The XC2S200-6FGG472C is a powerful Field Programmable Gate Array from the Xilinx FPGA Spartan-II family. This versatile programmable logic device delivers exceptional performance for digital signal processing, telecommunications, and embedded system applications. With 200,000 system gates and advanced architecture, the XC2S200-6FGG472C provides engineers with a cost-effective alternative to custom ASIC designs.

XC2S200-6FGG472C Key Features and Benefits

The XC2S200-6FGG472C offers outstanding flexibility for complex digital designs. This Spartan-II FPGA features a programmable architecture that allows rapid prototyping and in-field upgrades without hardware replacement. Engineers selecting the XC2S200-6FGG472C gain access to high-density logic resources combined with embedded memory blocks for data-intensive applications.

Logic Resources and System Gates

The XC2S200-6FGG472C provides 200,000 system gates, making it suitable for medium to high-complexity designs. The device contains 5,292 logic cells organized in a 28 x 42 Configurable Logic Block array, totaling 1,176 CLBs. Each CLB contains look-up tables, flip-flops, and multiplexers that enable flexible implementation of combinational and sequential logic functions.

Memory Architecture

The XC2S200-6FGG472C includes dual memory systems for optimal design flexibility. The distributed RAM provides 75,264 bits of storage integrated within the CLB fabric, enabling fast local data storage. Additionally, the dedicated Block RAM delivers 56 Kbits (7 blocks of 4,096 bits each) of synchronous dual-port memory for larger data buffers and FIFO implementations.

XC2S200-6FGG472C Technical Specifications

XC2S200-6FGG472C Package Information

The FGG472 package designation indicates a Fine-Pitch Ball Grid Array with 472 solder balls. The “G” in FGG denotes Pb-free (lead-free) packaging, ensuring compliance with RoHS environmental directives. This BGA package offers excellent thermal dissipation and reliable electrical connections for high-speed applications.

Part Number Breakdown

Understanding the XC2S200-6FGG472C part number helps engineers verify correct component selection:

• XC2S200: Spartan-II device with 200K system gates
• -6: Speed grade (-6 is the fastest available)
• FG: Fine-Pitch Ball Grid Array package
• G: Pb-free (lead-free) packaging option
• 472: Total ball count
• C: Commercial temperature range (0°C to +85°C)

Configurable Logic Block Architecture

The XC2S200-6FGG472C CLB architecture provides the foundation for implementing custom digital logic. Each CLB contains two slices, with each slice featuring two 4-input look-up tables (LUTs), two storage elements, and dedicated carry logic. This architecture supports efficient implementation of arithmetic functions, state machines, and data path elements.

Look-Up Tables and Registers

The 4-input LUTs in the XC2S200-6FGG472C can implement any 4-input Boolean function or serve as 16×1 distributed RAM elements. The storage elements can operate as edge-triggered D-type flip-flops or level-sensitive latches, providing flexibility for various clocking schemes.

Input/Output Block Capabilities

The XC2S200-6FGG472C Input/Output Blocks surround the CLB array and provide programmable interfacing to external components. Each IOB supports multiple I/O standards, enabling direct connection to various logic families without external level shifters.

Supported I/O Standards

The XC2S200-6FGG472C supports these electrical interface standards:

• LVTTL (Low Voltage TTL)
• LVCMOS (Low Voltage CMOS)
• PCI (Peripheral Component Interconnect)
• GTL+ (Gunning Transceiver Logic Plus)
• SSTL (Stub Series Terminated Logic)
• CTT (Center Tap Terminated)
• AGP (Accelerated Graphics Port)

SelectI/O Technology

The SelectI/O technology in the XC2S200-6FGG472C enables programmable drive strength and slew rate control. Engineers can optimize signal integrity by adjusting output characteristics to match transmission line impedances and reduce electromagnetic interference.

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG472C includes four Delay-Locked Loops positioned at each corner of the die. These DLLs provide clock management functions essential for high-performance synchronous designs.

Clock Management Capabilities

The DLLs in the XC2S200-6FGG472C offer these clock management features:

• Clock multiplication and division
• Phase shifting in 90-degree increments
• Duty cycle correction
• Clock delay compensation
• Jitter reduction

XC2S200-6FGG472C Application Areas

The XC2S200-6FGG472C serves diverse application segments requiring programmable logic solutions with substantial resources and fast performance.

Telecommunications Equipment

The XC2S200-6FGG472C excels in telecommunications infrastructure, including base station controllers, network switches, and protocol converters. The Block RAM supports packet buffering, while the high-speed logic enables real-time data processing.

Industrial Automation Systems

Manufacturing environments benefit from the XC2S200-6FGG472C in motor controllers, programmable logic controllers, and sensor interface modules. The device’s reprogrammability allows production line equipment updates without hardware modifications.

Consumer Electronics

The XC2S200-6FGG472C finds applications in set-top boxes, digital cameras, and audio processing equipment. The cost-effective pricing combined with adequate logic density makes it attractive for consumer product development.

Medical Instrumentation

Medical device manufacturers utilize the XC2S200-6FGG472C in patient monitoring systems, diagnostic imaging equipment, and laboratory instruments. The device’s reliability and available industrial temperature variants support demanding medical applications.

Configuration and Programming

The XC2S200-6FGG472C uses SRAM-based configuration technology, requiring configuration data loading at each power-up. This approach enables unlimited reprogramming throughout the device’s operational lifetime.

Configuration Modes

The XC2S200-6FGG472C supports multiple configuration modes:

• Master Serial: FPGA controls external serial PROM
• Slave Serial: External processor loads configuration data
• Master Parallel: FPGA reads parallel configuration memory
• Slave Parallel: Fast configuration via parallel interface
• JTAG/Boundary Scan: IEEE 1149.1 compliant programming

Development Tools

Xilinx ISE Design Suite provides comprehensive development support for the XC2S200-6FGG472C. The toolchain includes schematic capture, HDL synthesis, place-and-route, timing analysis, and configuration file generation.

Design Considerations for XC2S200-6FGG472C

Successful XC2S200-6FGG472C implementations require attention to power supply design, signal integrity, and thermal management.

Power Supply Requirements

The XC2S200-6FGG472C requires a 2.5V core supply with tight regulation (±5%). I/O bank power supplies can range from 1.5V to 3.3V depending on selected I/O standards. Proper decoupling with multiple capacitor values ensures stable operation.

Thermal Considerations

The 472-ball BGA package provides good thermal conductivity to the PCB. For designs approaching maximum power dissipation, consider thermal vias under the package and adequate copper area on power planes for heat spreading.

Why Choose XC2S200-6FGG472C

The XC2S200-6FGG472C delivers compelling advantages for programmable logic designs:

• High Logic Density: 200,000 system gates handle complex implementations
• Fast Speed Grade: -6 rating ensures maximum performance
• Embedded Memory: Combined distributed and block RAM options
• Flexible I/O: Multiple interface standards supported
• Cost-Effective: ASIC alternative without NRE costs
• Field Upgradeable: In-system reprogramming capability
• Environmental Compliance: Pb-free packaging meets RoHS requirements

Ordering Information

When ordering the XC2S200-6FGG472C, verify the complete part number to ensure correct speed grade, package type, and temperature range. Contact authorized distributors for current pricing, lead times, and volume discount availability.

The XC2S200-6FGG472C represents an excellent choice for engineers seeking a balance of performance, resources, and cost in their FPGA-based designs. Its proven Spartan-II architecture combined with comprehensive development tool support ensures successful project outcomes across diverse application domains.