The XC2S200-6FGG476C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, now part of AMD’s portfolio. This programmable logic device delivers exceptional flexibility for industrial, telecommunications, and embedded system applications. Engineers seeking a cost-effective alternative to mask-programmed ASICs will find this device ideal for rapid prototyping and production deployment.
XC2S200-6FGG476C Key Features and Specifications
The XC2S200-6FGG476C combines powerful digital processing capabilities with versatile I/O options, making it suitable for a wide range of applications.
Core Architecture Specifications
The Spartan-II XC2S200-6FGG476C features a robust internal architecture built on proven 0.18µm CMOS technology. The device operates at a 2.5V core voltage, ensuring compatibility with modern low-power designs.
| Parameter |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
| Maximum User I/O |
284 |
Package Information for 476-Pin Fine Pitch BGA
The FGG476 package designation indicates a 476-ball Fine Pitch Ball Grid Array with lead-free (Pb-free) construction. The “G” in FGG denotes RoHS-compliant, environmentally friendly packaging. This BGA format provides excellent thermal dissipation and reliable solder joint connections for high-density PCB designs.
Speed Grade and Operating Conditions
The “-6” speed grade represents the fastest available option for Spartan-II devices, offering superior timing performance for demanding applications. This speed grade is exclusively available in the Commercial temperature range (0°C to +85°C), indicated by the “C” suffix in the part number.
Spartan-II FPGA Architecture Overview
Understanding the XC2S200-6FGG476C architecture helps engineers maximize design efficiency and performance.
Configurable Logic Blocks (CLBs)
The heart of the XC2S200-6FGG476C consists of 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB contains four logic cells with 4-input Look-Up Tables (LUTs), carry logic, and storage elements. The LUTs can function as logic generators, 16×1 synchronous RAM, or 16-bit shift registers.
Input/Output Blocks (IOBs)
The XC2S200-6FGG476C provides up to 284 user-programmable I/O pins supporting 16 different I/O standards. The IOBs feature three registers per pin for input, output, and tri-state control, enabling efficient interface designs. Supported standards include LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, SSTL, and differential signaling options.
Block RAM Memory Resources
Two columns of dedicated block RAM provide 56 Kbits of high-speed dual-port memory. Each 4,096-bit RAM block operates as fully synchronous dual-port memory with independent read and write ports. Configurable data widths ranging from 1×4096 to 16×256 accommodate various memory architectures.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops positioned at each corner of the die provide advanced clock management capabilities. The DLLs eliminate clock distribution delays, multiply or divide clock frequencies, and enable board-level clock deskewing across multiple devices.
XC2S200-6FGG476C Applications and Use Cases
The versatility of this Xilinx FPGA makes it suitable for numerous industrial and commercial applications.
Telecommunications and Networking
The XC2S200-6FGG476C excels in telecommunications infrastructure including base stations, routers, switches, and network interface controllers. High-speed I/O capabilities and substantial logic resources enable efficient protocol implementation and data path processing.
Industrial Automation and Control
Manufacturing automation systems benefit from the device’s programmability and reliability. Motor control, process automation, and machinery control applications leverage the FPGA’s real-time processing capabilities and flexible I/O configuration.
Consumer Electronics and Multimedia
Video processing, display controllers, and audio systems utilize the XC2S200-6FGG476C for custom digital signal processing. The block RAM resources efficiently buffer streaming data, while the configurable logic implements compression and decompression algorithms.
Medical and Scientific Instrumentation
Diagnostic equipment, patient monitoring systems, and laboratory instruments require the precision and reliability that FPGAs deliver. The device’s reconfigurability enables field updates without hardware modifications.
Configuration Modes and Programming Options
The XC2S200-6FGG476C supports multiple configuration modes for maximum design flexibility.
Serial and Parallel Configuration
Master Serial mode uses external configuration PROMs with the FPGA generating the configuration clock. Slave Serial and Slave Parallel modes accept configuration data from external processors or systems. The 1,335,840-bit configuration bitstream loads quickly for minimal startup delay.
Boundary Scan Support
Full IEEE 1149.1 JTAG boundary scan compatibility enables in-system testing and configuration. Engineers can verify board connections and configure devices during production testing.
In-System Reconfiguration
The FPGA supports unlimited reprogramming cycles, enabling design iterations without physical modifications. Field upgrades become possible through remote reconfiguration over network connections.
Design Tools and Development Support
Xilinx ISE Design Suite provides comprehensive development tools for the XC2S200-6FGG476C. The toolchain supports VHDL, Verilog HDL, and schematic design entry methods. Integrated synthesis, place-and-route, and timing analysis streamline the development process from concept to production.
Why Choose XC2S200-6FGG476C for Your Project
The XC2S200-6FGG476C offers compelling advantages over ASICs and competing programmable devices.
Cost-Effective Development
Eliminating ASIC NRE charges and lengthy fabrication cycles reduces time-to-market and development costs. The FPGA approach allows design verification before committing to high-volume production.
Design Flexibility
Unlimited reprogrammability enables design corrections, feature additions, and algorithm optimizations throughout the product lifecycle. Hardware upgrades become software updates.
Proven Reliability
The Spartan-II family has demonstrated long-term reliability across thousands of applications worldwide. Extensive documentation, application notes, and community support accelerate development.
XC2S200-6FGG476C Part Number Breakdown
Understanding the full part number ensures correct ordering:
- XC2S200: Spartan-II device with 200K system gates
- -6: Fastest speed grade (Commercial temperature only)
- FG: Fine-pitch Ball Grid Array package
- G: Pb-free (lead-free) RoHS-compliant
- 476: 476 balls/pins
- C: Commercial temperature range (0°C to +85°C)
Technical Documentation and Resources
Complete technical specifications are available in the Spartan-II FPGA Family Data Sheet (DS001), which includes detailed timing parameters, electrical characteristics, pinout information, and application guidelines.
Conclusion
The XC2S200-6FGG476C Spartan-II FPGA delivers the perfect balance of performance, flexibility, and cost-effectiveness for medium-density programmable logic applications. With 200,000 system gates, 56K bits of block RAM, and comprehensive I/O capabilities in a lead-free 476-pin BGA package, this device serves demanding applications across telecommunications, industrial, consumer, and scientific markets. Engineers benefit from the proven Spartan-II architecture, extensive design tool support, and the reliability that comes from decades of field-proven performance.
