The XC2S200-6FGG557C is a high-performance Field Programmable Gate Array (FPGA) from the AMD/Xilinx Spartan-II family. This programmable logic device delivers 200,000 system gates with exceptional flexibility for digital circuit design. Engineers worldwide choose the XC2S200-6FGG557C for its cost-effective performance in telecommunications, industrial automation, and consumer electronics applications.
XC2S200-6FGG557C Key Features and Specifications
The XC2S200-6FGG557C combines advanced programmable logic architecture with robust I/O capabilities. This Spartan-II FPGA offers significant advantages over traditional mask-programmed ASICs, including lower initial costs and faster development cycles.
Core Specifications Overview
| Parameter |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Fastest) |
| Package Type |
Fine-Pitch Ball Grid Array (FGG) |
| Pin Count |
557 |
| Operating Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
| Maximum Frequency |
263 MHz |
| Temperature Range |
Commercial (0°C to 85°C) |
Memory Resources for XC2S200-6FGG557C
The XC2S200-6FGG557C provides generous on-chip memory options for data buffering and storage applications:
- Distributed RAM Bits: 75,264 bits
- Block RAM Bits: 56 Kbits (56,000 bits)
- SelectRAM™ Technology: Hierarchical memory architecture
XC2S200-6FGG557C Architecture and Design
Configurable Logic Block (CLB) Structure
Each CLB in the XC2S200-6FGG557C contains four logic cells organized in two slices. The architecture supports both combinational and sequential logic implementations. Every slice includes two 4-input function generators (LUTs), carry logic, and dedicated multiplexers for efficient arithmetic operations.
Input/Output Block (IOB) Capabilities
The XC2S200-6FGG557C features advanced I/O blocks that support multiple signaling standards:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS) at 2.5V and 3.3V
- PCI (Peripheral Component Interconnect) compliant
- GTL+ (Gunning Transceiver Logic Plus)
- HSTL (High-Speed Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
Delay-Locked Loop (DLL) Technology
The XC2S200-6FGG557C incorporates four dedicated Delay-Locked Loops positioned at each corner of the die. These DLLs provide:
- Zero propagation delay for clock distribution
- Low clock skew across the entire device
- Clock multiplication (2× frequency doubling)
- Clock division (up to 1/16)
- Multiple phase outputs (0°, 90°, 180°, 270°)
- Duty cycle correction for improved signal integrity
XC2S200-6FGG557C Package Information
Fine-Pitch Ball Grid Array (FGG557) Details
The FGG557 package provides optimal thermal and electrical performance for the XC2S200-6FGG557C:
| Package Specification |
Value |
| Package Type |
FBGA (Fine-Pitch BGA) |
| Total Balls |
557 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
23 mm × 23 mm |
| Lead-Free Option |
Available (G designation) |
| RoHS Compliance |
Yes |
Ordering Information Decoder
XC2S200-6FGG557C part number breakdown:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (fastest commercial grade)
- FG: Fine-pitch Ball Grid Array package
- G: Pb-free (lead-free) packaging
- 557: Pin count
- C: Commercial temperature range (0°C to 85°C)
XC2S200-6FGG557C Applications
The XC2S200-6FGG557C excels in various market segments due to its programmable flexibility and performance characteristics.
Telecommunications Applications
- Digital Signal Processing (DSP) implementations
- Protocol conversion and bridging
- Network interface controllers
- SDH/SONET framing
Industrial Control Systems
- Programmable Logic Controllers (PLC) replacements
- Motion control systems
- Sensor data acquisition
- Real-time monitoring systems
Consumer Electronics
- Video processing and scaling
- Audio codec implementations
- Display controllers
- Set-top box designs
Automotive Electronics
- Advanced Driver Assistance Systems (ADAS)
- Infotainment system controllers
- Instrument cluster displays
- Communication gateway modules
XC2S200-6FGG557C Development Tools
Software Support
Designers working with the XC2S200-6FGG557C can utilize comprehensive development tools:
- Xilinx ISE Design Suite: Complete synthesis and implementation environment
- ModelSim: Industry-standard simulation and verification
- ChipScope Pro: Real-time debugging and analysis
- JTAG Configuration: IEEE 1149.1/1532 compliant boundary scan
Configuration Options
The XC2S200-6FGG557C supports multiple configuration modes:
- Master Serial Mode: FPGA drives configuration clock
- Slave Serial Mode: External controller drives configuration
- SelectMAP Mode: Parallel byte-wide programming
- JTAG Mode: Boundary-scan configuration
XC2S200-6FGG557C Electrical Specifications
Power Supply Requirements
| Supply |
Voltage |
Description |
| VCCINT |
2.5V ± 5% |
Internal core supply |
| VCCO |
1.5V – 3.3V |
Output driver supply (bank-dependent) |
| VREF |
Variable |
Reference voltage for input standards |
Timing Performance
The -6 speed grade delivers the fastest performance in the commercial temperature range:
- Global Clock Frequency: Up to 263 MHz
- DLL Input Frequency Range: 24 MHz – 240 MHz
- Setup Time (Global Clock): 1.0 ns typical
- Clock-to-Output Delay: 3.0 ns typical
Why Choose XC2S200-6FGG557C Over ASICs
Cost Advantages
The XC2S200-6FGG557C eliminates expensive mask charges and long development cycles associated with Application-Specific Integrated Circuits. Design teams benefit from:
- Zero NRE costs: No non-recurring engineering expenses
- Rapid prototyping: Working hardware in hours, not months
- Risk reduction: Full hardware verification before commitment
Field Programmability
Unlike ASICs, the XC2S200-6FGG557C supports in-field updates without hardware replacement. This programmability enables:
- Bug fixes and feature additions post-deployment
- Product customization for different market segments
- Extended product lifecycle through software-defined functionality
For more information about FPGA technology and related products, visit Xilinx FPGA resources.
XC2S200-6FGG557C Design Considerations
PCB Layout Guidelines
Successful implementation of the XC2S200-6FGG557C requires attention to:
- Power plane design: Separate VCCINT and VCCO planes with proper decoupling
- Signal integrity: Controlled impedance traces for high-speed signals
- Thermal management: Adequate copper pour for heat dissipation
- Clock routing: Dedicated clock traces with minimal crosstalk
Decoupling Recommendations
Proper power supply decoupling ensures stable XC2S200-6FGG557C operation:
- Place 100nF capacitors adjacent to each power pin cluster
- Use 10µF bulk capacitors for each power supply
- Implement low-inductance connections to ground plane
XC2S200-6FGG557C Quality and Reliability
Manufacturing Standards
The XC2S200-6FGG557C meets stringent quality requirements:
- ISO 9001: Quality management certification
- ISO 14001: Environmental management compliance
- Automotive Grade Options: Extended temperature variants available
Handling Precautions
As with all semiconductor devices, the XC2S200-6FGG557C requires:
- ESD-safe handling procedures
- Moisture sensitivity level (MSL) compliance
- Proper storage conditions per manufacturer guidelines
Conclusion
The XC2S200-6FGG557C represents an excellent choice for engineers seeking high-performance programmable logic in a cost-effective package. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities, this Spartan-II FPGA addresses diverse application requirements. The -6 speed grade ensures maximum performance for demanding designs, while the FGG557 package provides excellent board-level integration.
Whether designing telecommunications equipment, industrial controllers, or consumer electronics, the XC2S200-6FGG557C delivers the programmable flexibility and proven reliability that modern electronic systems demand.
