The XC2S200-6FGG525C is a high-performance field-programmable gate array (FPGA) from AMD’s proven Spartan-II family. This programmable logic device delivers exceptional versatility and reliability for demanding industrial, commercial, and embedded applications. With 200,000 system gates, 5,292 logic cells, and a Pb-free 525-pin FBGA package, the XC2S200-6FGG525C provides engineers with a cost-effective solution for complex digital design implementations.
Key Features of the XC2S200-6FGG525C Spartan-II FPGA
The XC2S200-6FGG525C combines advanced programmable logic capabilities with robust memory resources, making it ideal for applications requiring flexible digital signal processing and control system solutions.
Core Architecture Specifications
The XC2S200-6FGG525C features a comprehensive CLB (Configurable Logic Block) architecture optimized for high-performance digital designs:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Process Technology |
0.18µm CMOS |
| Core Voltage |
2.5V (2.375V – 2.625V) |
| Speed Grade |
-6 (High Performance) |
Memory Resources and Block RAM
The XC2S200-6FGG525C incorporates substantial on-chip memory resources to support data-intensive applications:
| Memory Type |
Capacity |
| Total Block RAM |
56 Kbits (14 blocks) |
| Distributed RAM |
75,264 bits |
| Configuration Memory |
1,335,840 bits |
Each block RAM cell operates as a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The configurable port widths (1, 2, 4, 8, or 16 bits) provide design flexibility for various memory interface requirements.
XC2S200-6FGG525C Package and Pinout Information
525-Pin Fine-Pitch BGA Package Details
The FGG525 package designation indicates a Pb-free (RoHS compliant) Fine-pitch Ball Grid Array configuration. This surface-mount package offers excellent thermal performance and reliable solder connections for production environments.
| Package Parameter |
Value |
| Package Type |
FBGA (Fine-pitch Ball Grid Array) |
| Total Pins |
525 |
| Lead-Free |
Yes (Pb-free, indicated by “G”) |
| Mounting Type |
Surface Mount |
I/O Standards and Voltage Compatibility
The XC2S200-6FGG525C supports 16 selectable I/O standards, providing versatile interfacing options for various external devices and communication protocols:
- LVTTL (5V tolerant input)
- LVCMOS (2.5V and 3.3V)
- PCI 3.3V and PCI 5V
- GTL and GTL+
- SSTL2 and SSTL3
- HSTL Class I, III, and IV
- CTT
- AGP-2X
The I/O pins are organized into four banks, each with independent VCCO supply voltages, enabling mixed-voltage designs on a single device.
Clock Management with Delay-Locked Loops (DLLs)
The XC2S200-6FGG525C includes four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide advanced clock distribution and management capabilities:
- Clock deskew and phase alignment
- Clock multiplication and division
- Zero-delay clock buffering
- Clock mirroring for external synchronization
XC2S200-6FGG525C Part Number Breakdown
Understanding the ordering code helps engineers specify the correct device variant:
| Code Segment |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200K System Gate Density |
| -6 |
Speed Grade (Highest Performance) |
| FG |
Fine-pitch Ball Grid Array |
| G |
Pb-free (Lead-free) Package |
| 525 |
Pin Count |
| C |
Commercial Temperature (0°C to +85°C) |
Typical Applications for the XC2S200-6FGG525C FPGA
The XC2S200-6FGG525C programmable logic device excels in numerous application domains:
Industrial Control Systems
The robust architecture and high I/O count make this FPGA ideal for programmable logic controllers (PLCs), motor drive controllers, and industrial automation equipment requiring real-time processing capabilities.
Communications Equipment
With substantial block RAM and high-speed I/O capabilities, the XC2S200-6FGG525C suits telecommunications infrastructure, network switches, and protocol conversion applications.
Consumer Electronics
Cost-effective pricing combined with flexible configuration makes this device appropriate for high-volume consumer products including video processing systems and display controllers.
Prototyping and Development
Engineers frequently select the XC2S200-6FGG525C for ASIC prototyping and system development, leveraging its in-system programmability and JTAG interface for rapid design iterations.
Development Tools and Software Support
The XC2S200-6FGG525C is supported by Xilinx ISE Design Suite, which provides comprehensive tools for FPGA design:
- Schematic capture and HDL synthesis (VHDL/Verilog)
- Place-and-route optimization
- Timing analysis and simulation
- JTAG-based in-system programming
- Boundary scan testing capabilities
Configuration Modes
The XC2S200-6FGG525C supports multiple configuration modes for flexible system integration:
| Mode |
Description |
Data Width |
| Master Serial |
Self-loading from external PROM |
1-bit |
| Slave Serial |
Configuration via external controller |
1-bit |
| Slave Parallel |
High-speed parallel configuration |
8-bit |
| Boundary Scan |
JTAG-based configuration |
1-bit |
Why Choose the XC2S200-6FGG525C for Your Design
The XC2S200-6FGG525C offers several compelling advantages over mask-programmed ASICs and competing FPGA solutions:
Cost-Effective Development
This Spartan-II device eliminates the high NRE (non-recurring engineering) costs associated with custom ASIC development, making it economical for low-to-medium volume production runs.
Field Upgradability
In-system programmability enables firmware updates and feature enhancements without hardware replacement, extending product lifecycles and simplifying maintenance.
Proven Reliability
The Spartan-II architecture has demonstrated long-term reliability across thousands of deployed applications worldwide, providing confidence for mission-critical designs.
Comprehensive Documentation
Extensive technical resources including datasheets, application notes, and reference designs accelerate development timelines and reduce engineering risk.
For more information about programmable logic solutions and FPGA product families, visit our comprehensive Xilinx FPGA resource center.
Technical Specifications Summary
| Specification |
XC2S200-6FGG525C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLBs |
1,176 |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Max User I/O |
284 |
| DLLs |
4 |
| Core Voltage |
2.5V |
| Package |
525-pin FBGA |
| Speed Grade |
-6 |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliant |
Yes |
The XC2S200-6FGG525C represents a proven solution for engineers seeking reliable, high-performance FPGA capabilities in a cost-effective, lead-free package backed by comprehensive development tools and global technical support.