Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG467C: AMD/Xilinx Spartan-II FPGA – Complete Technical Specifications & Features

Product Details

The XC2S200-6FGG467C is a high-performance Field Programmable Gate Array (FPGA) from the renowned AMD/Xilinx Spartan-II family. This versatile programmable logic device delivers 200,000 system gates, 5,292 logic cells, and operates at frequencies up to 263MHz. Designed for demanding digital applications, the XC2S200-6FGG467C offers an excellent balance of performance, flexibility, and cost-effectiveness for engineers and system designers worldwide.

Whether you’re developing telecommunications equipment, industrial automation systems, or embedded control solutions, the XC2S200-6FGG467C provides the robust architecture needed for complex digital designs. Explore our complete range of Xilinx FPGA solutions for your next project.


XC2S200-6FGG467C Key Features and Benefits

The Spartan-II XC2S200-6FGG467C stands out as a superior alternative to traditional mask-programmed ASICs. This FPGA eliminates the high initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC designs. Furthermore, the XC2S200-6FGG467C’s in-field programmability enables design upgrades without hardware replacement—a flexibility impossible with ASICs.

Why Choose the XC2S200-6FGG467C FPGA?

  • Cost-Effective Development: Reduce NRE (Non-Recurring Engineering) costs significantly
  • Rapid Time-to-Market: Accelerate product development cycles
  • Field-Upgradable: Update firmware without physical hardware changes
  • Proven Reliability: Built on mature 0.18µm CMOS technology
  • RoHS Compliant: Lead-free (Pb-free) packaging for environmental compliance

XC2S200-6FGG467C Technical Specifications

Core Architecture

Part Number XC2S200-6FGG467C
FPGA Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284

Memory Resources

Distributed RAM 75,264 bits
Block RAM 56 Kbits
Total On-Chip Memory 131,264 bits

Performance and Electrical Characteristics

Specification Value
Maximum Frequency 263 MHz
Process Technology 0.18µm CMOS
Core Voltage 2.5V
I/O Voltage 1.5V to 3.3V (Multi-standard)
Speed Grade -6 (High Performance)
Temperature Range Commercial (0°C to +85°C)

Package Information

Package Parameter Details
Package Type FGG467 (Fine-Pitch Ball Grid Array)
Pin Count 467 Balls
Lead-Free Yes (Pb-free, RoHS Compliant)
Package Dimensions 27mm × 27mm
Ball Pitch 1.0mm

XC2S200-6FGG467C Part Number Decoder

Understanding the XC2S200-6FGG467C part number helps identify its exact specifications:

Code Segment Meaning
XC2S Xilinx Spartan-II Family
200 200,000 System Gates
-6 Speed Grade 6 (Fastest)
FG Fine-Pitch BGA Package
G Lead-Free (Pb-Free)
467 467-Ball Package
C Commercial Temperature Range

Spartan-II FPGA Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG467C features 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four logic cells, providing the foundation for implementing complex combinatorial and sequential logic functions. The CLB architecture supports both registered and combinatorial outputs, enabling efficient design implementation.

Input/Output Blocks (IOBs)

With 284 user-programmable I/O pins, the XC2S200-6FGG467C supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, and SSTL. This multi-standard I/O capability ensures seamless integration with various system components and communication protocols.

Delay-Locked Loops (DLLs)

The device incorporates four Delay-Locked Loops (DLLs), one at each corner of the die. These DLLs provide precise clock management, clock multiplication, clock division, and phase shifting capabilities essential for high-speed digital designs.

Block RAM

The XC2S200-6FGG467C includes 56 Kbits of dedicated Block RAM, organized as dual-port memory blocks. This high-speed memory resource is ideal for implementing FIFOs, buffers, register files, and small lookup tables without consuming valuable logic resources.


XC2S200-6FGG467C Application Areas

Telecommunications and Networking

The XC2S200-6FGG467C excels in telecommunications applications, including protocol conversion, data encryption/decryption, channel coding, and interface bridging. Its high-speed performance and abundant I/O resources make it ideal for network switches, routers, and communication gateways.

Industrial Automation and Control

Engineers frequently deploy this FPGA in industrial automation systems for motor control, sensor interfaces, real-time data processing, and machine vision applications. The device’s reliability and wide operating voltage range ensure stable operation in demanding industrial environments.

Consumer Electronics

From digital video processing to audio systems, the XC2S200-6FGG467C provides the processing power needed for consumer electronics applications. Its cost-effectiveness makes it attractive for high-volume consumer products requiring custom digital logic.

Embedded Systems and IoT

The Spartan-II architecture serves embedded applications requiring custom peripherals, protocol handlers, or specialized processing engines. System designers leverage the FPGA’s flexibility to create optimized solutions for Internet of Things (IoT) devices and embedded controllers.

Prototyping and Development

Before committing to full ASIC development, engineers use the XC2S200-6FGG467C for rapid prototyping and design verification. The FPGA’s reprogrammability allows multiple design iterations without manufacturing new silicon.


Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG467C receives full support from the Xilinx ISE Design Suite. This comprehensive development environment provides design entry (schematic and HDL), synthesis, implementation, simulation, and programming capabilities. Engineers can develop using VHDL, Verilog, or schematic capture methodologies.

Configuration Options

The device supports multiple configuration modes including Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG (Boundary Scan). This flexibility allows system designers to choose the optimal configuration approach for their application requirements.

IP Core Library

Xilinx provides an extensive library of pre-verified IP cores compatible with the Spartan-II family. These cores accelerate development by providing ready-to-use functional blocks for common applications including processors, memory controllers, communication interfaces, and DSP functions.


XC2S200-6FGG467C Ordering Information

When ordering the XC2S200-6FGG467C, ensure you specify the complete part number to receive the correct device configuration:

Full Part Number: XC2S200-6FGG467C

  • XC2S200: Spartan-II, 200K gates
  • -6: Speed grade -6 (Commercial only)
  • FGG467: 467-ball fine-pitch BGA, Pb-free
  • C: Commercial temperature (0°C to +85°C)

Related Spartan-II FPGA Devices

Part Number Gates Logic Cells Max I/O Package
XC2S100-6FGG256C 100K 2,700 176 256 BGA
XC2S150-6FGG256C 150K 3,888 260 256 BGA
XC2S200-6FGG467C 200K 5,292 284 467 BGA

Quality and Compliance Standards

The XC2S200-6FGG467C meets stringent quality and environmental standards:

  • RoHS Compliant: Fully compliant with Restriction of Hazardous Substances directive
  • Lead-Free (Pb-Free): Environmentally responsible manufacturing
  • MSL Rating: Moisture Sensitivity Level per J-STD-020
  • Qualification: Qualified per Xilinx standard qualification procedures

Conclusion

The XC2S200-6FGG467C delivers exceptional value for digital system designers seeking a reliable, high-performance FPGA solution. With 200,000 system gates, 5,292 logic cells, 284 I/O pins, and support for multiple I/O standards, this Spartan-II device addresses a wide range of application requirements. The lead-free 467-ball BGA package ensures RoHS compliance while maintaining excellent signal integrity and thermal performance.

For engineers developing telecommunications equipment, industrial controllers, consumer electronics, or embedded systems, the XC2S200-6FGG467C provides the programmable logic resources, performance, and flexibility needed to bring innovative products to market faster and more cost-effectively than traditional ASIC approaches.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.