The XC2S200-6FGG463C is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s proven Spartan-II family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, 5,292 logic cells, and 263MHz operating frequency—making it an ideal solution for industrial automation, telecommunications, and embedded system applications.
Key Features of the XC2S200-6FGG463C FPGA
The XC2S200-6FGG463C combines advanced programmable logic architecture with cost-effective implementation. Engineers and designers choose this Spartan-II device for its reliability, flexibility, and comprehensive feature set that supports complex digital designs.
High-Density Logic Resources
This FPGA provides substantial logic capacity for demanding applications:
- 200,000 System Gates for implementing complex digital circuits
- 5,292 Logic Cells enabling intricate signal processing functions
- 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array
- 284 Maximum User I/O Pins supporting extensive external interfacing
Embedded Memory Architecture
The XC2S200-6FGG463C features robust on-chip memory resources:
- 75,264 bits of Distributed RAM for flexible data storage
- 56 Kbits of Block RAM for high-speed buffering operations
- Dual-port memory capability for simultaneous read/write access
Performance Specifications
This -6 speed grade device delivers reliable high-speed operation:
- 263MHz Maximum Operating Frequency
- 2.5V Core Voltage for efficient power consumption
- 0.18μm CMOS Process Technology ensuring proven reliability
- Four integrated Delay-Locked Loops (DLLs) for precise clock management
XC2S200-6FGG463C Technical Specifications
| Parameter |
Specification |
| Manufacturer |
AMD Xilinx |
| Part Number |
XC2S200-6FGG463C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 Total) |
| Max User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 |
| Core Voltage |
2.5V |
| Package Type |
463-Ball Fine-Pitch BGA (FBGA) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Status |
Compliant (Pb-Free) |
| Process Technology |
0.18μm |
Package Information: 463-Ball FBGA
The XC2S200-6FGG463C utilizes a Fine-Pitch Ball Grid Array (FBGA) package that offers several advantages for PCB design and manufacturing:
Package Benefits
- Compact Footprint optimizes board space utilization
- Superior Thermal Performance through efficient heat dissipation
- Enhanced Signal Integrity with shorter interconnect paths
- Lead-Free (Pb-Free) Construction for environmental compliance
The “G” designation in FGG463C indicates RoHS-compliant, lead-free packaging suitable for environmentally conscious manufacturing processes.
Applications for the XC2S200-6FGG463C
The versatility of this Xilinx FPGA makes it suitable for diverse industrial and commercial applications.
Industrial Automation and Control
- Motor control systems and servo drives
- Process control and monitoring equipment
- Programmable logic controllers (PLC) implementations
- Factory automation interfaces
Telecommunications and Networking
- Network router and switch implementations
- Protocol conversion and bridging
- Base station processing units
- Data communication interfaces
Embedded Systems Development
- Custom peripheral controllers
- Real-time signal processing
- Co-processing and hardware acceleration
- Interface bridging and protocol translation
Medical and Scientific Equipment
- Diagnostic imaging systems
- Patient monitoring devices
- Laboratory instrumentation
- Data acquisition systems
Why Choose the Spartan-II XC2S200-6FGG463C
Cost-Effective Alternative to ASICs
The XC2S200-6FGG463C provides a superior alternative to mask-programmed Application-Specific Integrated Circuits (ASICs). This programmable solution eliminates the high initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC development.
Field-Upgradeable Design
Unlike fixed-function ASICs, the XC2S200-6FGG463C enables design modifications and feature upgrades in deployed systems without hardware replacement—reducing maintenance costs and extending product lifecycles.
Proven Technology Platform
The Spartan-II architecture represents mature, well-documented technology with extensive design resources, reference designs, and community support for streamlined development.
Development Tools and Software Support
Xilinx ISE Design Suite Compatibility
The XC2S200-6FGG463C is fully supported by Xilinx’s ISE Design Suite, providing comprehensive tools for:
- HDL synthesis and implementation
- Timing analysis and optimization
- Simulation and verification
- In-system programming and debugging
Design Resource Availability
Engineers benefit from extensive documentation including complete datasheets, user guides, application notes, and reference designs that accelerate development timelines.
Ordering Information
The XC2S200-6FGG463C part number follows Xilinx’s standard naming convention:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade designation (commercial temperature)
- FGG: Fine-Pitch Ball Grid Array (Pb-Free)
- 463: Pin count
- C: Commercial temperature range (0°C to +85°C)
Related Spartan-II Family Devices
For applications requiring different gate densities or package options, consider these related XC2S200 variants:
- XC2S200-5FG456C (Speed Grade -5)
- XC2S200-6FG256C (256-Pin FBGA)
- XC2S200-6PQ208C (208-Pin QFP)
Summary
The XC2S200-6FGG463C from AMD Xilinx delivers reliable, high-performance programmable logic in a compact 463-ball FBGA package. With 200,000 system gates, 5,292 logic cells, and 263MHz operation, this Spartan-II FPGA serves demanding industrial, telecommunications, and embedded applications. The Pb-free, RoHS-compliant construction ensures environmental compliance while maintaining the proven reliability that engineers expect from the Xilinx FPGA portfolio.
