, flexibility, and value for programmable logic applications requiring robust 200K-gate FPGA solutions.