Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG525C: AMD Spartan-II FPGA with 200K System Gates

Product Details

The XC2S200-6FGG525C is a high-performance field-programmable gate array (FPGA) from AMD’s proven Spartan-II family. This programmable logic device delivers exceptional versatility and reliability for demanding industrial, commercial, and embedded applications. With 200,000 system gates, 5,292 logic cells, and a Pb-free 525-pin FBGA package, the XC2S200-6FGG525C provides engineers with a cost-effective solution for complex digital design implementations.

Key Features of the XC2S200-6FGG525C Spartan-II FPGA

The XC2S200-6FGG525C combines advanced programmable logic capabilities with robust memory resources, making it ideal for applications requiring flexible digital signal processing and control system solutions.

Core Architecture Specifications

The XC2S200-6FGG525C features a comprehensive CLB (Configurable Logic Block) architecture optimized for high-performance digital designs:

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Process Technology 0.18µm CMOS
Core Voltage 2.5V (2.375V – 2.625V)
Speed Grade -6 (High Performance)

Memory Resources and Block RAM

The XC2S200-6FGG525C incorporates substantial on-chip memory resources to support data-intensive applications:

Memory Type Capacity
Total Block RAM 56 Kbits (14 blocks)
Distributed RAM 75,264 bits
Configuration Memory 1,335,840 bits

Each block RAM cell operates as a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The configurable port widths (1, 2, 4, 8, or 16 bits) provide design flexibility for various memory interface requirements.

XC2S200-6FGG525C Package and Pinout Information

525-Pin Fine-Pitch BGA Package Details

The FGG525 package designation indicates a Pb-free (RoHS compliant) Fine-pitch Ball Grid Array configuration. This surface-mount package offers excellent thermal performance and reliable solder connections for production environments.

Package Parameter Value
Package Type FBGA (Fine-pitch Ball Grid Array)
Total Pins 525
Lead-Free Yes (Pb-free, indicated by “G”)
Mounting Type Surface Mount

I/O Standards and Voltage Compatibility

The XC2S200-6FGG525C supports 16 selectable I/O standards, providing versatile interfacing options for various external devices and communication protocols:

  • LVTTL (5V tolerant input)
  • LVCMOS (2.5V and 3.3V)
  • PCI 3.3V and PCI 5V
  • GTL and GTL+
  • SSTL2 and SSTL3
  • HSTL Class I, III, and IV
  • CTT
  • AGP-2X

The I/O pins are organized into four banks, each with independent VCCO supply voltages, enabling mixed-voltage designs on a single device.

Clock Management with Delay-Locked Loops (DLLs)

The XC2S200-6FGG525C includes four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide advanced clock distribution and management capabilities:

  • Clock deskew and phase alignment
  • Clock multiplication and division
  • Zero-delay clock buffering
  • Clock mirroring for external synchronization

XC2S200-6FGG525C Part Number Breakdown

Understanding the ordering code helps engineers specify the correct device variant:

Code Segment Meaning
XC2S Xilinx Spartan-II Family
200 200K System Gate Density
-6 Speed Grade (Highest Performance)
FG Fine-pitch Ball Grid Array
G Pb-free (Lead-free) Package
525 Pin Count
C Commercial Temperature (0°C to +85°C)

Typical Applications for the XC2S200-6FGG525C FPGA

The XC2S200-6FGG525C programmable logic device excels in numerous application domains:

Industrial Control Systems

The robust architecture and high I/O count make this FPGA ideal for programmable logic controllers (PLCs), motor drive controllers, and industrial automation equipment requiring real-time processing capabilities.

Communications Equipment

With substantial block RAM and high-speed I/O capabilities, the XC2S200-6FGG525C suits telecommunications infrastructure, network switches, and protocol conversion applications.

Consumer Electronics

Cost-effective pricing combined with flexible configuration makes this device appropriate for high-volume consumer products including video processing systems and display controllers.

Prototyping and Development

Engineers frequently select the XC2S200-6FGG525C for ASIC prototyping and system development, leveraging its in-system programmability and JTAG interface for rapid design iterations.

Development Tools and Software Support

The XC2S200-6FGG525C is supported by Xilinx ISE Design Suite, which provides comprehensive tools for FPGA design:

  • Schematic capture and HDL synthesis (VHDL/Verilog)
  • Place-and-route optimization
  • Timing analysis and simulation
  • JTAG-based in-system programming
  • Boundary scan testing capabilities

Configuration Modes

The XC2S200-6FGG525C supports multiple configuration modes for flexible system integration:

Mode Description Data Width
Master Serial Self-loading from external PROM 1-bit
Slave Serial Configuration via external controller 1-bit
Slave Parallel High-speed parallel configuration 8-bit
Boundary Scan JTAG-based configuration 1-bit

Why Choose the XC2S200-6FGG525C for Your Design

The XC2S200-6FGG525C offers several compelling advantages over mask-programmed ASICs and competing FPGA solutions:

Cost-Effective Development

This Spartan-II device eliminates the high NRE (non-recurring engineering) costs associated with custom ASIC development, making it economical for low-to-medium volume production runs.

Field Upgradability

In-system programmability enables firmware updates and feature enhancements without hardware replacement, extending product lifecycles and simplifying maintenance.

Proven Reliability

The Spartan-II architecture has demonstrated long-term reliability across thousands of deployed applications worldwide, providing confidence for mission-critical designs.

Comprehensive Documentation

Extensive technical resources including datasheets, application notes, and reference designs accelerate development timelines and reduce engineering risk.

For more information about programmable logic solutions and FPGA product families, visit our comprehensive Xilinx FPGA resource center.

Technical Specifications Summary

Specification XC2S200-6FGG525C
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLBs 1,176
Block RAM 56 Kbits
Distributed RAM 75,264 bits
Max User I/O 284
DLLs 4
Core Voltage 2.5V
Package 525-pin FBGA
Speed Grade -6
Temperature Range Commercial (0°C to +85°C)
RoHS Compliant Yes

The XC2S200-6FGG525C represents a proven solution for engineers seeking reliable, high-performance FPGA capabilities in a cost-effective, lead-free package backed by comprehensive development tools and global technical support.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.