The XC2S200-6FGG562C is a powerful Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family. This programmable logic device delivers exceptional performance, flexibility, and reliability for demanding industrial, telecommunications, and embedded system applications. Engineers worldwide choose this Xilinx FPGA for its outstanding balance of logic capacity, memory resources, and cost-effectiveness.

XC2S200-6FGG562C Technical Specifications Overview

The XC2S200-6FGG562C combines advanced architecture with robust performance capabilities. This section provides a comprehensive breakdown of its core technical parameters.

Core Logic and Gate Count

The XC2S200-6FGG562C offers 200,000 system gates, providing substantial logic capacity for complex digital designs. With 5,292 logic cells arranged in a 28 × 42 Configurable Logic Block (CLB) array, this FPGA supports sophisticated signal processing, control systems, and data communication protocols.

Memory Architecture and Block RAM

The XC2S200-6FGG562C features 14 dedicated Block RAM modules, each providing 4,096 bits of fully synchronous dual-ported memory. This architecture enables independent read/write operations with configurable data widths ranging from 1-bit × 4096 to 16-bit × 256 configurations.

Package and Electrical Specifications

XC2S200-6FGG562C Key Features and Benefits

Advanced Clock Management with DLL

The XC2S200-6FGG562C incorporates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide:

• Clock deskew and distribution optimization
• Zero-delay clock buffering
• Clock multiplication and division capabilities
• Board-level clock synchronization through clock mirroring

Flexible I/O Standards Support

This Spartan-II FPGA supports multiple industry-standard I/O interfaces:

• LVTTL (Low Voltage TTL)
• LVCMOS (Low Voltage CMOS)
• PCI (Peripheral Component Interconnect)
• GTL/GTL+ signaling
• SSTL (Stub Series Terminated Logic)

In-System Programming and Configuration

The XC2S200-6FGG562C offers versatile configuration options:

XC2S200-6FGG562C Application Areas

Industrial Automation and Control

The XC2S200-6FGG562C excels in industrial control systems requiring real-time processing, motor control algorithms, and sensor interface management. Its extensive I/O count and deterministic timing make it ideal for PLC implementations and process automation.

Telecommunications Infrastructure

Network equipment manufacturers utilize this FPGA for protocol bridging, data packet processing, and communication interface design. The high-speed performance and flexible routing architecture support demanding telecom applications.

Digital Signal Processing (DSP)

With 1,176 CLBs and 56 Kbits of Block RAM, the XC2S200-6FGG562C handles complex DSP algorithms including FIR/IIR filters, FFT implementations, and modulation/demodulation schemes.

Embedded Systems and Prototyping

Engineers choose the XC2S200-6FGG562C for rapid prototyping and embedded system development. Its field-programmable nature eliminates mask charges and reduces development cycles compared to traditional ASICs.

XC2S200-6FGG562C Design Resources and Development Tools

Supported Software Platforms

AMD provides comprehensive development tool support for the XC2S200-6FGG562C:

• ISE Design Suite: Complete synthesis, implementation, and programming environment
• Vivado Design Suite: Modern design flow with advanced optimization
• ModelSim/ISIM: Simulation and verification tools
• ChipScope Pro: On-chip debugging and logic analysis

Documentation and Technical Support

Engineers can access extensive documentation including:

• Complete datasheet (DS001) with timing specifications
• User guides and application notes
• Reference designs and IP cores
• Pinout tables and footprint specifications

XC2S200-6FGG562C Ordering Information

Part Number Breakdown

Why Choose the XC2S200-6FGG562C Spartan-II FPGA?

The XC2S200-6FGG562C delivers compelling advantages over mask-programmed ASICs and alternative programmable logic solutions:

Cost-Effective Development

Eliminate NRE (Non-Recurring Engineering) costs associated with ASIC development. The XC2S200-6FGG562C enables design modifications throughout the product lifecycle without hardware changes.

Reduced Time-to-Market

Field programmability accelerates development cycles. Design iterations occur in software rather than requiring new silicon, dramatically reducing time-to-market.

Future-Proof Design

In-system reprogrammability allows firmware updates and feature enhancements after product deployment, extending product lifespan and enabling field upgrades.

Proven Reliability

Built on mature 0.18µm CMOS technology, the XC2S200-6FGG562C offers established reliability for mission-critical applications requiring long-term component availability.

XC2S200-6FGG562C Summary Specifications

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The XC2S200-6FGG562C represents a proven, reliable solution for engineers requiring high-performance FPGA capabilities in cost-sensitive applications. Contact authorized distributors for current pricing, availability, and volume discounts.