The XC2S200-6FGG533C is a powerful field-programmable gate array from AMD’s renowned Spartan-II FPGA family. This advanced programmable logic device delivers exceptional performance and flexibility for demanding digital applications, making it an ideal choice for engineers seeking cost-effective FPGA solutions with robust functionality.

Key Features of the XC2S200-6FGG533C Spartan-II FPGA

The XC2S200-6FGG533C combines cutting-edge architecture with proven reliability, offering developers a comprehensive feature set for complex digital designs. This Xilinx FPGA device provides substantial logic resources while maintaining excellent power efficiency.

Core Architecture Specifications

The XC2S200-6FGG533C features a sophisticated internal architecture designed for maximum design flexibility:

Package Information and Pinout Details

The FGG533 package variant offers enhanced connectivity options with its 533-ball Fine-pitch Ball Grid Array configuration. The Pb-free (lead-free) packaging, indicated by the “G” designation in FGG533, ensures RoHS compliance for environmentally conscious designs.

Speed Grade and Temperature Range

• Speed Grade: -6 (highest performance tier for commercial applications)
• Operating Temperature: Commercial range (0°C to +85°C)
• Core Voltage: 2.5V
• I/O Voltage: 3.3V compatible

Advanced Clock Management with DLL Technology

Four On-Chip Delay-Locked Loops

The XC2S200-6FGG533C incorporates four fully digital Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These DLLs provide:

• Zero propagation delay between source and output clocks
• Low clock skew across the entire device
• Clock mirroring capability for board-level synchronization
• System clock rates up to 200 MHz

Global Clock Distribution Network

The Spartan-II architecture features a two-tier global routing system with four dedicated primary global nets and 24 secondary backbone lines, ensuring efficient high-fanout signal distribution throughout the device.

Versatile I/O Standards Support

Multi-Standard Interface Compatibility

The XC2S200-6FGG533C supports numerous I/O standards for seamless integration with various system interfaces:

• LVTTL (5V tolerant)
• LVCMOS2 (5V tolerant)
• PCI 33MHz/66MHz (5V tolerant)
• GTL and GTL+
• HSTL Class I, II, III, IV
• SSTL2 Class I and II
• SSTL3 Class I and II
• CTT
• AGP-2X

Input/Output Block Architecture

Each IOB provides comprehensive signal control features including:

• Three registers configurable as edge-triggered flip-flops or level-sensitive latches
• Independent Clock Enable (CE) signals
• Programmable Set/Reset functionality
• Configurable drive strength and slew rate control

Configurable Logic Block Structure

CLB Organization and Resources

The XC2S200-6FGG533C contains 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB comprises:

• Four Logic Cells (LCs) organized in two slices
• Four 4-input look-up tables (LUTs) per CLB
• Fast carry logic for high-speed arithmetic operations
• Dedicated multiplexer resources for wide function implementation

Distributed RAM Capabilities

The LUT-based architecture enables flexible distributed RAM implementation:

• Single-port RAM: 16 x 1-bit per LUT
• Dual-port RAM configurations supported
• Synchronous read/write operations
• Total distributed RAM capacity: 75,264 bits

Block RAM Memory Resources

Dedicated Block RAM Architecture

The XC2S200-6FGG533C includes 56 Kbits of dedicated block RAM organized in two columns along the vertical edges of the die. Key features include:

• 4,096-bit memory blocks
• Single-port and dual-port configurations
• Synchronous operation
• Independent read and write clocks for dual-port mode
• Cascadable for larger memory implementations

Configuration and Programming Options

Multiple Configuration Modes

The Spartan-II FPGA supports flexible configuration through several modes:

• Master Serial Mode
• Slave Serial Mode
• Master Parallel Mode
• Slave Parallel Mode
• Boundary Scan (JTAG) Mode

In-System Programmability

The XC2S200-6FGG533C offers unlimited reprogramming cycles with configuration data stored in internal SRAM cells. This enables:

• Field-upgradeable designs
• Dynamic reconfiguration capabilities
• Rapid prototyping and development iterations

Industrial Applications and Use Cases

Ideal Application Areas

The XC2S200-6FGG533C excels in numerous application domains:

• Telecommunications: Protocol processing, signal routing, and interface bridging
• Industrial Automation: Motor control, sensor processing, and PLC implementations
• Consumer Electronics: Video processing, audio systems, and display controllers
• Networking Equipment: Packet processing, switch fabric, and bridge functions
• Embedded Systems: Custom peripheral interfaces and co-processing units

Design Advantages Over ASICs

The Spartan-II FPGA provides significant benefits compared to mask-programmed ASICs:

• Elimination of high NRE (Non-Recurring Engineering) costs
• Reduced time-to-market with rapid design iterations
• Field-upgradeable functionality
• Lower risk through programmable hardware verification

Technical Documentation and Design Resources

Available Support Materials

Comprehensive documentation supports development with the XC2S200-6FGG533C:

• Complete datasheet (DS001) with electrical specifications
• Pinout tables for FGG533 package
• Configuration and programming guides
• Application notes for DLL usage and I/O interfacing
• PCB layout guidelines and thermal considerations

Development Tool Compatibility

The XC2S200-6FGG533C is supported by:

• Xilinx ISE Design Suite (recommended for Spartan-II designs)
• Industry-standard HDL synthesis tools
• Third-party simulation and verification platforms

Ordering Information and Part Number Breakdown

Understanding the Part Number

XC2S200-6FGG533C decodes as follows:

Quality and Reliability Standards

The XC2S200-6FGG533C adheres to stringent quality standards:

• RoHS compliant Pb-free packaging
• Extensive qualification testing
• Proven 0.18μm CMOS process technology
• Long-term reliability data available

Conclusion

The XC2S200-6FGG533C Spartan-II FPGA delivers an optimal combination of logic density, performance, and I/O flexibility in a RoHS-compliant 533-ball FBGA package. With 200,000 system gates, 5,292 logic cells, 56K block RAM, and support for 16 different I/O standards, this device serves as an excellent platform for telecommunications, industrial, and embedded applications requiring proven FPGA technology.