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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG460C: Xilinx Spartan-II FPGA with 200K System Gates

Product Details

The XC2S200-6FGG460C is a high-performance Field Programmable Gate Array (FPGA) from the AMD/Xilinx Spartan-II family. This cost-effective programmable logic device delivers exceptional flexibility for digital design applications, offering 200,000 system gates in a compact 456-pin Fine-Pitch Ball Grid Array (FBGA) package.


XC2S200-6FGG460C Key Features and Specifications

The XC2S200-6FGG460C combines robust logic capacity with advanced I/O capabilities, making it an excellent choice for embedded systems, telecommunications, and industrial control applications.

Technical Specifications Overview

Parameter Specification
Manufacturer AMD/Xilinx
Family Spartan-II
Part Number XC2S200-6FGG460C
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42 (1,176 CLBs)
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56K bits (14 blocks)
Speed Grade -6 (High Performance)
Package Type 456-Ball FBGA (FGG456)
Core Voltage 2.5V
Operating Temperature Commercial (0°C to +85°C)
Process Technology 0.18µm CMOS
Maximum Clock Frequency 263 MHz

XC2S200-6FGG460C Architecture and Design Capabilities

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG460C features 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB contains four logic cells with 4-input look-up tables (LUTs), dedicated carry logic, and edge-triggered D-type flip-flops. This architecture supports complex digital designs with high-speed arithmetic functions and efficient multiplier implementations.

Dual-Port Block RAM Memory

With 14 dedicated Block RAM modules providing 56K bits of on-chip memory, the XC2S200-6FGG460C delivers high-bandwidth data storage for buffering, FIFO implementation, and embedded processing applications. Each 4,096-bit RAM block features independent dual-port access with configurable aspect ratios from 4096×1 to 256×16.

Delay-Locked Loops (DLLs)

Four integrated Delay-Locked Loops provide advanced clock management capabilities including zero-delay clock distribution, clock multiplication (2x), and clock division (up to 16x). The DLLs eliminate clock skew and support multiple clock domains for complex synchronous designs.


XC2S200-6FGG460C I/O Standards and Interface Support

The XC2S200-6FGG460C supports 16 industry-standard I/O interfaces organized in 8 independent I/O banks, enabling seamless integration with diverse system architectures.

Supported I/O Standards

Standard VREF (V) VCCO (V) VTT (V)
LVTTL (2-24mA) N/A 3.3 N/A
LVCMOS2 N/A 2.5 N/A
PCI (3.3V/5V) N/A 3.3 N/A
GTL 0.8 N/A 1.2
GTL+ 1.0 N/A 1.5
HSTL Class I/III/IV 0.75-0.9 1.5 0.75-1.5
SSTL2 Class I/II 1.25 2.5 1.25
SSTL3 Class I/II 1.5 3.3 1.5
CTT 1.5 3.3 1.5
AGP-2X 1.32 3.3 N/A

XC2S200-6FGG460C Part Number Breakdown

Understanding the XC2S200-6FGG460C ordering code helps identify exact device specifications:

  • XC2S200: Spartan-II device with 200,000 system gates
  • -6: Speed grade 6 (high-performance grade)
  • FGG: Fine-Pitch Ball Grid Array, Pb-free (RoHS compliant)
  • 456: 456-ball package
  • C: Commercial temperature range (0°C to +85°C)

XC2S200-6FGG460C Configuration Options

The XC2S200-6FGG460C supports multiple configuration modes for flexible system integration:

  • Master Serial Mode: FPGA generates CCLK to drive external configuration PROM
  • Slave Serial Mode: External controller provides CCLK for daisy-chain configurations
  • Slave Parallel Mode: 8-bit wide data loading for fastest configuration (up to 66 MHz)
  • Boundary Scan (JTAG): IEEE 1149.1 compliant in-system programming via TAP

The configuration file size for XC2S200 devices is 1,335,840 bits (approximately 163KB), enabling rapid system startup.


XC2S200-6FGG460C Applications

The versatile XC2S200-6FGG460C FPGA addresses a wide range of embedded and industrial applications:

Communications and Networking

  • Network routers and switches
  • Protocol converters and bridges
  • Base station infrastructure
  • Data transmission controllers

Industrial Automation

  • Motor control systems
  • Process control equipment
  • Machine vision preprocessing
  • Programmable logic controllers

Consumer Electronics

  • Digital signal processing
  • Video/image processing pipelines
  • Audio codec implementation
  • Display controllers

Medical and Scientific

  • Patient monitoring devices
  • Diagnostic equipment interfaces
  • Laboratory instrumentation
  • Data acquisition systems

Why Choose the XC2S200-6FGG460C Spartan-II FPGA?

The XC2S200-6FGG460C offers significant advantages over mask-programmed ASICs and competing FPGA solutions:

Cost-Effective Development

Eliminate NRE (Non-Recurring Engineering) costs associated with ASIC development. The Spartan-II architecture enables rapid prototyping and iterative design refinement without expensive mask changes.

Field Programmability

Deploy design updates and feature enhancements in the field without hardware replacement. The unlimited reprogramming capability ensures long product lifecycles and reduced obsolescence risk.

High Performance at Low Power

The 0.18µm CMOS process technology delivers clock frequencies up to 263 MHz while maintaining efficient power consumption with 2.5V core operation.

Comprehensive Development Support

Fully supported by the Xilinx ISE development system with automatic mapping, placement, and routing. The library includes over 400 primitives and macros for rapid design implementation.


XC2S200-6FGG460C Package Information

456-Ball FBGA Package Specifications

Parameter Value
Package Type Fine-Pitch BGA
Ball Count 456
Package Dimensions 23mm x 23mm
Ball Pitch 1.0mm
Mounting Type Surface Mount
RoHS Compliance Yes (Pb-free)
Moisture Sensitivity Level MSL-3

Related Xilinx Spartan-II FPGA Products

Explore the complete Xilinx FPGA portfolio for additional device options:

Part Number System Gates Logic Cells User I/O Package
XC2S50-6FGG256C 50,000 1,728 176 256-FBGA
XC2S100-6FGG256C 100,000 2,700 176 256-FBGA
XC2S150-6FGG456C 150,000 3,888 260 456-FBGA
XC2S200-6FGG456C 200,000 5,292 284 456-FBGA

XC2S200-6FGG460C Documentation and Resources

For complete technical specifications, consult the following resources:

  • Spartan-II FPGA Family Data Sheet (DS001): Comprehensive specifications including DC characteristics, switching parameters, and pinout tables
  • XAPP176: Spartan-II Configuration and Readback Application Note
  • XAPP098: Serial Configuration of Spartan FPGAs

Frequently Asked Questions

What is the difference between XC2S200-6FGG456C and XC2S200-5FGG456C?

The “-6” speed grade delivers higher performance than the “-5” grade, with faster internal clock speeds and reduced propagation delays. The -6 grade is exclusively available in the commercial temperature range.

Is the XC2S200-6FGG460C lead-free?

Yes. The “G” in FGG456 indicates Pb-free (lead-free) packaging that complies with RoHS environmental regulations.

What development tools support the XC2S200-6FGG460C?

The Xilinx ISE Design Suite provides complete support for Spartan-II device development, including synthesis, implementation, timing analysis, and in-circuit debugging capabilities.

Can multiple XC2S200-6FGG456C devices be configured in a daisy chain?

Yes. Slave Serial mode supports daisy-chain configuration where multiple devices receive configuration data sequentially from a single PROM or controller.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.