The XC2S200-6FGG553C is a powerful field-programmable gate array (FPGA) from AMD’s proven Spartan-II family, delivering exceptional performance and reliability for demanding embedded and industrial applications. This 200K system gate FPGA combines advanced programmable logic capabilities with cost-effective implementation, making it an ideal solution for engineers seeking robust digital signal processing, telecommunications, and control system designs. As a leading Xilinx FPGA, this device offers the perfect balance of performance, power efficiency, and flexibility.

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XC2S200-6FGG553C Key Features and Benefits

Superior Logic Capacity and Architecture

The XC2S200-6FGG553C features an impressive 200,000 system gates with 5,292 logic cells arranged in a 28 x 42 CLB (Configurable Logic Block) array. This architecture provides engineers with substantial design flexibility for implementing complex digital logic functions. The device contains 1,176 total CLBs, enabling sophisticated algorithm implementations and multi-function designs within a single chip solution.

Advanced Memory Resources

This Spartan-II FPGA integrates comprehensive on-chip memory resources essential for high-performance applications:

The dual-port block RAM cells operate as fully synchronous 4,096-bit memory modules with independent control signals for each port, supporting flexible data width configurations for optimized memory utilization.

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XC2S200-6FGG553C Technical Specifications

Electrical Characteristics

Package and I/O Configuration

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XC2S200-6FGG553C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG553C utilizes a regular, flexible programmable architecture where CLBs form the core computational fabric. Each CLB contains multiple slices with look-up tables (LUTs), flip-flops, and carry logic, enabling efficient implementation of combinatorial and sequential logic functions.

Input/Output Blocks (IOBs)

Surrounding the CLB array, programmable IOBs provide versatile interface capabilities supporting multiple I/O standards. This flexibility allows seamless integration with various external devices and communication protocols in embedded system designs.

Delay-Locked Loops (DLLs)

Four DLLs positioned at each corner of the die provide advanced clock management capabilities:

• Clock deskewing and phase alignment
• Frequency synthesis
• Board-level clock synchronization across multiple FPGAs
• Low clock distribution skew for timing-critical applications

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XC2S200-6FGG553C Target Applications

Industrial and Commercial Applications

The XC2S200-6FGG553C excels in demanding industrial environments:

• Telecommunications Equipment – Protocol processing, data routing, and signal conditioning
• Industrial Automation – Motor control, PLC implementations, and process monitoring
• Medical Devices – Diagnostic imaging, patient monitoring, and therapeutic equipment
• Aerospace & Defense – Avionics systems, radar processing, and secure communications
• Consumer Electronics – Set-top boxes, digital displays, and multimedia processing

Design Flexibility Advantages

This FPGA provides significant advantages over traditional ASIC implementations:

• Eliminates NRE Costs – No mask charges or minimum order quantities
• Rapid Prototyping – Accelerated development cycles with in-system programmability
• Field Upgradability – Design modifications without hardware replacement
• Risk Mitigation – Programmable architecture reduces development uncertainty

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XC2S200-6FGG553C Part Number Decoding

Understanding the AMD/Xilinx part numbering convention:

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Development Tools and Design Resources

Software Support

The XC2S200-6FGG553C is fully supported by AMD’s comprehensive design suite:

• ISE Design Suite – Complete synthesis, implementation, and verification environment
• Vivado Design Suite – Advanced design tools for FPGA development
• IP Core Library – Pre-verified intellectual property blocks for accelerated development
• ChipScope Pro – Real-time debugging and analysis tools

Documentation Resources

Engineers can access extensive technical documentation including:

• Complete datasheet with DC and AC specifications
• Package pinout diagrams and mechanical drawings
• Application notes and design guidelines
• Reference designs and evaluation boards

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XC2S200-6FGG553C Quality and Reliability

Manufacturing Standards

The XC2S200-6FGG553C meets stringent quality requirements:

• RoHS compliant Pb-free packaging
• Automotive and industrial qualification options
• Comprehensive reliability testing per JEDEC standards
• Full production traceability

Long-Term Availability

AMD’s commitment to the Spartan-II family ensures:

• Extended product lifecycle support
• Consistent supply chain availability
• Technical support and documentation maintenance

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Why Choose the XC2S200-6FGG553C for Your Design?

The XC2S200-6FGG553C represents an optimal solution for engineers requiring reliable, high-performance FPGA capabilities in a cost-effective package. With 200K system gates, comprehensive memory resources, and the fastest -6 speed grade, this Spartan-II device delivers exceptional value for industrial, telecommunications, and embedded applications.

Whether you’re developing new products or maintaining legacy systems, the XC2S200-6FGG553C provides the performance, flexibility, and reliability your designs demand. Backed by AMD’s extensive documentation, development tools, and global support infrastructure, this FPGA ensures successful project execution from prototype through volume production.