The XC2S200-6FGG503C is a high-performance field-programmable gate array (FPGA) from AMD’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional performance for industrial, commercial, and embedded applications requiring robust digital signal processing capabilities.

XC2S200-6FGG503C Overview and Key Features

The XC2S200-6FGG503C combines advanced 0.18-micron CMOS technology with a comprehensive feature set that makes it an ideal solution for engineers seeking cost-effective programmable logic alternatives to mask-programmed ASICs. This Xilinx FPGA eliminates the initial costs, lengthy development cycles, and inherent risks associated with conventional application-specific integrated circuits.

Core Architecture Specifications

The XC2S200-6FGG503C features a powerful architecture built around configurable logic blocks (CLBs) arranged in a 28 × 42 array structure. This configuration provides:

XC2S200-6FGG503C Package Information

Fine-Pitch Ball Grid Array (FGG) Package

The XC2S200-6FGG503C utilizes a fine-pitch ball grid array (FBGA) package that offers excellent thermal performance, superior signal integrity, and compact board space utilization. The “G” designation indicates Pb-free (lead-free) compliance, meeting RoHS environmental standards for electronic components.

Package Characteristics

The FGG package configuration provides reliable solder joint connections for high-volume manufacturing processes. The ball grid array design ensures consistent electrical performance across all operating conditions while maintaining excellent heat dissipation characteristics essential for demanding applications.

XC2S200-6FGG503C Technical Specifications

Memory Architecture

The XC2S200-6FGG503C implements a hierarchical memory structure combining distributed RAM and dedicated block RAM resources:

Distributed RAM Features:

• 75,264 bits of distributed memory
• Configurable as 16-bit lookup tables
• Synchronous and asynchronous operation modes
• Single-port and dual-port configurations

Block RAM Features:

• 56 Kbits of dedicated block RAM
• True dual-port operation capability
• Configurable as RAM, ROM, or FIFO
• Synchronous read and write operations

Clock Management System

The XC2S200-6FGG503C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These clock management resources provide:

• Clock deskew and phase adjustment
• Frequency synthesis capabilities
• Multiple clock domain support
• System clock rates exceeding 200 MHz

Input/Output Architecture

The I/O blocks (IOBs) surrounding the XC2S200-6FGG503C core logic support multiple I/O standards for seamless integration with various system interfaces:

• LVTTL and LVCMOS outputs
• PCI-compliant I/O support
• Programmable slew rate control
• Selectable drive strength options
• Input delay elements for timing adjustment

XC2S200-6FGG503C Speed Grade Information

Understanding the -6 Speed Grade

The “-6” designation indicates the fastest commercial speed grade available for the Spartan-II XC2S200 device. This speed grade delivers optimal performance for timing-critical applications requiring:

• Maximum operating frequencies up to 263 MHz
• Fastest propagation delays
• Enhanced setup and hold time margins
• Superior clock-to-output performance

The -6 speed grade is exclusively available in the commercial temperature range (0°C to +85°C), making it ideal for industrial and commercial applications where maximum performance takes priority.

XC2S200-6FGG503C Applications

Industrial Control Systems

The XC2S200-6FGG503C excels in industrial automation environments where reliable, real-time control logic is essential. Common applications include:

• Programmable logic controllers (PLCs)
• Motor drive control systems
• Process automation equipment
• Factory automation interfaces

Digital Signal Processing

With substantial logic resources and flexible memory architecture, the XC2S200-6FGG503C supports complex DSP algorithms for:

• Audio processing systems
• Video signal conditioning
• Communication signal processing
• Sensor data acquisition

Communications Infrastructure

The high-speed I/O capabilities and clock management features make the XC2S200-6FGG503C suitable for:

• Telecommunications equipment
• Networking hardware
• Protocol conversion bridges
• Serial communication interfaces

Consumer Electronics

The cost-effective nature of the XC2S200-6FGG503C makes it attractive for high-volume consumer applications:

• Display controllers
• Audio/video equipment
• Gaming peripherals
• Set-top boxes

XC2S200-6FGG503C Development Tools and Support

ISE Design Suite Compatibility

The XC2S200-6FGG503C is fully supported by AMD’s ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. The development environment includes:

• HDL design entry (VHDL and Verilog)
• Schematic capture tools
• Synthesis and optimization engines
• Timing analysis and simulation
• Configuration file generation

Programming and Configuration

The XC2S200-6FGG503C supports multiple configuration modes for flexible system integration:

• Serial configuration via Platform Flash PROMs
• JTAG boundary scan programming
• SelectMAP parallel configuration
• Master/slave configuration chains

XC2S200-6FGG503C Ordering Information

Part Number Breakdown

Understanding the XC2S200-6FGG503C part number structure:

• XC2S200: Spartan-II device with 200K system gates
• -6: Speed grade (fastest commercial)
• FGG: Fine-pitch ball grid array, Pb-free
• 503: Package pin count
• C: Commercial temperature range

Quality and Compliance

The XC2S200-6FGG503C meets stringent quality standards:

• RoHS compliant (Pb-free packaging)
• ISO quality certified manufacturing
• Comprehensive reliability testing
• Full documentation and technical support

XC2S200-6FGG503C vs. ASIC Solutions

Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG503C offers significant advantages compared to traditional ASIC solutions:

Reduced Development Risk:

• No NRE (non-recurring engineering) costs
• Shorter time-to-market
• In-field reprogrammability
• Design iteration flexibility

Lower Total Cost of Ownership:

• Eliminated mask costs
• Reduced prototype expenses
• Simplified inventory management
• Extended product lifecycle support

Enhanced Flexibility:

• Field-upgradeable firmware
• Hardware bug fixes without board changes
• Feature additions post-deployment
• Platform reuse across products

Technical Documentation for XC2S200-6FGG503C

Comprehensive technical resources are available for XC2S200-6FGG503C implementation:

• Complete datasheet with DC and AC specifications
• User guides and application notes
• PCB layout recommendations
• Power supply design guidelines
• Configuration and programming guides

Conclusion

The XC2S200-6FGG503C represents an excellent choice for engineers requiring a reliable, high-performance FPGA solution with proven Spartan-II architecture. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources in a Pb-free fine-pitch BGA package, this device delivers the performance, flexibility, and cost-effectiveness demanded by modern electronic design applications.

Whether developing industrial control systems, communications equipment, or consumer electronics, the XC2S200-6FGG503C provides the programmable logic foundation for successful product development with minimal risk and maximum design flexibility.