The XC2S200-6FGG483C is a powerful Field Programmable Gate Array (FPGA) from AMD’s proven Spartan-II family. This versatile programmable logic device delivers exceptional performance for demanding industrial, commercial, and embedded applications. Engineers seeking a cost-effective alternative to mask-programmed ASICs will find the XC2S200-6FGG483C an ideal solution for digital signal processing, control systems, and communication interfaces.
XC2S200-6FGG483C Key Features and Benefits
The XC2S200-6FGG483C combines advanced programmable logic capabilities with robust reliability. This FPGA eliminates the initial costs and lengthy development cycles associated with conventional ASICs. Field-upgradable design allows hardware modifications without physical replacement, reducing time-to-market and enabling rapid prototyping.
High-Density Logic Resources
The XC2S200-6FGG483C offers substantial logic capacity for complex digital designs:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/Os |
284 |
Advanced Memory Architecture
This Xilinx FPGA features a comprehensive memory subsystem designed for high-bandwidth applications:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 blocks) |
| Dual-Port RAM |
Fully synchronous |
Each block RAM cell provides 4,096 bits of fully synchronous dual-ported memory with independent control signals for each port. The flexible aspect ratios support widths from 1 to 16 bits with corresponding depths from 256 to 4,096 locations.
XC2S200-6FGG483C Technical Specifications
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| Process Technology |
0.18μm CMOS |
| Operating Frequency |
Up to 263 MHz |
| Speed Grade |
-6 (Fastest Commercial) |
| Package Type |
FGG483 (Pb-Free Fine-Pitch BGA) |
| Pin Count |
483 Pins |
| Temperature Range |
Commercial (0°C to +85°C) |
Clock Management System
The XC2S200-6FGG483C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide precise clock distribution and deskewing capabilities for synchronous designs. The clock mirror function enables board-level clock synchronization across multiple FPGA devices.
XC2S200-6FGG483C Architecture Overview
Configurable Logic Blocks (CLBs)
The CLB structure forms the primary logic fabric of the XC2S200-6FGG483C. Each CLB contains four logic cells with dedicated 4-input function generators, storage elements, and carry logic. The architecture supports both combinatorial and sequential logic implementations with minimal propagation delays.
Input/Output Blocks (IOBs)
The XC2S200-6FGG483C supports 16 different I/O standards for seamless interfacing with various external devices. The IOB registers function as D-type edge-triggered flip-flops or level-sensitive latches, enabling high-speed data capture and output buffering.
VersaRing Routing Technology
Enhanced routing between the CLB array and IOBs facilitates pin-swapping and pin-locking. This routing technology allows logic redesigns to adapt to existing PCB layouts, minimizing board respins during development iterations.
XC2S200-6FGG483C Application Areas
The XC2S200-6FGG483C excels in numerous demanding applications:
- Digital Signal Processing (DSP): High-speed filtering, FFT implementations, and real-time data processing
- Industrial Control Systems: Motor controllers, PLC interfaces, and automation equipment
- Communication Interfaces: Protocol bridges, data converters, and network processors
- Embedded Computing: Custom peripheral controllers and hardware accelerators
- Prototyping and Development: Rapid validation of ASIC designs before tape-out
- Medical Electronics: Signal conditioning and data acquisition systems
- Automotive Systems: Sensor interfaces and control modules
XC2S200-6FGG483C Development Tools
Engineers can design for the XC2S200-6FGG483C using industry-standard development environments. The ISE Design Suite provides comprehensive synthesis, implementation, and verification capabilities. JTAG boundary scan support enables in-system programming and debugging through standard test access ports.
XC2S200-6FGG483C Package Information
The FGG483 package utilizes a fine-pitch ball grid array format with Pb-free (RoHS compliant) solder balls. The “G” designation in the ordering code indicates lead-free packaging options for environmentally conscious manufacturing processes.
Package Dimensions
| Parameter |
Value |
| Ball Pitch |
1.0 mm |
| Package Body |
23 × 23 mm |
| Ball Count |
483 |
| Mounting |
Surface Mount (SMT) |
Why Choose the XC2S200-6FGG483C FPGA
The XC2S200-6FGG483C represents an optimal balance between performance, logic density, and cost-effectiveness. The -6 speed grade delivers the fastest timing performance available in the commercial temperature range, making it suitable for demanding real-time applications.
Field programmability eliminates NRE (Non-Recurring Engineering) costs associated with traditional ASIC development. Design changes can be implemented through simple firmware updates, extending product lifecycles and enabling rapid response to market requirements.
XC2S200-6FGG483C Ordering Information
| Part Number |
Description |
| XC2S200-6FGG483C |
Spartan-II FPGA, 200K Gates, -6 Speed, FGG483 Package, Commercial |
XC2S200-6FGG483C Related Resources
For comprehensive technical documentation, reference designs, and application notes, consult the official Spartan-II FPGA Family Data Sheet (DS001). This resource provides detailed pinout tables, timing specifications, and design guidelines for successful implementation.