Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG559C: High-Performance AMD Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG559C is a powerful field-programmable gate array (FPGA) from the renowned AMD (formerly Xilinx) Spartan-II family. This advanced programmable logic device delivers exceptional performance, reliability, and cost-effectiveness for demanding digital design applications. Engineers seeking a robust solution for embedded systems, telecommunications, and industrial automation will find the XC2S200-6FGG559C an ideal choice for their next project.

XC2S200-6FGG559C Key Features and Benefits

The XC2S200-6FGG559C combines cutting-edge FPGA architecture with versatile I/O capabilities, making it suitable for a wide range of applications from digital signal processing to complex control systems.

Superior Logic Capacity and System Gates

The XC2S200-6FGG559C offers impressive logic resources that enable implementation of complex digital designs:

  • 200,000 System Gates for comprehensive logic implementation
  • 5,292 Logic Cells providing flexible design options
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array
  • 284 Maximum User I/O Pins for extensive connectivity options

Advanced Memory Architecture

This Spartan-II FPGA features a hierarchical memory system designed for optimal performance:

  • 75,264 Bits of Distributed RAM using SelectRAM technology
  • 56K Bits of Dedicated Block RAM with dual-port capability
  • Configurable 4K-bit Block RAM modules for data-intensive applications
  • 16 Bits per LUT distributed RAM for high-speed local storage

XC2S200-6FGG559C Technical Specifications

Understanding the complete technical specifications helps engineers make informed decisions when selecting components for their Xilinx FPGA designs.

Electrical Characteristics

Parameter Specification
Core Voltage (VCCINT) 2.5V (2.375V – 2.625V)
I/O Voltage (VCCO) 1.5V to 3.3V
Process Technology 0.18µm CMOS
Maximum Frequency 263 MHz
Speed Grade -6 (Fastest Commercial)

Package Information

Characteristic Detail
Package Type FGG (Fine-pitch Ball Grid Array)
Pin Count 559 Pins
Lead-Free Yes (Pb-Free)
Temperature Range Commercial (0°C to +85°C)
Mounting Type Surface Mount

XC2S200-6FGG559C Applications

The versatility of the XC2S200-6FGG559C makes it suitable for numerous industries and applications.

Industrial Automation and Control

This FPGA excels in industrial environments where reliability and real-time processing are critical. Common applications include motor control systems, PLC implementations, and factory automation equipment.

Telecommunications and Networking

The high-speed I/O capabilities and substantial logic resources make the XC2S200-6FGG559C ideal for communication protocol implementation, data routing, and network interface solutions.

Digital Signal Processing (DSP)

With its abundant logic cells and memory resources, this device supports complex DSP algorithms for audio processing, image manipulation, and sensor data analysis.

Embedded Systems Development

Engineers developing embedded solutions benefit from the XC2S200-6FGG559C’s combination of processing capability and peripheral interface flexibility.

XC2S200-6FGG559C Architecture Overview

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG559C contains four logic cells arranged in two slices. This architecture provides efficient logic implementation with fast carry propagation for arithmetic operations.

Input/Output Blocks (IOBs)

The IOBs support multiple I/O standards including:

  • LVTTL and LVCMOS at various voltage levels
  • GTL and GTL+ for high-speed interfaces
  • PCI compliant signaling
  • Differential signaling support

Delay-Locked Loops (DLLs)

Four DLLs positioned at each corner of the die provide:

  • Clock deskewing capabilities
  • Frequency synthesis
  • Phase shifting for timing optimization
  • Board-level clock distribution support

Design Tools and Development Support

ISE Design Suite Compatibility

The XC2S200-6FGG559C is fully supported by AMD’s ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities.

HDL Support

Engineers can develop designs using industry-standard hardware description languages:

  • VHDL for structured design methodology
  • Verilog for behavioral and structural modeling
  • Mixed-language designs for maximum flexibility

Configuration Options

Multiple configuration modes accommodate various system requirements:

  • Master Serial Mode for standalone operation
  • Slave Serial Mode for processor-controlled configuration
  • Slave Parallel Mode for high-speed configuration
  • Boundary-Scan (JTAG) Mode for test and debug

XC2S200-6FGG559C Ordering Information

Part Number Breakdown

Understanding the part number structure helps ensure correct ordering:

  • XC2S200: Spartan-II device with 200K system gates
  • -6: Speed grade 6 (fastest commercial option)
  • FGG: Fine-pitch BGA package (Pb-free)
  • 559: Pin count
  • C: Commercial temperature range

Quality and Compliance

The XC2S200-6FGG559C meets stringent quality standards:

  • RoHS compliant manufacturing
  • Lead-free (Pb-free) packaging
  • ISO 9001 certified production facilities
  • Comprehensive quality assurance testing

Why Choose the XC2S200-6FGG559C Spartan-II FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG559C provides a superior alternative to mask-programmed ASICs, eliminating initial NRE costs, lengthy development cycles, and inherent risks of conventional ASIC development.

Field Upgradability

Unlike fixed-function devices, this FPGA permits design upgrades in deployed systems without hardware replacement, extending product lifecycle and reducing maintenance costs.

Proven Reliability

Built on AMD’s mature Spartan-II architecture with 0.18µm process technology, the XC2S200-6FGG559C delivers consistent performance and long-term reliability for mission-critical applications.

Comprehensive Ecosystem

Access to development boards, reference designs, IP cores, and extensive documentation accelerates time-to-market for new product development.

Conclusion

The XC2S200-6FGG559C represents an excellent choice for engineers requiring a high-performance, cost-effective FPGA solution. With 200,000 system gates, 5,292 logic cells, and extensive memory resources in a lead-free BGA package, this Spartan-II device delivers the performance, flexibility, and reliability needed for today’s demanding applications. Whether developing industrial control systems, telecommunications equipment, or embedded solutions, the XC2S200-6FGG559C provides the foundation for successful digital designs.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.