The XC2S200-6FGG467C is a high-performance Field Programmable Gate Array (FPGA) from the renowned AMD/Xilinx Spartan-II family. This versatile programmable logic device delivers 200,000 system gates, 5,292 logic cells, and operates at frequencies up to 263MHz. Designed for demanding digital applications, the XC2S200-6FGG467C offers an excellent balance of performance, flexibility, and cost-effectiveness for engineers and system designers worldwide.
Whether you’re developing telecommunications equipment, industrial automation systems, or embedded control solutions, the XC2S200-6FGG467C provides the robust architecture needed for complex digital designs. Explore our complete range of Xilinx FPGA solutions for your next project.
XC2S200-6FGG467C Key Features and Benefits
The Spartan-II XC2S200-6FGG467C stands out as a superior alternative to traditional mask-programmed ASICs. This FPGA eliminates the high initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC designs. Furthermore, the XC2S200-6FGG467C’s in-field programmability enables design upgrades without hardware replacement—a flexibility impossible with ASICs.
Why Choose the XC2S200-6FGG467C FPGA?
- Cost-Effective Development: Reduce NRE (Non-Recurring Engineering) costs significantly
- Rapid Time-to-Market: Accelerate product development cycles
- Field-Upgradable: Update firmware without physical hardware changes
- Proven Reliability: Built on mature 0.18µm CMOS technology
- RoHS Compliant: Lead-free (Pb-free) packaging for environmental compliance
XC2S200-6FGG467C Technical Specifications
Core Architecture
| Part Number |
XC2S200-6FGG467C |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Memory Resources
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Total On-Chip Memory |
131,264 bits |
Performance and Electrical Characteristics
| Specification |
Value |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18µm CMOS |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V to 3.3V (Multi-standard) |
| Speed Grade |
-6 (High Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
Package Information
| Package Parameter |
Details |
| Package Type |
FGG467 (Fine-Pitch Ball Grid Array) |
| Pin Count |
467 Balls |
| Lead-Free |
Yes (Pb-free, RoHS Compliant) |
| Package Dimensions |
27mm × 27mm |
| Ball Pitch |
1.0mm |
XC2S200-6FGG467C Part Number Decoder
Understanding the XC2S200-6FGG467C part number helps identify its exact specifications:
| Code Segment |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade 6 (Fastest) |
| FG |
Fine-Pitch BGA Package |
| G |
Lead-Free (Pb-Free) |
| 467 |
467-Ball Package |
| C |
Commercial Temperature Range |
Spartan-II FPGA Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG467C features 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, providing the foundation for implementing complex combinatorial and sequential logic functions. The CLB architecture supports both registered and combinatorial outputs, enabling efficient design implementation.
Input/Output Blocks (IOBs)
With 284 user-programmable I/O pins, the XC2S200-6FGG467C supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, and SSTL. This multi-standard I/O capability ensures seamless integration with various system components and communication protocols.
Delay-Locked Loops (DLLs)
The device incorporates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs provide precise clock management, clock multiplication, clock division, and phase shifting capabilities essential for high-speed digital designs.
Block RAM
The XC2S200-6FGG467C includes 56 Kbits of dedicated Block RAM, organized as dual-port memory blocks. This high-speed memory resource is ideal for implementing FIFOs, buffers, register files, and small lookup tables without consuming valuable logic resources.
XC2S200-6FGG467C Application Areas
Telecommunications and Networking
The XC2S200-6FGG467C excels in telecommunications applications, including protocol conversion, data encryption/decryption, channel coding, and interface bridging. Its high-speed performance and abundant I/O resources make it ideal for network switches, routers, and communication gateways.
Industrial Automation and Control
Engineers frequently deploy this FPGA in industrial automation systems for motor control, sensor interfaces, real-time data processing, and machine vision applications. The device’s reliability and wide operating voltage range ensure stable operation in demanding industrial environments.
Consumer Electronics
From digital video processing to audio systems, the XC2S200-6FGG467C provides the processing power needed for consumer electronics applications. Its cost-effectiveness makes it attractive for high-volume consumer products requiring custom digital logic.
Embedded Systems and IoT
The Spartan-II architecture serves embedded applications requiring custom peripherals, protocol handlers, or specialized processing engines. System designers leverage the FPGA’s flexibility to create optimized solutions for Internet of Things (IoT) devices and embedded controllers.
Prototyping and Development
Before committing to full ASIC development, engineers use the XC2S200-6FGG467C for rapid prototyping and design verification. The FPGA’s reprogrammability allows multiple design iterations without manufacturing new silicon.
Development Tools and Software Support
Xilinx ISE Design Suite
The XC2S200-6FGG467C receives full support from the Xilinx ISE Design Suite. This comprehensive development environment provides design entry (schematic and HDL), synthesis, implementation, simulation, and programming capabilities. Engineers can develop using VHDL, Verilog, or schematic capture methodologies.
Configuration Options
The device supports multiple configuration modes including Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG (Boundary Scan). This flexibility allows system designers to choose the optimal configuration approach for their application requirements.
IP Core Library
Xilinx provides an extensive library of pre-verified IP cores compatible with the Spartan-II family. These cores accelerate development by providing ready-to-use functional blocks for common applications including processors, memory controllers, communication interfaces, and DSP functions.
XC2S200-6FGG467C Ordering Information
When ordering the XC2S200-6FGG467C, ensure you specify the complete part number to receive the correct device configuration:
Full Part Number: XC2S200-6FGG467C
- XC2S200: Spartan-II, 200K gates
- -6: Speed grade -6 (Commercial only)
- FGG467: 467-ball fine-pitch BGA, Pb-free
- C: Commercial temperature (0°C to +85°C)
Related Spartan-II FPGA Devices
| Part Number |
Gates |
Logic Cells |
Max I/O |
Package |
| XC2S100-6FGG256C |
100K |
2,700 |
176 |
256 BGA |
| XC2S150-6FGG256C |
150K |
3,888 |
260 |
256 BGA |
| XC2S200-6FGG467C |
200K |
5,292 |
284 |
467 BGA |
Quality and Compliance Standards
The XC2S200-6FGG467C meets stringent quality and environmental standards:
- RoHS Compliant: Fully compliant with Restriction of Hazardous Substances directive
- Lead-Free (Pb-Free): Environmentally responsible manufacturing
- MSL Rating: Moisture Sensitivity Level per J-STD-020
- Qualification: Qualified per Xilinx standard qualification procedures
Conclusion
The XC2S200-6FGG467C delivers exceptional value for digital system designers seeking a reliable, high-performance FPGA solution. With 200,000 system gates, 5,292 logic cells, 284 I/O pins, and support for multiple I/O standards, this Spartan-II device addresses a wide range of application requirements. The lead-free 467-ball BGA package ensures RoHS compliance while maintaining excellent signal integrity and thermal performance.
For engineers developing telecommunications equipment, industrial controllers, consumer electronics, or embedded systems, the XC2S200-6FGG467C provides the programmable logic resources, performance, and flexibility needed to bring innovative products to market faster and more cost-effectively than traditional ASIC approaches.