The XC2S200-6FGG549C is a high-performance Field Programmable Gate Array (FPGA) from the acclaimed Spartan-II family. This versatile programmable logic device delivers exceptional value for engineers seeking a reliable, cost-effective solution for high-volume electronic applications. With 200,000 system gates, 5,292 logic cells, and robust I/O capabilities, the XC2S200-6FGG549C stands as a superior alternative to traditional mask-programmed ASICs.
Key Features of the XC2S200-6FGG549C FPGA
Advanced Logic Architecture
The XC2S200-6FGG549C incorporates a sophisticated configurable logic block (CLB) architecture arranged in a 28×42 array. This design provides 1,176 total CLBs, enabling complex digital logic implementations with maximum flexibility. Each CLB contains four logic cells (LCs), with each LC featuring a 4-input function generator, carry logic, and a storage element.
High-Capacity Memory Resources
This Xilinx FPGA offers dual memory options to meet diverse application requirements:
- Distributed RAM: 75,264 bits of flexible distributed memory integrated within the CLB structure
- Block RAM: 56 Kbits of dedicated dual-port block RAM for high-bandwidth data storage
Comprehensive I/O Support
The XC2S200-6FGG549C provides up to 284 user-configurable I/O pins, supporting multiple I/O standards for seamless system integration. The device accommodates both single-ended and differential signaling protocols, ensuring compatibility with various interface requirements.
Technical Specifications
XC2S200-6FGG549C Detailed Parameters
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18 µm CMOS |
| Core Voltage |
2.5V |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Pin Count |
549 |
| Speed Grade |
-6 (Fastest) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Lead-Free Available |
XC2S200-6FGG549C Architecture Overview
Configurable Logic Blocks (CLBs)
The core of the XC2S200-6FGG549C architecture consists of Configurable Logic Blocks arranged in a regular matrix. Each CLB contains two slices, with each slice providing two 4-input look-up tables (LUTs), two flip-flops, multiplexers, and dedicated arithmetic logic. This structure enables efficient implementation of combinational and sequential logic functions.
Input/Output Blocks (IOBs)
The Input/Output Blocks surrounding the CLB array provide the interface between internal logic and external package pins. Each IOB supports programmable input and output delays, pull-up and pull-down resistors, and multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, and SSTL.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops positioned at each corner of the device provide advanced clock management capabilities. These DLLs offer clock deskew, frequency synthesis, and phase shifting functions essential for high-performance system designs.
Versatile Routing Architecture
A hierarchical routing structure connects all functional elements within the XC2S200-6FGG549C. This routing network includes local interconnects for nearby connections and global routing resources for signals requiring chip-wide distribution.
Applications of XC2S200-6FGG549C
Industrial Control Systems
The XC2S200-6FGG549C excels in industrial automation applications requiring real-time processing capabilities. Its abundant logic resources and high-speed performance make it ideal for motor control, sensor interface, and process automation implementations.
Communication Equipment
This Spartan-II FPGA serves communication infrastructure applications including protocol conversion, data encoding/decoding, and interface bridging. The device’s flexible I/O structure supports various communication standards prevalent in networking equipment.
Consumer Electronics
High-volume consumer electronic products benefit from the XC2S200-6FGG549C’s cost-effective programmability. Applications include display controllers, audio processing systems, and smart home automation devices.
Automotive Electronics
Body electronics, lighting control, and infotainment systems leverage the XC2S200-6FGG549C’s reliability and reconfigurability. The commercial temperature range ensures stable operation across typical automotive operating conditions.
Medical Instrumentation
Medical device manufacturers utilize this FPGA for patient monitoring equipment, diagnostic instruments, and laboratory automation systems where design flexibility and field upgradeability prove valuable.
Advantages of Choosing XC2S200-6FGG549C
Cost-Effective ASIC Alternative
Unlike traditional ASICs requiring significant upfront investment and lengthy development cycles, the XC2S200-6FGG549C eliminates non-recurring engineering (NRE) costs. Engineers can iterate designs rapidly without incurring mask charges or production setup fees.
In-System Programmability
The unlimited reprogrammability of the XC2S200-6FGG549C enables field upgrades without hardware replacement. This capability proves invaluable for addressing post-deployment bug fixes, feature enhancements, or standard compliance updates.
Proven 0.18 µm Process Technology
Manufactured using mature 0.18 µm CMOS process technology, the XC2S200-6FGG549C delivers consistent performance with excellent reliability. This established process node ensures stable supply and predictable device behavior.
Comprehensive Development Support
Design implementation utilizes industry-standard EDA tools with comprehensive documentation and reference designs available. The development ecosystem includes synthesis tools, simulation environments, and in-system debugging capabilities.
XC2S200-6FGG549C Package Information
549-Pin Fine-Pitch BGA Details
The XC2S200-6FGG549C utilizes a Fine-Pitch Ball Grid Array (FBGA) package providing optimal electrical performance and board-level reliability. Key package characteristics include:
- Ball Pitch: 1.0 mm
- Package Dimensions: Compact footprint for space-constrained designs
- Thermal Performance: Enhanced heat dissipation through BGA substrate
- Soldering: Compatible with standard lead-free reflow processes
Lead-Free Packaging Option
Environmental compliance requirements are addressed through lead-free (Pb-free) packaging options. The “G” designation in the part number (FGG) indicates RoHS-compliant, lead-free ball composition suitable for environmentally conscious manufacturing.
Ordering Information
Part Number Breakdown
XC2S200-6FGG549C decodes as follows:
- XC2S200: Spartan-II device with 200K system gates
- -6: Fastest speed grade (commercial temperature only)
- FGG: Fine-pitch BGA, lead-free packaging
- 549: 549-ball package configuration
- C: Commercial temperature range (0°C to +85°C)
Speed Grade Considerations
The -6 speed grade represents the fastest performance tier within the XC2S200 family. This designation indicates optimized timing parameters for applications demanding maximum operating frequency. Note that -6 speed grade availability is restricted to commercial temperature variants.
Configuration and Programming
Configuration Modes
The XC2S200-6FGG549C supports multiple configuration modes to accommodate various system architectures:
- Master Serial Mode: Device controls configuration timing
- Slave Serial Mode: External controller manages configuration
- Master Parallel Mode: Byte-wide configuration for faster programming
- Boundary Scan Mode: JTAG-based configuration and testing
Configuration Storage
Configuration data storage options include Platform Flash in-system programmable PROMs and standard parallel flash memories. The device requires approximately 1.5 Mb of configuration storage for complete bitstream programming.
Design Resources for XC2S200-6FGG549C
Development Tools
- ISE Design Suite: Comprehensive FPGA development environment
- ModelSim/ISim: Simulation and verification tools
- ChipScope Pro: In-system debugging and analysis
- IMPACT: Configuration and programming software
Documentation Available
Engineers working with the XC2S200-6FGG549C can access extensive technical documentation including device datasheets, user guides, application notes, and reference designs through official AMD/Xilinx documentation portals.
Why Select XC2S200-6FGG549C for Your Next Project
The XC2S200-6FGG549C represents an optimal balance of performance, capacity, and cost for embedded system applications. Its combination of 200,000 system gates, comprehensive I/O capabilities, and flexible memory resources addresses requirements spanning industrial, communication, consumer, and automotive markets.
Engineers benefit from reduced development risk through the device’s reprogrammability while achieving cost targets comparable to high-volume ASIC implementations. The mature technology foundation ensures long-term availability and consistent supply for production programs.
For projects requiring programmable logic solutions that balance capability with economy, the XC2S200-6FGG549C Spartan-II FPGA delivers proven performance backed by comprehensive design support infrastructure.
