The XC2S200-6FGG516C is a high-performance Field Programmable Gate Array (FPGA) from the AMD Xilinx Spartan-II family. This versatile programmable logic device delivers 200,000 system gates, 5,292 logic cells, and operates at frequencies up to 263MHz, making it an excellent choice for cost-sensitive applications requiring flexible, reprogrammable hardware solutions.
XC2S200-6FGG516C Technical Specifications Overview
The XC2S200-6FGG516C combines robust logic resources with advanced I/O capabilities, all packaged in a compact 516-pin Fine-pitch Ball Grid Array (FBGA) format. Engineers and designers choose this Xilinx FPGA for its balance of performance, power efficiency, and system integration flexibility.
Core Architecture Parameters
| Parameter |
Specification |
| Device Family |
Spartan-II |
| Part Number |
XC2S200-6FGG516C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array (Row × Column) |
28 × 42 |
| Number of CLBs |
1,176 |
| Maximum Distributed RAM (bits) |
57,344 |
| Block RAM (bits) |
56,000 |
| Delay-Locked Loops (DLLs) |
4 |
XC2S200-6FGG516C Speed Grade and Performance Characteristics
The “-6” speed grade designation indicates the fastest performance tier available for this Spartan-II device. Consequently, the XC2S200-6FGG516C achieves maximum internal clock frequencies of 263MHz, enabling demanding signal processing and high-throughput data applications.
Timing and Frequency Specifications
| Parameter |
XC2S200-6FGG516C Value |
| Maximum Clock Frequency |
263 MHz |
| Process Technology |
0.18 µm |
| CLB Flip-Flop Toggle Rate |
Up to 263 MHz |
| Block RAM Access Speed |
Single-cycle synchronous |
I/O Configuration and Pin Assignment for XC2S200-6FGG516C
The 516-pin FBGA package provides extensive I/O resources for complex system designs. Moreover, the XC2S200-6FGG516C supports multiple I/O standards, ensuring seamless integration with diverse peripheral components and interface protocols.
Input/Output Features
| I/O Characteristic |
Specification |
| Maximum User I/Os |
284 |
| Package Type |
516-Pin FBGA |
| I/O Standards Supported |
LVTTL, LVCMOS, PCI, GTL, SSTL |
| Differential I/O Support |
LVDS, BLVDS, LVPECL |
| Hot-Swap Compliance |
Yes |
| 3.3V PCI Compatible |
Yes |
Power Supply Requirements
| Supply Rail |
Voltage Range |
| VCCINT (Core Logic) |
2.375V – 2.625V (Nominal 2.5V) |
| VCCO (I/O Banks) |
1.5V / 2.5V / 3.3V (Bank selectable) |
XC2S200-6FGG516C Configurable Logic Block (CLB) Architecture
Each CLB in the XC2S200-6FGG516C contains four Logic Cells (LCs), providing granular control over logic implementation. Furthermore, the hierarchical routing structure enables efficient signal propagation across the device fabric.
CLB Internal Structure
| CLB Element |
Description |
| Logic Cells per CLB |
4 |
| 4-Input LUTs per CLB |
4 |
| Flip-Flops per CLB |
4 |
| Carry Logic |
Dedicated fast carry chain |
| Distributed RAM per CLB |
32-bit single-port / 16-bit dual-port |
| Direct Feedthrough Paths |
4 per CLB |
Block RAM Resources in XC2S200-6FGG516C
The XC2S200-6FGG516C incorporates 14 dedicated Block RAM modules, each offering 4,096 bits of true dual-port synchronous memory. As a result, designers can implement high-speed buffers, FIFOs, and local storage without consuming valuable logic resources.
Block RAM Configuration Options
| Memory Configuration |
Port A Width |
Port B Width |
| 4K × 1 |
1 bit |
1 bit |
| 2K × 2 |
2 bits |
2 bits |
| 1K × 4 |
4 bits |
4 bits |
| 512 × 8 |
8 bits |
8 bits |
| 256 × 16 |
16 bits |
16 bits |
Delay-Locked Loop (DLL) Features for XC2S200-6FGG516C
Four dedicated DLLs provide precise clock management capabilities in the XC2S200-6FGG516C. These modules eliminate clock distribution delays and enable advanced clocking schemes essential for high-performance digital designs.
DLL Capabilities
| DLL Function |
Specification |
| Number of DLLs |
4 |
| Clock Deskew |
Yes |
| Frequency Multiplication |
2× |
| Frequency Division |
1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16× |
| Phase Shift |
0°, 90°, 180°, 270° |
| Input Frequency Range |
25 MHz – 200 MHz |
XC2S200-6FGG516C Application Domains
The XC2S200-6FGG516C serves diverse application segments due to its combination of logic density, memory resources, and I/O flexibility. Typical deployment scenarios include:
Industrial and Commercial Applications
- Telecommunications Equipment: Protocol conversion, data multiplexing
- Industrial Automation: Motor control, sensor interfaces, PLC coprocessing
- Consumer Electronics: Video processing, display controllers
- Network Infrastructure: Packet processing, bridge/router functions
- Medical Devices: Signal acquisition, real-time processing
Design Advantages Over ASICs
| Benefit |
Description |
| Rapid Prototyping |
Immediate design verification without mask charges |
| Field Upgradability |
In-system reprogramming for feature updates |
| Lower NRE Costs |
No custom fabrication expenses |
| Reduced Time-to-Market |
Weeks instead of months for production |
Configuration and Programming Options for XC2S200-6FGG516C
The XC2S200-6FGG516C supports multiple configuration modes, allowing designers to optimize board layout and boot sequences according to system requirements.
Supported Configuration Modes
| Mode |
Description |
| Master Serial |
FPGA controls configuration clock |
| Slave Serial |
External controller drives configuration |
| Master Parallel |
8-bit parallel interface, FPGA as master |
| Slave Parallel |
8-bit parallel interface, external master |
| Boundary Scan (JTAG) |
IEEE 1149.1 compliant programming |
Configuration Memory Size
| Parameter |
Value |
| Configuration Bits |
1,442,016 |
| Frames |
404 |
| Bits per Frame |
3,572 |
XC2S200-6FGG516C Part Number Decoder
Understanding the complete part number helps engineers specify the correct device variant for their applications.
Part Number Breakdown
| Segment |
Meaning |
| XC2S |
Spartan-II Family Identifier |
| 200 |
200K System Gate Density |
| -6 |
Fastest Speed Grade |
| FGG |
Fine-pitch BGA, Pb-free Package |
| 516 |
516-Pin Count |
| C |
Commercial Temperature Grade (0°C to +85°C) |
Operating Conditions and Environmental Specifications
| Parameter |
Commercial (C) Grade |
| Junction Temperature |
0°C to +85°C |
| Storage Temperature |
-65°C to +150°C |
| Moisture Sensitivity Level |
MSL 3 |
| ESD Protection (HBM) |
2000V |
| Package Material |
Pb-free / RoHS Compliant |
XC2S200-6FGG516C Design Tool Support
Xilinx ISE Design Suite provides comprehensive support for Spartan-II device development, including synthesis, implementation, and simulation capabilities.
Recommended Development Tools
| Tool |
Function |
| ISE WebPACK |
Free synthesis and implementation |
| ISE Foundation |
Full-featured design suite |
| ModelSim XE |
Functional simulation |
| ChipScope Pro |
On-chip debugging |
Summary: Why Choose XC2S200-6FGG516C
The XC2S200-6FGG516C delivers exceptional value for applications requiring moderate logic density with high-speed performance. Its combination of 200,000 system gates, 56K bits of block RAM, four DLLs, and 284 user I/Os provides substantial design headroom. Additionally, the commercial temperature rating and Pb-free packaging ensure compliance with modern environmental standards.
Whether upgrading legacy designs or implementing new embedded solutions, the XC2S200-6FGG516C offers proven reliability backed by AMD Xilinx’s extensive documentation and design ecosystem.
