The XC2S200-6FGG501C is a high-performance Field-Programmable Gate Array (FPGA) from the AMD (formerly Xilinx) Spartan-II family. This powerful programmable logic device delivers exceptional performance at an economical price point, making it an ideal solution for cost-sensitive applications requiring complex digital logic implementation.
XC2S200-6FGG501C Technical Specifications
The XC2S200-6FGG501C represents the flagship device in the Spartan-II product line. Below are the comprehensive technical specifications that make this Xilinx FPGA a preferred choice for demanding digital design applications.
Core Architecture Features
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kb (14 blocks × 4Kb) |
| Delay-Locked Loops (DLLs) |
4 |
XC2S200-6FGG501C Package Information
The XC2S200-6FGG501C utilizes a Fine-Pitch Ball Grid Array (FBGA) package that offers several advantages for high-density PCB designs:
- Package Type: FGG (Fine-Pitch BGA with Pb-Free option)
- Ball Count: 456-ball configuration
- Ball Pitch: 1.0 mm
- Package Dimensions: 23mm × 23mm
- Mounting Type: Surface Mount
Speed Grade and Operating Conditions
The “-6” designation indicates this device features the highest performance speed grade available in the Spartan-II family:
- Speed Grade: -6 (Higher Performance)
- Temperature Range: Commercial (0°C to +85°C)
- Core Voltage (VCCINT): 2.5V
- I/O Voltage (VCCO): 1.5V, 2.5V, or 3.3V (selectable)
- Process Technology: 0.18µm CMOS
XC2S200-6FGG501C Key Features and Benefits
Advanced Configurable Logic Blocks (CLBs)
The XC2S200-6FGG501C employs a sophisticated CLB architecture that forms the foundation of its programmable logic capabilities. Each CLB contains four logic cells (LCs), where each LC includes a 4-input Look-Up Table (LUT), dedicated carry logic, and a storage element functioning as either an edge-triggered flip-flop or level-sensitive latch.
Flexible Input/Output Blocks (IOBs)
This Spartan-II FPGA supports 16 different I/O signaling standards, providing excellent compatibility with modern memory and bus interfaces:
- LVTTL (2-24 mA drive strength)
- LVCMOS2
- PCI (3.3V/5V at 33/66 MHz)
- GTL and GTL+
- HSTL (Class I, III, IV)
- SSTL2 and SSTL3 (Class I and II)
- CTT
- AGP-2X
Integrated Block RAM Memory
The XC2S200-6FGG501C features 14 dedicated block RAM modules, each providing 4,096 bits of dual-port synchronous memory. These block RAM resources support multiple aspect ratios and independent port widths for flexible memory implementation.
Clock Management with Delay-Locked Loops
Four on-chip Delay-Locked Loops (DLLs) provide advanced clock management capabilities:
- Zero propagation delay clock distribution
- Clock multiplication (2×)
- Clock division (÷1.5, ÷2, ÷2.5, ÷3, ÷4, ÷5, ÷8, ÷16)
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- Board-level clock deskewing
XC2S200-6FGG501C Application Areas
The versatility and performance of the XC2S200-6FGG501C make it suitable for numerous application domains:
Telecommunications
- Digital signal processing
- Protocol conversion
- Data encryption/decryption
- Network interface controllers
Industrial Automation
- Motor control systems
- PLC implementations
- Sensor data acquisition
- Factory automation equipment
Consumer Electronics
- Video processing
- Audio signal processing
- Gaming peripherals
- Display controllers
Embedded Systems
- Co-processor implementations
- Custom peripheral interfaces
- Real-time control systems
- Prototype development
XC2S200-6FGG501C Configuration Options
The device supports multiple configuration modes for flexibility in system design:
| Mode |
Description |
Clock Direction |
| Master Serial |
FPGA generates CCLK, reads from PROM |
Output |
| Slave Serial |
External source provides CCLK |
Input |
| Slave Parallel |
Byte-wide configuration (fastest) |
Input |
| Boundary Scan (JTAG) |
IEEE 1149.1 compliant |
N/A |
Configuration Memory Requirements
- Bitstream Size: Approximately 1.34 Mbits
- Compatible PROMs: XC18V01, XC18V02, XC18V04
XC2S200-6FGG501C Development Support
Design Tools
The XC2S200-6FGG501C is fully supported by the Xilinx ISE Design Suite, providing:
- Schematic and HDL design entry (VHDL/Verilog)
- Automatic mapping, placement, and routing
- Timing-driven optimization
- In-circuit debugging capabilities
- Static timing analysis
IP Core Compatibility
Access to an extensive library of pre-verified IP cores accelerates development:
- Arithmetic functions and multipliers
- Memory controllers
- Communication protocols
- DSP building blocks
Why Choose the XC2S200-6FGG501C?
Cost-Effective ASIC Alternative
The XC2S200-6FGG501C eliminates the initial NRE costs, lengthy development cycles, and inherent risks associated with mask-programmed ASICs. Additionally, field programmability enables design upgrades without hardware replacement.
Proven Reliability
Built on mature 0.18µm technology, the Spartan-II family delivers consistent performance and reliability validated across millions of deployed units worldwide.
Seamless Migration Path
The FGG package provides footprint compatibility across the Spartan-II family, enabling easy migration between density options as requirements evolve.
XC2S200-6FGG501C Ordering Information
When ordering the XC2S200-6FGG501C, consider the following specifications encoded in the part number:
- XC2S200: Device type (200K system gates)
- -6: Speed grade (highest performance)
- FGG: Fine-pitch BGA package (Pb-free)
- 501: Pin count variant
- C: Commercial temperature range
Conclusion
The XC2S200-6FGG501C delivers an optimal combination of logic density, memory resources, and I/O flexibility for engineers developing next-generation digital systems. With 200,000 system gates, advanced clock management, and support for 16 I/O standards, this Spartan-II FPGA provides a robust, cost-effective platform for telecommunications, industrial, and embedded applications.
