The XC2S200-6FGG462C is a high-performance Field Programmable Gate Array (FPGA) from the AMD Xilinx Spartan-II family. This 200,000-gate FPGA delivers exceptional flexibility, reliability, and cost-effectiveness for embedded systems, industrial automation, telecommunications, and digital signal processing applications. Built on advanced 0.18µm CMOS technology, the XC2S200-6FGG462C offers engineers a powerful alternative to traditional ASICs with the added benefit of in-field reprogrammability.

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XC2S200-6FGG462C Key Features and Benefits

The XC2S200-6FGG462C FPGA combines robust architecture with industry-leading performance. Engineers and designers choose this Spartan-II device for projects requiring high logic density, fast clock speeds, and extensive I/O capabilities.

High-Density Logic Architecture

The XC2S200-6FGG462C features 5,292 logic cells organized in a 28 × 42 CLB (Configurable Logic Block) array, totaling 1,176 CLBs. This architecture enables complex digital designs while maintaining efficient resource utilization. The device supports up to 200,000 system gates, making it ideal for medium to high-complexity applications.

Advanced Memory Resources

On-chip memory is critical for high-performance FPGA designs. The XC2S200-6FGG462C includes:

• 75,264 bits of distributed RAM for fast, flexible storage
• 56 Kbits of dedicated Block RAM for larger data buffers
• Dual-port RAM capability for simultaneous read/write operations

High-Speed Performance

With a maximum operating frequency of 263 MHz and the -6 speed grade optimization, the XC2S200-6FGG462C delivers the timing performance required for demanding digital applications. Four integrated Delay-Locked Loops (DLLs) provide precise clock management, reducing clock skew and enabling multi-clock domain designs.

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XC2S200-6FGG462C Technical Specifications

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XC2S200-6FGG462C Package Information

462-Ball Fine Pitch BGA (FGG462) Package

The XC2S200-6FGG462C utilizes a 462-ball Fine Pitch Ball Grid Array (FGG462) package. The “G” designation indicates Pb-free (lead-free) packaging, ensuring compliance with RoHS environmental directives. This package offers:

• Compact footprint for space-constrained PCB designs
• Superior thermal performance
• Reliable solder joint integrity
• 284 user-configurable I/O pins
• Four dedicated global clock input pins

Pin Configuration and I/O Standards

The XC2S200-6FGG462C supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL, GTL+, HSTL, and SSTL. This flexibility allows seamless integration with various system components and interface requirements.

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XC2S200-6FGG462C Applications

The versatile architecture of the XC2S200-6FGG462C makes it suitable for a wide range of applications across multiple industries.

Industrial and Automation Systems

• Programmable logic controllers (PLCs)
• Motor control systems
• Factory automation equipment
• Sensor interface and data acquisition

Telecommunications Equipment

• Network routers and switches
• Protocol converters
• Base station controllers
• Fiber optic communication systems

Consumer Electronics

• Set-top boxes
• Digital video recorders
• Gaming peripherals
• Audio processing systems

Embedded Computing

• Custom processor implementations
• Hardware acceleration modules
• Interface bridging solutions
• Prototyping and development platforms

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Why Choose the XC2S200-6FGG462C Over ASICs?

The XC2S200-6FGG462C Spartan-II FPGA offers significant advantages compared to Application-Specific Integrated Circuits (ASICs):

Reduced Development Time and Cost

Unlike ASICs, which require expensive mask sets and lengthy fabrication cycles, the XC2S200-6FGG462C can be programmed and reprogrammed instantly. This eliminates NRE (Non-Recurring Engineering) costs and accelerates time-to-market.

In-Field Upgradability

Hardware updates and bug fixes can be deployed remotely without replacing physical components. This extends product lifecycles and reduces maintenance costs.

Design Flexibility

The reconfigurable nature of FPGAs allows design modifications throughout the product development cycle, enabling rapid prototyping and iterative improvements.

Lower Risk

With no minimum order quantities for programming, the XC2S200-6FGG462C reduces inventory risk and enables cost-effective low-volume production.

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XC2S200-6FGG462C Development Tools and Support

AMD provides comprehensive design tools for the XC2S200-6FGG462C through the ISE Design Suite. This mature development environment includes:

• HDL synthesis and simulation
• Place and route optimization
• Timing analysis and constraint management
• Bitstream generation and device programming
• ChipScope Pro for in-system debugging

For engineers seeking quality Xilinx FPGA components and technical resources, trusted suppliers offer competitive pricing, datasheets, and application support.

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XC2S200-6FGG462C Ordering Information

Part Number Breakdown

XC2S200-6FGG462C decodes as follows:

• XC2S200 – Spartan-II device with 200K system gates
• -6 – Speed grade 6 (fastest commercial grade)
• FG – Fine Pitch Ball Grid Array package
• G – Pb-free (RoHS compliant) packaging
• 462 – 462-ball pin count
• C – Commercial temperature range (0°C to +85°C)

Related Part Numbers

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Conclusion

The XC2S200-6FGG462C represents a proven, reliable solution for FPGA-based designs requiring 200,000 system gates in a compact BGA package. With its robust Spartan-II architecture, extensive I/O capabilities, and RoHS-compliant packaging, this device continues to serve applications in telecommunications, industrial automation, and embedded systems. The combination of high logic density, integrated memory resources, and field-programmable flexibility makes the XC2S200-6FGG462C an excellent choice for engineers seeking a cost-effective alternative to custom ASIC development.