The XC2S200-6FGG469C is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx) belonging to the renowned Spartan-II FPGA family. This commercial-grade programmable logic device delivers exceptional performance, flexible I/O capabilities, and cost-effective solutions for embedded systems, telecommunications, and industrial automation applications.
XC2S200-6FGG469C Key Features and Specifications
The XC2S200-6FGG469C combines powerful logic resources with advanced architectural features designed to meet demanding digital design requirements.
Core Architecture Specifications
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Operating Voltage |
2.5V |
| Speed Grade |
-6 (Fastest) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Package Type |
469-Ball Fine Pitch BGA (FGG469) |
| Process Technology |
0.18µm |
| Maximum Frequency |
Up to 263 MHz |
Understanding the Part Number Breakdown
The XC2S200-6FGG469C part number provides essential information about the device configuration:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade designation (fastest available for commercial temperature)
- FGG: Fine Pitch Ball Grid Array package with Pb-free option (RoHS compliant)
- 469: Number of package balls
- C: Commercial temperature range (0°C to +85°C)
XC2S200-6FGG469C Performance Advantages
The Spartan-II XC2S200-6FGG469C offers significant advantages for modern electronic designs requiring programmable logic solutions.
High-Speed Signal Processing
With support for frequencies up to 263 MHz and the -6 speed grade designation, the XC2S200-6FGG469C excels in applications requiring fast data throughput. The device architecture includes four Delay-Locked Loops (DLLs) positioned at each corner of the die, enabling precise clock management and low-skew clock distribution across the entire FPGA fabric.
Flexible Memory Architecture
The XC2S200-6FGG469C provides a dual-memory architecture combining distributed RAM (75,264 bits) with dedicated Block RAM (56 Kbits). This configuration allows designers to implement various memory structures including FIFOs, dual-port RAMs, and lookup tables without consuming external memory resources.
Rich I/O Capabilities
Offering up to 284 user-programmable I/O pins, the XC2S200-6FGG469C supports multiple I/O standards for seamless integration with diverse system components. The Input/Output Blocks (IOBs) surrounding the programmable core provide flexible interfacing options for different voltage levels and signaling standards.
XC2S200-6FGG469C Applications
The versatility of the XC2S200-6FGG469C makes it suitable for numerous applications across multiple industries.
Telecommunications Equipment
The high logic density and fast clock speeds make this FPGA ideal for baseband processing, protocol conversion, and data routing in telecommunications systems. Engineers frequently deploy the XC2S200-6FGG469C in wireless communication baseband processors for 4G systems and IoT devices.
Industrial Automation and Control
Factory automation systems benefit from the XC2S200-6FGG469C’s reliable performance and extensive I/O options. The device enables real-time control algorithms, sensor interfacing, and motor drive applications with deterministic timing requirements.
Embedded Vision Systems
High-speed image processing applications leverage the parallel processing capabilities of the XC2S200-6FGG469C. The combination of logic cells and embedded memory supports efficient implementation of image filtering, edge detection, and video preprocessing algorithms.
Data Acquisition Systems
The XC2S200-6FGG469C excels in high-speed data acquisition platforms where real-time processing of multiple data channels is essential. Applications include radar systems, medical imaging equipment, and scientific instrumentation.
XC2S200-6FGG469C vs Mask-Programmed ASICs
The Spartan-II XC2S200-6FGG469C represents a superior alternative to traditional mask-programmed Application-Specific Integrated Circuits (ASICs) for many design scenarios.
Cost and Development Benefits
Unlike ASICs requiring significant upfront NRE (Non-Recurring Engineering) costs and lengthy mask fabrication cycles, the XC2S200-6FGG469C enables immediate prototyping and production deployment. Design modifications require only firmware updates rather than expensive mask revisions.
Field Upgradability
The XC2S200-6FGG469C’s programmability permits design upgrades and bug fixes in deployed systems without hardware replacement—a capability impossible with traditional ASICs. This feature significantly reduces long-term maintenance costs and enables rapid response to evolving requirements.
Design Resources and Development Tools
AMD provides comprehensive support resources for XC2S200-6FGG469C development.
Software Tools
The ISE Design Suite supports Spartan-II development with synthesis, implementation, and simulation capabilities. Designers can leverage schematic entry, HDL-based design flows (VHDL/Verilog), and third-party EDA tool integration.
Documentation and Technical Support
Complete documentation packages include detailed datasheets, user guides, application notes, and PCB layout recommendations. The DS001 datasheet provides comprehensive electrical characteristics, timing specifications, and packaging information essential for successful design integration.
Configuration Solutions
The XC2S200-6FGG469C supports multiple configuration modes including Master Serial, Slave Serial, Master Parallel, and JTAG boundary scan. Compatible configuration PROMs and flash memory devices enable standalone operation for production deployment.
Where to Buy XC2S200-6FGG469C
For engineers and procurement specialists seeking reliable sources for the XC2S200-6FGG469C FPGA, authorized distributors and specialized component suppliers offer competitive pricing and technical support. When sourcing programmable logic components, working with reputable suppliers ensures authentic products with full manufacturer traceability.
For a comprehensive selection of Xilinx FPGA components including Spartan-II family devices, explore trusted electronic component distributors specializing in programmable logic solutions.
XC2S200-6FGG469C Quality and Compliance
The XC2S200-6FGG469C meets industry standards for electronic component quality and environmental compliance.
Environmental Standards
The “G” designation in the FGG469 package code indicates Pb-free (lead-free) packaging compliant with RoHS (Restriction of Hazardous Substances) regulations. This ensures environmentally responsible manufacturing practices suitable for global markets with strict environmental requirements.
Quality Certifications
AMD/Xilinx maintains ISO 9001 quality management systems ensuring consistent product quality and reliability. Components undergo rigorous testing and quality control procedures before shipment.
Conclusion
The XC2S200-6FGG469C Spartan-II FPGA delivers an optimal combination of performance, flexibility, and cost-effectiveness for digital design applications. With 200,000 system gates, 5,292 logic cells, and speeds up to 263 MHz, this programmable logic device serves diverse markets from telecommunications to industrial automation. The -6 speed grade and commercial temperature rating make it particularly suitable for high-performance applications requiring reliable operation under standard environmental conditions.
Whether upgrading existing designs or developing new products, the XC2S200-6FGG469C provides the programmable logic resources needed to bring innovative electronic systems to market efficiently.
