The XC2S200-6FGG513C is a powerful field-programmable gate array (FPGA) from AMD’s proven Spartan-II family, delivering exceptional performance and reliability for demanding industrial and commercial applications. This Xilinx FPGA solution combines advanced 200,000-gate programmable logic capabilities with cost-effective implementation in a 513-pin Fine-pitch Ball Grid Array (FBGA) package.
XC2S200-6FGG513C Technical Specifications
Core Architecture and Logic Resources
The XC2S200-6FGG513C features a robust architecture built on 0.18µm process technology, offering engineers substantial logic resources for complex digital designs.
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Number of CLBs |
1,176 |
| Distributed RAM Bits |
75,264 |
| Maximum User I/O |
284 |
Block RAM Configuration
The XC2S200-6FGG513C integrates dedicated Block RAM resources for high-speed data buffering and storage applications.
| Block RAM Parameter |
Value |
| Block RAM Blocks |
14 |
| Total Block RAM |
56 Kbits |
| RAM Port Configurations |
Dual-Port |
| Maximum Width |
16-bit |
| Maximum Depth |
4,096 × 1-bit |
Supported Block RAM Aspect Ratios
The dual-port Block RAM supports multiple aspect ratio configurations:
- 4096 × 1-bit configuration
- 2048 × 2-bit configuration
- 1024 × 4-bit configuration
- 512 × 8-bit configuration
- 256 × 16-bit configuration
XC2S200-6FGG513C Performance Characteristics
Speed Grade and Timing Performance
The “-6” speed grade designation indicates the fastest available speed bin for the Spartan-II family, making the XC2S200-6FGG513C ideal for performance-critical applications.
| Performance Parameter |
Specification |
| Speed Grade |
-6 (Fastest) |
| Maximum System Frequency |
263 MHz |
| Process Technology |
0.18 µm |
| Performance Classification |
High-Speed Commercial |
Four Delay-Locked Loops (DLLs)
The XC2S200-6FGG513C incorporates four dedicated Delay-Locked Loops positioned at each corner of the die, providing:
- Clock de-skewing capabilities
- Frequency synthesis functions
- Phase-shift clock generation
- Low-jitter clock distribution
XC2S200-6FGG513C Package and Electrical Specifications
FGG513 Fine-Pitch BGA Package Details
The Fine-pitch Ball Grid Array (FBGA) package offers excellent thermal and electrical performance for high-density PCB designs.
| Package Parameter |
Specification |
| Package Type |
FGG (Fine-pitch BGA) |
| Pin Count |
513 |
| Package Material |
Lead-Free Available |
| Mounting Type |
Surface Mount |
| Temperature Grade |
C (Commercial: 0°C to +85°C) |
Power Supply Requirements
| Power Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V (2.375V – 2.625V) |
| I/O Voltage (VCCO) |
Programmable |
| Power Management |
Low-Power Design |
XC2S200-6FGG513C I/O Standards and SelectIO Technology
Supported I/O Standards
The XC2S200-6FGG513C SelectIO technology supports 16 different I/O signaling standards:
- Single-Ended Standards: LVTTL, LVCMOS (3.3V/2.5V), PCI (3.3V/5V)
- Differential Standards: LVDS, BLVDS, LVPECL
- High-Speed Interfaces: GTL, GTL+, HSTL (Class I/II/III/IV)
- Memory Interfaces: SSTL2 (Class I/II), SSTL3 (Class I/II)
Programmable I/O Features
- Individual output drive strength control
- Programmable slew rate (Fast/Slow)
- Optional pull-up/pull-down resistors
- Hot-swap compliance support
XC2S200-6FGG513C Configurable Logic Block Architecture
CLB Structure and Capabilities
Each Configurable Logic Block in the XC2S200-6FGG513C contains:
- Two logic slices
- Four 4-input look-up tables (LUTs)
- Four flip-flops with individual clock enables
- Fast carry logic for arithmetic operations
- Wide function multiplexers
Distributed RAM Implementation
The CLB architecture enables distributed RAM configurations:
- Single-port RAM (16 × 1-bit per LUT)
- Dual-port RAM (16 × 1-bit per LUT)
- Shift register implementation (16-bit per LUT)
XC2S200-6FGG513C Part Number Decoder
Understanding the complete part number structure:
| Code Segment |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Fastest Speed Grade |
| FGG |
Fine-pitch Ball Grid Array (Pb-Free) |
| 513 |
513-Pin Package |
| C |
Commercial Temperature (0°C to +85°C) |
XC2S200-6FGG513C Industrial Applications
Target Application Areas
The XC2S200-6FGG513C excels in diverse application environments:
Digital Signal Processing (DSP)
- Filter implementations
- Signal conditioning
- Data acquisition systems
- Audio/video processing
Industrial Control Systems
- Motor control units
- PLC coprocessors
- Factory automation
- Process control interfaces
Communications Equipment
- Protocol conversion
- Interface bridging
- Packet processing
- Telecommunication systems
Consumer Electronics
- Display controllers
- Image processing
- Gaming systems
- Set-top boxes
XC2S200-6FGG513C Advantages Over ASICs
Cost-Effective Alternative to Mask-Programmed ASICs
The XC2S200-6FGG513C provides significant advantages:
- Zero NRE Costs: No mask or tooling charges
- Rapid Prototyping: Immediate design validation
- Field Upgradability: In-system reprogramming capability
- Risk Mitigation: Design changes without hardware replacement
- Time-to-Market: Accelerated development cycles
XC2S200-6FGG513C Development Tools and Resources
Compatible Design Software
- Xilinx ISE Design Suite: Complete synthesis and implementation
- Foundation Series: Schematic and HDL design entry
- ModelSim: Simulation and verification
- ChipScope Pro: On-chip debugging
Supported Design Languages
- Verilog HDL
- VHDL
- Schematic Capture
- Mixed-mode Design Entry
XC2S200-6FGG513C Configuration Options
Configuration Modes Supported
| Mode |
Description |
| Master Serial |
External serial PROM |
| Slave Serial |
External processor control |
| Master Parallel |
Byte-wide configuration |
| Boundary Scan |
JTAG programming |
Configuration Storage
- Compatible with Xilinx Platform Flash PROMs
- Supports industry-standard serial EEPROMs
- JTAG boundary-scan (IEEE 1149.1) compliant
XC2S200-6FGG513C Quality and Reliability
Manufacturing Standards
- ISO 9001 certified manufacturing
- Automotive-grade options available
- Extended temperature range variants
- Lead-free (Pb-free) packaging compliance (RoHS)
Reliability Metrics
- Extensive qualification testing
- Accelerated life testing data available
- Failure rate data per JEDEC standards
XC2S200-6FGG513C Summary Specifications Table
| Category |
Parameter |
Value |
| Logic |
System Gates |
200,000 |
|
Logic Cells |
5,292 |
|
CLBs |
1,176 |
| Memory |
Block RAM |
56 Kbits (14 blocks) |
|
Distributed RAM |
75,264 bits |
| I/O |
Maximum User I/O |
284 |
|
I/O Standards |
16 |
| Clock |
DLLs |
4 |
|
Max Frequency |
263 MHz |
| Package |
Type |
FGG513 (FBGA) |
|
Pin Count |
513 |
| Electrical |
Core Voltage |
2.5V |
|
Technology |
0.18 µm |
| Environmental |
Temperature |
0°C to +85°C (Commercial) |
Ordering Information for XC2S200-6FGG513C
When ordering the XC2S200-6FGG513C, verify the following specifications match your design requirements:
- Speed grade (-6 for highest performance)
- Package type (FGG513 for 513-pin FBGA)
- Temperature grade (C for commercial applications)
- Lead-free designation (G in package code indicates Pb-free)
Frequently Asked Questions About XC2S200-6FGG513C
What is the maximum operating frequency of XC2S200-6FGG513C?
The XC2S200-6FGG513C achieves system frequencies up to 263 MHz with the -6 speed grade, the fastest available in the Spartan-II family.
Is the XC2S200-6FGG513C suitable for in-system reconfiguration?
Yes, the XC2S200-6FGG513C supports multiple configuration modes including JTAG boundary-scan for in-system programming and field updates.
What I/O voltage levels does XC2S200-6FGG513C support?
The SelectIO technology supports programmable I/O voltages compatible with 16 different standards including LVTTL, LVCMOS, LVDS, HSTL, and SSTL interfaces.
Does XC2S200-6FGG513C include embedded memory?
Yes, the device integrates 14 dedicated Block RAM blocks totaling 56 Kbits, plus 75,264 bits of distributed RAM implemented using CLB resources.
