The XC2S200-6FGG484C is a high-performance Field-Programmable Gate Array (FPGA) from the renowned AMD (formerly Xilinx) Spartan-II family. This versatile programmable logic device delivers exceptional performance, reliability, and cost-effectiveness for demanding digital design applications. With 200,000 system gates, advanced 0.18μm CMOS technology, and a robust 484-pin Fine-Pitch Ball Grid Array (FBGA) package, the XC2S200-6FGG484C stands as a superior alternative to traditional mask-programmed ASICs.
Key Features of the XC2S200-6FGG484C Spartan-II FPGA
The XC2S200-6FGG484C combines cutting-edge architecture with industry-leading specifications, making it ideal for engineers seeking a reliable Xilinx FPGA solution for complex digital designs.
XC2S200-6FGG484C Technical Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG484C |
| FPGA Family |
AMD Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
864 |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18μm CMOS |
| Supply Voltage |
2.5V |
| Package Type |
484-Pin FBGA (Fine-Pitch Ball Grid Array) |
| Speed Grade |
-6 (High Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
Advanced Architecture and Design Resources
The XC2S200-6FGG484C features a sophisticated architecture built on the proven Spartan-II platform. This FPGA provides abundant logic resources for implementing complex digital designs, including digital signal processing, communication protocols, and embedded control systems.
Block RAM and Memory Resources
The device incorporates dedicated block RAM modules that enable efficient on-chip memory implementation. These configurable 4K-bit true dual-port block SelectRAM modules support high-bandwidth data storage and retrieval operations essential for buffering, FIFO implementations, and lookup table applications.
Distributed RAM Capabilities
Beyond block RAM, the XC2S200-6FGG484C offers distributed RAM resources integrated within the Configurable Logic Blocks. Each CLB slice contains 16-bit RAM capability, enabling designers to implement small, fast memories distributed throughout the device fabric for optimal performance.
Delay-Locked Loop (DLL) Technology
Four on-chip Delay-Locked Loops provide advanced clock management capabilities. These DLLs enable clock multiplication, division, and phase shifting, ensuring precise timing control for high-speed digital designs operating at frequencies up to 263 MHz.
XC2S200-6FGG484C Pin Configuration and I/O Standards
High-Density I/O Architecture
The 484-pin FBGA package of the XC2S200-6FGG484C maximizes user I/O availability while maintaining excellent signal integrity and thermal performance. The fine-pitch ball grid array configuration optimizes board space utilization in space-constrained applications.
Supported I/O Standards
The XC2S200-6FGG484C supports multiple I/O standards for seamless integration with diverse system components, including LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, SSTL2, SSTL3, and differential signaling standards.
Speed Grade -6: Optimized Performance Characteristics
The -6 speed grade designation indicates this variant delivers enhanced performance with faster signal propagation delays compared to standard speed options. This makes the XC2S200-6FGG484C particularly suitable for timing-critical applications requiring maximum clock frequencies and minimal latency.
XC2S200-6FGG484C Application Areas
Industrial Automation and Control Systems
The XC2S200-6FGG484C excels in industrial automation applications, providing real-time processing capabilities for motor control, sensor interfaces, and programmable logic controller (PLC) implementations. The device’s reliability and reprogrammability support field upgrades without hardware replacement.
Telecommunications and Networking Equipment
Communication system designers leverage the XC2S200-6FGG484C for protocol conversion, packet processing, and interface bridging applications. The high-speed performance supports demanding networking requirements while maintaining cost efficiency.
Embedded Systems and Consumer Electronics
From video processing to audio applications, the XC2S200-6FGG484C provides the programmable logic foundation for embedded system development. Engineers benefit from the device’s balance of performance, power consumption, and cost.
Prototyping and ASIC Replacement
The XC2S200-6FGG484C serves as an excellent prototyping platform and ASIC replacement solution. Unlike mask-programmed ASICs, this FPGA eliminates initial NRE costs, lengthy development cycles, and inherent risks associated with conventional ASIC approaches.
XC2S200-6FGG484C Development Tools and Software Support
AMD Vivado and ISE Design Suite Compatibility
The XC2S200-6FGG484C is fully supported by AMD’s comprehensive development tools, including the ISE Design Suite. These tools provide complete design entry, synthesis, implementation, and verification capabilities for VHDL and Verilog designs.
Configuration and Programming Options
Multiple configuration options support various deployment scenarios. The device accepts configuration data through serial or parallel interfaces, enabling standalone operation with dedicated configuration PROMs or processor-controlled loading.
XC2S200-6FGG484C Ordering Information
Part Number Breakdown
Understanding the XC2S200-6FGG484C part number structure helps in selecting the correct device variant:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (highest performance tier)
- FGG484: 484-ball Fine-Pitch BGA package
- C: Commercial temperature range (0°C to +85°C)
Availability and Procurement
The XC2S200-6FGG484C is available through authorized AMD distributors and electronic component suppliers worldwide. Volume pricing and lead time information can be obtained from authorized distribution channels.
Why Choose the XC2S200-6FGG484C FPGA?
Cost-Effective ASIC Alternative
The XC2S200-6FGG484C eliminates the substantial NRE costs associated with ASIC development. Design iterations and field upgrades become straightforward, reducing time-to-market and total project costs.
Proven Reliability and Longevity
Built on AMD’s mature Spartan-II architecture with proven 0.18μm technology, the XC2S200-6FGG484C delivers consistent performance and reliability across industrial and commercial applications.
Comprehensive Ecosystem Support
Engineers benefit from extensive documentation, reference designs, IP cores, and community resources. The established Spartan-II ecosystem accelerates development and reduces design risk.
In-System Reprogrammability
Unlimited in-system reprogrammability enables field updates, feature additions, and bug fixes without physical hardware changes—a capability impossible with traditional ASICs.
XC2S200-6FGG484C Technical Documentation
Comprehensive technical resources support XC2S200-6FGG484C implementation:
- DS001 Data Sheet: Complete electrical characteristics, timing specifications, and packaging information
- User Guides: PCB layout recommendations, power supply design, and configuration procedures
- Application Notes: Design best practices and implementation guidelines
- Reference Designs: Proven design templates for common applications
Conclusion
The XC2S200-6FGG484C represents an exceptional choice for engineers requiring a reliable, high-performance FPGA solution. With 200,000 system gates, 5,292 logic cells, and operation up to 263 MHz, this Spartan-II device delivers the performance and flexibility needed for demanding industrial, telecommunications, and embedded applications. The 484-pin FBGA package maximizes I/O density while the -6 speed grade ensures optimal timing performance. Whether replacing ASICs, prototyping new designs, or implementing production systems, the XC2S200-6FGG484C provides the programmable logic foundation for success.
