Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG477C Spartan-II FPGA: Complete Technical Specifications and Features

Product Details

The XC2S200-6FGG477C is a high-performance Field Programmable Gate Array (FPGA) from the AMD/Xilinx Spartan-II family. This 200,000 system gate FPGA delivers exceptional programmable logic capabilities for industrial, telecommunications, and embedded system applications. Designed with advanced 0.18µm CMOS technology, the XC2S200-6FGG477C offers engineers a cost-effective alternative to mask-programmed ASICs with unlimited reprogrammability.

XC2S200-6FGG477C Key Features and Benefits

The XC2S200-6FGG477C combines robust architecture with flexible I/O capabilities, making it an ideal choice for complex digital designs requiring high-speed performance and reliability.

High-Capacity Programmable Logic Resources

The XC2S200-6FGG477C features 5,292 logic cells organized in a 28×42 CLB (Configurable Logic Block) array, providing 1,176 total CLBs for implementing sophisticated digital circuits. This generous logic capacity supports complex designs including digital signal processing, protocol conversion, and custom controller applications.

Advanced Memory Architecture

This Xilinx FPGA integrates a dual-memory architecture optimized for diverse application requirements:

  • Block RAM: 56 Kbits of dedicated block RAM organized in 4-Kbit configurable modules
  • Distributed RAM: 75,264 bits of LUT-based distributed RAM for local data storage
  • Total Memory Capacity: Over 131,000 bits of on-chip memory resources

High-Speed -6 Speed Grade Performance

The -6 speed grade designation indicates optimized timing characteristics for high-frequency applications. The XC2S200-6FGG477C supports system clock frequencies up to 263 MHz, enabling real-time signal processing and high-throughput data handling capabilities.

XC2S200-6FGG477C Technical Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Block RAM 56 Kbits
Distributed RAM 75,264 bits
DLLs 4
Core Voltage 2.5V
I/O Voltage 1.5V / 2.5V / 3.3V
Technology 0.18µm CMOS
Speed Grade -6
Package Type FGG (Fine-Pitch BGA, Pb-Free)
Temperature Range Commercial (0°C to +85°C)

XC2S200-6FGG477C Package Information

FGG477 Fine-Pitch Ball Grid Array Package

The FGG477 package offers a high-density BGA configuration with Pb-free (RoHS compliant) ball finish. The “G” designator in FGG indicates lead-free solder balls, making the XC2S200-6FGG477C fully compliant with environmental regulations for electronics manufacturing.

Package Characteristics

  • Package Style: Fine-Pitch Ball Grid Array (FBGA)
  • Pin Count: 477 balls
  • Ball Pitch: 1.0mm
  • RoHS Compliance: Yes (Pb-Free)
  • Moisture Sensitivity Level: MSL-3

XC2S200-6FGG477C I/O Capabilities

Versatile I/O Standards Support

The XC2S200-6FGG477C supports 16 different I/O signaling standards, providing exceptional interface flexibility for mixed-voltage system designs:

  • LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
  • PCI (3.3V, 33 MHz and 66 MHz compliant)
  • GTL and GTL+
  • HSTL Class I, II, III, IV
  • SSTL2 Class I and II
  • SSTL3 Class I and II
  • CTT
  • AGP-2X

Programmable I/O Features

Each I/O block provides programmable slew rate control, drive strength adjustment, and optional weak pull-up/pull-down resistors. The zero hold time architecture simplifies system timing constraints and improves design reliability.

XC2S200-6FGG477C Clock Management

Four Dedicated Delay-Locked Loops (DLLs)

The XC2S200-6FGG477C integrates four DLLs positioned at each corner of the die for advanced clock management:

  • Clock deskewing and phase shifting
  • Clock multiplication and division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×)
  • Duty cycle correction
  • Low-jitter clock distribution

Global Clock Distribution Network

Four primary low-skew global clock networks ensure precise clock delivery across the entire device, supporting multi-clock domain designs and complex timing requirements.

XC2S200-6FGG477C Applications

The XC2S200-6FGG477C excels in numerous industrial and commercial applications:

Telecommunications and Networking

  • Protocol bridging and conversion
  • Network interface cards
  • Base station controllers
  • VoIP gateway equipment

Industrial Automation

  • Motor control systems
  • Programmable logic controllers
  • Process automation
  • Machine vision preprocessing

Consumer Electronics

  • Digital video processing
  • Audio signal processing
  • Display controllers
  • Gaming peripherals

Medical and Scientific Instruments

  • Data acquisition systems
  • Signal conditioning
  • Medical imaging preprocessing
  • Laboratory automation

XC2S200-6FGG477C Configuration Options

Supported Configuration Modes

The XC2S200-6FGG477C supports multiple configuration methods for maximum design flexibility:

  • Master Serial Mode: Uses external PROM for standalone operation
  • Slave Serial Mode: Configuration from external processor or controller
  • Slave Parallel Mode: 8-bit parallel configuration interface
  • JTAG/Boundary Scan Mode: IEEE 1149.1 compliant configuration

Configuration Data Size

The XC2S200 requires approximately 1,335,840 bits (167 KB) of configuration data, compatible with standard Xilinx Platform Flash and third-party configuration memories.

XC2S200-6FGG477C Development Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG477C is fully supported by the Xilinx ISE Design Suite, providing comprehensive tools for:

  • HDL synthesis (VHDL and Verilog)
  • Schematic capture
  • Constraint-driven place and route
  • Static timing analysis
  • Simulation and verification

Design Resources

Engineers can access extensive documentation including datasheets, user guides, application notes, and reference designs to accelerate development timelines.

Why Choose XC2S200-6FGG477C for Your Design

Cost-Effective ASIC Alternative

The XC2S200-6FGG477C eliminates the high NRE (Non-Recurring Engineering) costs associated with custom ASIC development while maintaining competitive per-unit pricing for volume production.

Field Upgradability

Unlike fixed-function ASICs, the XC2S200-6FGG477C enables in-system reprogramming for feature additions, bug fixes, and design optimizations without hardware changes.

Reduced Time-to-Market

Programmable logic technology accelerates product development cycles, enabling faster prototyping and iterative design improvements compared to traditional ASIC flows.

Long-Term Availability

The Spartan-II family benefits from established manufacturing processes and broad industry adoption, ensuring reliable supply chain availability for production programs.

XC2S200-6FGG477C Ordering Information

Part Number Breakdown

XC2S200-6FGG477C

Code Description
XC2S200 Spartan-II, 200K system gates
-6 Speed grade (highest performance)
FG Fine-pitch BGA package
G Pb-free (RoHS compliant)
477 Pin count
C Commercial temperature (0°C to +85°C)

Conclusion

The XC2S200-6FGG477C Spartan-II FPGA delivers an optimal balance of performance, capacity, and cost-effectiveness for demanding programmable logic applications. With 200,000 system gates, comprehensive memory resources, flexible I/O standards, and advanced clock management features, this device enables engineers to implement complex digital designs efficiently. Whether you’re developing telecommunications equipment, industrial controllers, or embedded systems, the XC2S200-6FGG477C provides the programmable logic foundation for success.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.