Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG461C: High-Performance Xilinx Spartan-II FPGA for Embedded Applications

Product Details

The XC2S200-6FGG461C is a powerful Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family, now part of AMD. Engineered with 200,000 system gates and advanced 0.18μm CMOS technology, this FPGA delivers exceptional performance for cost-sensitive embedded designs, telecommunications, and industrial control applications. The -6 speed grade ensures optimal clock speeds up to 263MHz, making it an ideal choice for engineers seeking a reliable, high-density programmable logic solution.


Key Features of the XC2S200-6FGG461C FPGA

High-Density Logic Architecture

The XC2S200-6FGG461C offers substantial logic resources that enable complex digital designs without external components. Its configurable logic block (CLB) array provides maximum design flexibility for both sequential and combinational circuits.

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum Frequency 263 MHz
Process Technology 0.18μm CMOS

On-Chip Memory Resources

The device integrates generous on-chip memory to support data buffering, FIFO implementations, and lookup table applications.

Memory Type Capacity
Block RAM 56 Kbits
Distributed RAM 75,264 bits

XC2S200-6FGG461C Technical Specifications

Package and Pinout Configuration

The XC2S200-6FGG461C utilizes a 456-Pin Fine-Pitch Ball Grid Array (FGG456) package, offering excellent thermal performance and high I/O density. The “G” designation indicates Pb-free (RoHS compliant) packaging, meeting modern environmental regulations.

Parameter Specification
Package Type FGG456 (Fine-Pitch BGA)
Pin Count 456 Pins
User I/O Pins 284
Ball Pitch 1.0 mm
RoHS Compliance Yes (Pb-Free)

Speed Grade and Operating Conditions

Parameter Value
Speed Grade -6 (Highest Performance)
Core Voltage 2.5V
Operating Temperature 0°C to +85°C (Commercial)
I/O Voltage Standards 16 Selectable Standards

Advanced I/O Capabilities

Flexible I/O Standards Support

The XC2S200-6FGG461C supports 16 different I/O standards, enabling seamless integration with various system interfaces and peripheral devices:

  • LVTTL / LVCMOS (3.3V, 2.5V)
  • PCI (33 MHz / 66 MHz Compliant)
  • GTL / GTL+
  • HSTL (Class I, II, III, IV)
  • SSTL (2.5V, 3.3V)
  • AGP-2X
  • CTT

Clock Management with Delay-Locked Loops

The device features four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing:

  • Clock deskew and distribution
  • Frequency synthesis (multiply/divide)
  • Phase shifting capabilities
  • Jitter reduction for high-speed designs

Spartan-II FPGA Architecture Overview

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG461C contains four logic cells arranged in two slices. Every slice includes:

  • Two 4-input function generators (LUTs)
  • Carry logic for arithmetic functions
  • Two storage elements (flip-flops/latches)
  • Multiplexers for wide logic functions

Block RAM Modules

The XC2S200-6FGG461C incorporates dedicated BlockRAM modules supporting:

  • Dual-port operation
  • Synchronous read/write
  • Configurable aspect ratios (16K×1, 8K×2, 4K×4, 2K×8, 1K×16, 512×32)
  • Cascade capability for larger memory arrays

Typical Applications for XC2S200-6FGG461C

The XC2S200-6FGG461C FPGA excels in numerous application domains where flexibility, performance, and cost-effectiveness are paramount:

Telecommunications and Networking

  • DSL and cable modem interfaces
  • Protocol conversion bridges
  • Packet processing engines
  • Base station controllers

Industrial and Control Systems

  • Motor drive controllers
  • PLC (Programmable Logic Controller) implementations
  • Sensor data acquisition
  • Real-time monitoring systems

Consumer Electronics

  • Set-top boxes and DVRs
  • Digital display controllers
  • Audio/video processing
  • Gaming peripherals

Embedded Computing

  • Co-processing acceleration
  • Custom peripheral interfaces
  • Legacy system integration
  • Prototyping and development

Why Choose the XC2S200-6FGG461C Over ASICs?

The XC2S200-6FGG461C offers compelling advantages compared to traditional mask-programmed ASICs:

Faster Time-to-Market

Eliminate lengthy ASIC development cycles. Program and reprogram the FPGA instantly to meet aggressive product schedules.

Zero NRE Costs

Avoid expensive non-recurring engineering fees associated with ASIC tape-outs and mask fabrication.

Field-Upgradeable Design

Update functionality in deployed systems without hardware replacement—impossible with fixed-function ASICs.

Lower Risk Development

Iterate designs rapidly, fix bugs, and add features throughout the product lifecycle.


Development Tools and Software Support

The XC2S200-6FGG461C is fully supported by Xilinx ISE Design Suite, providing:

  • Schematic and HDL-based design entry
  • Synthesis and implementation tools
  • Timing analysis and simulation
  • JTAG-based programming and debugging

For comprehensive resources and additional Xilinx FPGA solutions, including development boards, evaluation kits, and technical documentation, engineers can access extensive support materials to accelerate their design process.


XC2S200-6FGG461C Part Number Decoder

Understanding the part number structure helps identify exact device specifications:

Segment Meaning
XC2S Spartan-II FPGA Family
200 200,000 System Gates
-6 Speed Grade (Fastest)
FG Fine-Pitch BGA Package
G Pb-Free (RoHS Compliant)
456 456-Pin Package
C Commercial Temperature Range

Ordering Information and Availability

The XC2S200-6FGG461C is available from authorized AMD/Xilinx distributors worldwide. When ordering, ensure the complete part number is specified to receive the correct speed grade, package, and temperature variant.

Related Part Numbers

Part Number Speed Grade Package Temperature
XC2S200-5FGG456C -5 FGG456 Commercial
XC2S200-6FGG456C -6 FGG456 Commercial
XC2S200-5FGG456I -5 FGG456 Industrial

Summary: XC2S200-6FGG461C FPGA at a Glance

The XC2S200-6FGG461C Spartan-II FPGA combines high logic density, flexible I/O, integrated memory, and excellent clock management in a compact Pb-free BGA package. Its -6 speed grade delivers maximum performance for demanding embedded applications while maintaining cost efficiency. Whether developing telecommunications equipment, industrial controllers, or consumer electronics, this FPGA provides the programmable logic foundation for innovative, reliable designs.

Manufacturer: AMD (formerly Xilinx)
Family: Spartan-II
Status: Mature Product (Available for Legacy Designs)

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.