The XC2S200-6FGG509C is a powerful field-programmable gate array (FPGA) from AMD’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance, reliability, and cost-effectiveness for demanding industrial, commercial, and embedded applications. Engineered with proven 0.18-micron process technology, the XC2S200-6FGG509C provides designers with a superior alternative to mask-programmed ASICs while offering unlimited reprogrammability and field-upgrade capabilities.

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XC2S200-6FGG509C Key Features and Benefits

The XC2S200-6FGG509C combines second-generation ASIC replacement technology with streamlined features based on the Virtex FPGA architecture. This Xilinx FPGA solution eliminates initial NRE costs, reduces lengthy development cycles, and removes the inherent risks associated with conventional ASICs.

Why Choose the XC2S200-6FGG509C FPGA

• High Logic Density: 200,000 system gates with 5,292 logic cells for complex digital designs
• Lead-Free Package: RoHS-compliant FGG509 BGA package (Pb-free)
• Fast Speed Grade: -6 speed grade for optimized timing performance
• Cost-Effective: 0.18-micron process technology delivers excellent price-to-performance ratio
• Unlimited Reprogrammability: Field-upgradeable without hardware replacement

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XC2S200-6FGG509C Technical Specifications

Core Architecture Specifications

Memory Configuration

Electrical Characteristics

Package Information

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XC2S200-6FGG509C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG509C features 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB contains four Logic Cells (LCs) with direct feedthrough paths for additional data input lines and local routing. This architecture provides exceptional flexibility for implementing complex digital logic functions.

Input/Output Blocks (IOBs)

The XC2S200-6FGG509C provides versatile I/O capabilities with support for multiple low-voltage I/O standards. The IOBs support various VCCO source voltages for output drive, enabling seamless integration with different system components and interfaces. Eight independent VCCO supplies allow maximum flexibility in multi-voltage designs.

Block RAM Architecture

Block RAM in the XC2S200-6FGG509C is organized in two columns along the vertical edges of the die. Each memory block is a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port. The data widths of the two ports can be configured independently, providing built-in width conversion capabilities.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops (DLLs) are positioned at each corner of the die, providing advanced clock management features including clock deskewing, clock multiplication/division, and phase shifting. The DLLs can operate as clock mirrors for board-level clock deskewing applications.

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XC2S200-6FGG509C Application Areas

Industrial Automation

The XC2S200-6FGG509C excels in industrial control systems, motor drives, and programmable logic controllers (PLCs). Its high-speed performance and robust architecture ensure reliable operation in demanding factory environments.

Telecommunications Equipment

This Spartan-II FPGA is ideal for telecommunications infrastructure including routers, switches, and base station equipment. The extensive I/O capabilities and high-speed processing support complex communication protocols and signal processing requirements.

Digital Signal Processing

With 56 Kbits of block RAM and 5,292 logic cells, the XC2S200-6FGG509C provides ample resources for DSP applications including audio processing, video encoding, and sensor data acquisition systems.

Consumer Electronics

Cost-effective design makes the XC2S200-6FGG509C suitable for high-volume consumer applications including set-top boxes, gaming peripherals, and smart home devices.

Automotive Systems

The commercial temperature range and proven reliability support various automotive applications including infotainment systems, driver assistance features, and body electronics modules.

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XC2S200-6FGG509C Development Tools and Support

Design Software Compatibility

The XC2S200-6FGG509C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Both VHDL and Verilog HDL design flows are supported.

Configuration Options

Multiple configuration modes are available for the XC2S200-6FGG509C:

• Serial configuration mode
• Parallel configuration modes (SelectMAP)
• JTAG boundary scan configuration
• Compatible with serial PROMs and flash memory

Reference Documentation

Comprehensive documentation supports XC2S200-6FGG509C implementation including complete datasheets, application notes, reference designs, and development board schematics.

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XC2S200-6FGG509C Ordering Information

Part Number Breakdown

Related Part Numbers

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XC2S200-6FGG509C Quality and Compliance

Environmental Standards

• RoHS Compliance: Fully compliant with lead-free requirements
• REACH Compliance: Meets EU chemical regulations
• Moisture Sensitivity: MSL rating ensures proper handling

Quality Certifications

• ISO 9001 manufacturing standards
• Comprehensive qualification testing
• Full traceability and documentation

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Conclusion

The XC2S200-6FGG509C represents an excellent choice for engineers requiring a reliable, high-performance FPGA solution in a lead-free package. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities, this Spartan-II FPGA delivers the flexibility and performance needed for diverse applications. The -6 speed grade ensures optimal timing performance, while the FGG509 package provides excellent signal integrity and thermal characteristics. Contact authorized AMD/Xilinx distributors for current pricing, availability, and volume discounts.