The XC2S200-6FGG505C is a high-performance field-programmable gate array (FPGA) from the AMD (formerly Xilinx) Spartan-II family. This programmable logic device delivers 200,000 system gates in a compact 505-ball fine-pitch BGA package, making it an ideal solution for engineers seeking cost-effective programmable logic for industrial, telecommunications, and embedded applications.

Key Features of the XC2S200-6FGG505C Spartan-II FPGA

The XC2S200-6FGG505C offers exceptional value for high-volume applications requiring reliable programmable logic. As part of the Spartan-II family, this device combines advanced 0.18µm process technology with a comprehensive feature set that supports complex digital designs.

High-Density Logic Architecture

The XC2S200-6FGG505C integrates substantial on-chip resources designed for demanding applications:

Speed Grade and Operating Conditions

The “-6” designation indicates this is the fastest speed grade available in the Spartan-II XC2S200 series. The XC2S200-6FGG505C operates exclusively within the commercial temperature range (0°C to +85°C), delivering optimal performance for standard industrial environments.

XC2S200-6FGG505C Technical Specifications

Package Information

The FGG505 package represents a 505-ball fine-pitch ball grid array configuration with Pb-free (RoHS compliant) solder balls. The “G” in the package designation confirms lead-free compliance, meeting modern environmental standards for electronic components.

Package Details

• Package Type: Fine-pitch Ball Grid Array (FBGA)
• Pin Count: 505 balls
• Environmental Compliance: Pb-free / RoHS Compliant
• Mounting Type: Surface Mount (SMD/SMT)

Electrical Characteristics

Memory Resources

The XC2S200-6FGG505C provides versatile on-chip memory options for designers:

• Distributed RAM: 75,264 bits of LUT-based distributed memory configurable as single-port RAM, dual-port RAM, or ROM
• Block RAM: Seven 4,096-bit block RAM modules (56 Kbits total) supporting flexible port widths and true dual-port operation

Applications for the XC2S200-6FGG505C FPGA

The Spartan-II XC2S200-6FGG505C serves as a versatile solution across multiple industry sectors. This Xilinx FPGA is particularly well-suited for:

Telecommunications Equipment

• Network switches and routers
• Protocol conversion bridges
• Digital signal processing front-ends
• SDH/SONET interface circuits

Industrial Automation

• Programmable logic controllers (PLCs)
• Motor drive control systems
• Sensor interface modules
• Real-time monitoring systems

Consumer Electronics

• Set-top boxes
• Digital video processing
• Audio codec implementations
• Display controllers

Embedded Systems

• Microcontroller peripheral expansion
• Custom communication interfaces
• Hardware acceleration engines
• Prototyping and development platforms

Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG505C features 1,176 CLBs arranged in a 28 × 42 array. Each CLB contains four logic cells (LCs), with each LC comprising a 4-input function generator (LUT), carry logic, and a storage element. This architecture enables efficient implementation of both combinatorial and sequential logic functions.

Input/Output Blocks (IOBs)

With up to 284 user-configurable I/O pins, the XC2S200-6FGG505C supports multiple I/O standards including:

• LVTTL / LVCMOS
• PCI (3.3V)
• GTL / GTL+
• SSTL (3.3V and 2.5V)
• HSTL (Class I, II, III, IV)
• CTT

Delay-Locked Loops (DLLs)

Four integrated DLLs positioned at each corner of the die provide advanced clock management capabilities:

• Clock deskewing and phase shifting
• Clock multiplication and division
• Low-jitter clock distribution
• Board-level clock synchronization

Ordering Information Breakdown

Understanding the XC2S200-6FGG505C part number:

Design Considerations

Power Supply Requirements

The XC2S200-6FGG505C requires proper power sequencing and decoupling for reliable operation. Designers should implement:

• Adequate bulk and bypass capacitance on VCCINT (2.5V core) rails
• Separate power planes for VCCO (I/O voltage) based on selected I/O standards
• Proper ground plane design to minimize noise coupling

Configuration Options

The Spartan-II XC2S200-6FGG505C supports multiple configuration modes:

• Serial configuration using Platform Flash PROMs
• Parallel (SelectMAP) configuration for faster programming
• JTAG boundary-scan configuration for in-system programming
• Daisy-chain configuration for multi-device designs

Development Tools

AMD provides comprehensive development support through the ISE Design Suite (legacy) software environment, including:

• Schematic capture and HDL synthesis
• Place-and-route optimization
• Timing analysis and simulation
• In-circuit debugging via ChipScope

Why Choose the XC2S200-6FGG505C?

The XC2S200-6FGG505C offers several compelling advantages for system designers:

1. Cost-Effectiveness: Spartan-II devices deliver excellent price-per-gate ratios for volume production
2. Field Programmability: In-system reconfiguration enables design updates without hardware changes
3. Proven Technology: The Spartan-II family has a long track record of reliability in deployed systems
4. Development Ecosystem: Extensive documentation, reference designs, and community support

Summary

The XC2S200-6FGG505C Spartan-II FPGA from AMD provides a robust, cost-optimized solution for designers requiring 200,000 system gates in a lead-free 505-ball BGA package. With its comprehensive feature set including 5,292 logic cells, 56 Kbits of block RAM, four DLLs, and support for multiple I/O standards, this device delivers the flexibility and performance needed for telecommunications, industrial, consumer, and embedded applications.