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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG555C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG555C is a high-density Field Programmable Gate Array (FPGA) from AMD’s proven Spartan-II family. Engineered for demanding industrial and commercial applications, this versatile programmable logic device delivers exceptional performance with cost-effective implementation. Whether you’re designing embedded systems, telecommunications equipment, or industrial control solutions, the XC2S200-6FGG555C provides the flexibility and reliability engineers require.

Key Features of the XC2S200-6FGG555C FPGA

The XC2S200-6FGG555C stands out as a superior alternative to traditional mask-programmed ASICs. This device eliminates the initial cost barriers, reduces lengthy development cycles, and removes the inherent risks associated with conventional ASIC designs.

Advanced System-Level Specifications

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Operating Frequency Up to 263 MHz
Process Technology 0.18 µm
Core Voltage 2.5V

Memory Architecture

The XC2S200-6FGG555C features a hierarchical SelectRAM memory system that provides designers with flexible storage options:

  • Distributed RAM: 75,264 bits using 16 bits per LUT configuration
  • Block RAM: 56K bits organized in dedicated 4K-bit memory blocks
  • Fast RAM Interfaces: Optimized routing for efficient external RAM connectivity

XC2S200-6FGG555C Technical Specifications

Speed Grade and Temperature Rating

The -6 speed grade designation indicates this device operates within the commercial temperature range of 0°C to 85°C (TJ). This makes the XC2S200-6FGG555C ideal for standard industrial environments where extreme temperature variations are not expected.

Package Information

The FGG555 package utilizes Fine-pitch Ball Grid Array (FBGA) technology. The “G” designation indicates Pb-free (lead-free) packaging, ensuring RoHS compliance for environmentally conscious manufacturing processes.

Package Advantages

  • High pin density in compact form factor
  • Excellent thermal dissipation characteristics
  • Reliable solder joint connections
  • Space-efficient board mounting

Spartan-II Architecture Overview

The XC2S200-6FGG555C leverages the streamlined Spartan-II architecture based on proven Virtex FPGA technology. This second-generation ASIC replacement platform delivers enterprise-level features at significantly reduced costs.

Configurable Logic Blocks (CLBs)

Each CLB contains programmable logic elements that can implement combinational and sequential logic functions. The 28 x 42 CLB array provides substantial resources for complex digital designs.

Input/Output Blocks (IOBs)

The device supports up to 284 user-configurable I/Os with these interface standards:

  • LVTTL and LVCMOS (1.5V, 2.5V, 3.3V)
  • PCI compliant interfaces
  • GTL and GTL+ signaling
  • SSTL and HSTL standards
  • Differential signaling support

Clock Management

Four dedicated Delay-Locked Loops (DLLs) provide advanced clock control features:

  • Clock deskewing and multiplication
  • Phase shifting capabilities
  • Low-skew global clock distribution
  • Board-level clock synchronization

Applications for the XC2S200-6FGG555C

This versatile Xilinx FPGA serves numerous application domains where programmable logic provides distinct advantages over fixed-function alternatives.

Industrial Automation

The XC2S200-6FGG555C excels in factory automation systems requiring real-time signal processing and motor control implementations. Its reconfigurable nature allows for field upgrades without hardware modifications.

Telecommunications Equipment

Network infrastructure equipment benefits from the high-speed interfaces and substantial logic resources. Applications include:

  • Protocol conversion bridges
  • Data switching fabrics
  • Signal processing modules
  • Interface adapters

Embedded Systems

Designers leverage the XC2S200-6FGG555C for custom peripheral implementations and system integration tasks where flexibility and time-to-market are critical factors.

Consumer Electronics

High-volume, cost-sensitive consumer applications benefit from the economical pricing and proven reliability of the Spartan-II platform.

Development Tools and Support

Design Software Compatibility

The XC2S200-6FGG555C is fully supported by Xilinx ISE development tools, providing:

  • Automatic mapping, placement, and routing
  • Comprehensive simulation capabilities
  • Timing analysis and optimization
  • Configuration file generation

Configuration Options

Multiple configuration modes accommodate various system requirements:

  • Master Serial Mode
  • Slave Serial Mode
  • Master Parallel Mode (SelectMAP)
  • JTAG/Boundary Scan configuration

Why Choose the XC2S200-6FGG555C?

Cost-Effective Performance

The Spartan-II family delivers optimal price-to-performance ratios for volume production while maintaining the flexibility advantages of programmable logic.

Unlimited Reprogrammability

Unlike one-time-programmable alternatives, the XC2S200-6FGG555C supports unlimited configuration cycles. This enables:

  • In-system design iterations
  • Field upgrades and enhancements
  • Bug fixes without hardware replacement
  • Product feature customization

Proven Reliability

Based on mature 0.18 µm CMOS process technology, the device offers documented reliability metrics suitable for mission-critical applications.

Full IEEE 1149.1 Compliance

Integrated boundary scan logic simplifies board-level testing and production verification procedures.

Ordering Information

When specifying the XC2S200-6FGG555C, the part number breakdown follows this convention:

  • XC2S200: Device type (Spartan-II, 200K gates)
  • -6: Speed grade (commercial temperature)
  • FGG: Fine-pitch BGA package, Pb-free
  • 555: Pin count
  • C: Commercial temperature range

Conclusion

The XC2S200-6FGG555C represents an excellent choice for engineers requiring high-density programmable logic with proven reliability and comprehensive development support. Its combination of substantial system gates, flexible memory architecture, and versatile I/O capabilities makes it suitable for diverse application requirements ranging from industrial automation to telecommunications infrastructure.

For design-in support, technical documentation, and development resources, consult the official AMD (formerly Xilinx) documentation portal or contact authorized distribution partners.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.