The XC2S200-6FGG556C is a versatile Field-Programmable Gate Array from the proven Spartan-II family. This powerful programmable logic device delivers exceptional performance for digital design applications, offering 200,000 system gates in a compact 556-ball Fine-Pitch BGA package. Engineers choose this FPGA for its reliability, flexibility, and cost-effectiveness in prototyping and production environments.
XC2S200-6FGG556C Key Features and Benefits
The XC2S200-6FGG556C stands out as a superior alternative to mask-programmed ASICs. This programmable device eliminates lengthy development cycles and reduces the inherent risks associated with conventional ASIC designs. Its in-field programmability enables design upgrades without hardware replacement, providing significant advantages for modern electronic systems.
Why Choose the XC2S200-6FGG556C Programmable Logic Device
Designers select this Xilinx FPGA for applications requiring high gate density, fast performance, and reliable operation. The -6 speed grade designation indicates optimized timing characteristics for demanding digital circuits. Commercial temperature range operation ensures stable functionality across standard operating conditions.
XC2S200-6FGG556C Technical Specifications
Understanding the complete technical specifications helps engineers integrate this FPGA into their designs effectively.
Core Architecture Specifications
| Parameter |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
Electrical and Performance Parameters
| Specification |
Value |
| Core Voltage (VCCINT) |
2.5V |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18µm |
| I/O Banks |
4 |
| Delay-Locked Loops (DLLs) |
4 |
XC2S200-6FGG556C Package Information
| Package Detail |
Specification |
| Package Type |
FGG556 (Fine-Pitch BGA) |
| Ball Count |
556 |
| Speed Grade |
-6 |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Status |
Pb-free compliant (“G” designation) |
Spartan-II FPGA Architecture Overview
The XC2S200-6FGG556C utilizes the proven Spartan-II programmable architecture. This architecture features Configurable Logic Blocks surrounded by programmable Input/Output Blocks for maximum design flexibility.
Configurable Logic Block Structure
Each CLB contains four logic cells, which serve as the fundamental building blocks. A logic cell consists of a 4-input function generator, storage element, and dedicated carry logic. This structure enables efficient implementation of combinatorial and sequential logic functions.
Block RAM and Memory Resources
The device incorporates dedicated block RAM organized in two columns along opposite vertical edges. Each block RAM cell provides a fully synchronous dual-ported 4096-bit RAM with independent control signals per port. Designers benefit from configurable data widths for each port, enabling flexible memory implementations.
Delay-Locked Loop Technology
Four DLLs positioned at each die corner provide advanced clock management capabilities. These DLLs support clock deskewing across board-level designs and ensure proper system clock operation before FPGA startup after configuration.
XC2S200-6FGG556C Applications
This programmable gate array suits various electronic design requirements across multiple industries.
Industrial Automation Applications
- Motor control systems
- PLC replacements
- Sensor interface modules
- Industrial communication bridges
Telecommunications Applications
- Protocol conversion
- Data encryption/decryption
- Signal processing
- Network interface controllers
Embedded Systems Applications
- Custom peripheral interfaces
- System-on-chip prototyping
- Hardware acceleration
- Real-time control systems
Consumer Electronics Applications
- Display controllers
- Audio/video processing
- Gaming peripherals
- Smart home devices
XC2S200-6FGG556C I/O Standards Support
The flexible I/O architecture supports multiple signaling standards for seamless system integration.
Supported I/O Standards
- LVTTL (Low-Voltage TTL)
- LVCMOS (Low-Voltage CMOS)
- PCI (Peripheral Component Interconnect)
- GTL/GTL+ (Gunning Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
- HSTL (High-Speed Transceiver Logic)
I/O Bank Configuration
The device divides I/Os into four banks, each supporting independent VCCO voltage levels. This configuration enables mixed-voltage interfacing within a single device, reducing external level-shifting components.
Design Tools and Development Support
Comprehensive development tools support XC2S200-6FGG556C implementation from concept through production.
Compatible Design Software
The Xilinx ISE Design Suite provides complete design entry, synthesis, implementation, and verification capabilities. Engineers can utilize VHDL, Verilog, or schematic entry methods based on project requirements.
Configuration Options
Multiple configuration modes support various system architectures:
- Master Serial Mode: FPGA controls configuration from serial PROM
- Slave Serial Mode: External processor controls configuration
- Master Parallel Mode: Fast configuration using parallel interface
- Boundary Scan (JTAG): Configuration and testing via IEEE 1149.1
XC2S200-6FGG556C Part Number Decoder
Understanding the part number structure helps identify device specifications:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade designation
- FG: Fine-pitch Ball Grid Array package type
- G: Pb-free (lead-free) designation
- 556: Ball count
- C: Commercial temperature range
PCB Design Considerations
Proper PCB design ensures optimal XC2S200-6FGG556C performance and reliability.
Power Supply Requirements
- Dedicated 2.5V supply for VCCINT (core voltage)
- Separate VCCO supplies per I/O bank
- Adequate decoupling capacitors near power pins
- Proper power sequencing during startup
Signal Integrity Guidelines
- Controlled impedance traces for high-speed signals
- Appropriate termination for transmission line effects
- Careful clock routing to minimize skew
- Ground plane integrity beneath signal layers
Thermal Management
The 556-ball BGA package provides excellent thermal dissipation. Engineers should ensure adequate airflow and consider thermal vias for high-power applications.
XC2S200-6FGG556C Quality and Compliance
This device meets stringent quality and environmental standards.
Environmental Compliance
- RoHS (Restriction of Hazardous Substances) compliant
- Pb-free (lead-free) packaging
- REACH compliant materials
- MSL (Moisture Sensitivity Level) rated for proper handling
Quality Assurance
All devices undergo comprehensive testing to ensure reliable operation throughout the specified operating range.
Ordering Information
The XC2S200-6FGG556C is available through authorized distributors worldwide. Volume pricing and lead time information can be obtained directly from authorized channel partners. Educational and prototype quantities may be available for evaluation purposes.
Summary: XC2S200-6FGG556C Spartan-II FPGA
The XC2S200-6FGG556C delivers outstanding value for programmable logic applications requiring high gate density and reliable performance. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support, this Spartan-II FPGA enables efficient implementation of complex digital designs. The 556-ball Fine-Pitch BGA package optimizes board space while maintaining excellent signal integrity and thermal performance.
Engineers benefit from the proven Spartan-II architecture, extensive development tool support, and flexible configuration options. Whether designing industrial automation systems, telecommunications equipment, or embedded applications, the XC2S200-6FGG556C provides the programmable logic resources needed for successful project completion.
