Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG457C: Xilinx Spartan-II FPGA with 200K System Gates

Product Details

The XC2S200-6FGG457C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. This programmable logic device delivers exceptional flexibility and reliability for industrial, telecommunications, and embedded system applications. Engineers seeking a cost-effective alternative to ASICs will find this FPGA offers the perfect balance of performance, power efficiency, and design versatility.


XC2S200-6FGG457C Key Features and Benefits

The XC2S200-6FGG457C belongs to the renowned Xilinx FPGA product line, offering advanced programmable logic capabilities. This device provides an excellent platform for implementing custom digital designs without the lengthy development cycles associated with traditional ASICs.

High-Density Logic Architecture

The XC2S200-6FGG457C incorporates 200,000 system gates and 5,292 logic cells organized in a 28 x 42 CLB (Configurable Logic Block) array. This architecture provides 1,176 total CLBs, enabling complex digital signal processing algorithms and sophisticated control systems in a single chip solution.

Flexible Memory Resources

This Spartan-II FPGA features dual memory architectures for optimized performance. The device includes 75,264 bits of distributed RAM and 56 Kbits of dedicated Block RAM. These memory resources support efficient data buffering, FIFO implementation, and lookup table functions essential for high-speed applications.


XC2S200-6FGG457C Technical Specifications

Parameter Specification
Part Number XC2S200-6FGG457C
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42 (1,176 CLBs)
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Maximum Frequency 263 MHz
Supply Voltage 2.5V
Process Technology 0.18µm
Package Type 456-Ball Fine Pitch BGA
Speed Grade -6 (Commercial)
Operating Temperature 0°C to +85°C (Commercial)
RoHS Status Pb-free (Lead-free compliant)

XC2S200-6FGG457C Package Information

456-Ball Fine Pitch BGA Package

The XC2S200-6FGG457C utilizes a 456-ball Fine Pitch Ball Grid Array (FGG456) package. This compact surface-mount configuration ensures reliable solder connections and excellent thermal performance. The “G” designation indicates Pb-free (lead-free) packaging, making this device compliant with environmental regulations.

Package Specifications

Attribute Value
Package Code FGG456
Pin Count 456
Package Dimensions 23mm x 23mm
Ball Pitch 1.0mm
Mount Type Surface Mount (SMD)

XC2S200-6FGG457C Speed Grade and Performance

Understanding the -6 Speed Grade

The “-6” designation indicates this is the fastest speed grade available in the Spartan-II commercial product line. This speed grade is exclusively available in the commercial temperature range (0°C to +85°C), delivering optimal performance for applications requiring maximum operating frequency.

Performance Characteristics

Specification Value
Maximum System Clock 263 MHz
Speed Grade -6 (Fastest Commercial)
Pin-to-Pin Delay Optimized for high-speed applications

XC2S200-6FGG457C Configuration Options

The XC2S200-6FGG457C supports multiple configuration modes for design flexibility. Engineers can select the most suitable method based on their system requirements.

Supported Configuration Modes

Mode CCLK Direction Data Width Description
Master Serial Output 1-bit Self-configuring from serial PROM
Slave Parallel Input 8-bit External processor configuration
Boundary-Scan N/A 1-bit JTAG-based configuration
Slave Serial Input 1-bit Daisy-chain configuration

Configuration Memory Requirements

Device Configuration Bits
XC2S200 1,335,840 bits

XC2S200-6FGG457C Applications

The versatility of the XC2S200-6FGG457C makes it suitable for numerous applications across multiple industries.

Industrial Applications

This FPGA excels in industrial automation, motor control systems, and programmable logic controllers. The 284 user I/O pins provide extensive connectivity for sensor interfaces and actuator control.

Telecommunications

Network equipment, protocol conversion, and data encryption systems benefit from the high-speed performance and flexible logic resources of this device.

Consumer Electronics

Digital video processing, audio systems, and display controllers leverage the Spartan-II architecture for cost-effective implementations.

Embedded Systems

The XC2S200-6FGG457C serves as an ideal co-processor or system controller in embedded applications requiring custom hardware acceleration.


XC2S200-6FGG457C Ordering Information

Part Number Breakdown

Understanding the XC2S200-6FGG457C part numbering convention helps ensure correct ordering.

Code Segment Meaning
XC2S Spartan-II Family
200 200K System Gates
-6 Speed Grade (Fastest Commercial)
FGG Fine Pitch BGA, Pb-free
456 Pin Count
C Commercial Temperature (0°C to +85°C)

Related Part Numbers

Part Number Speed Grade Package Temperature
XC2S200-6FGG456C -6 FGG456 (Pb-free) Commercial
XC2S200-5FGG456C -5 FGG456 (Pb-free) Commercial
XC2S200-5FGG456I -5 FGG456 (Pb-free) Industrial
XC2S200-6FG456C -6 FG456 Commercial

Development Tools and Support

Design Software Compatibility

The XC2S200-6FGG457C is supported by Xilinx ISE Design Suite. This comprehensive development environment includes synthesis tools, simulation capabilities, and programming utilities.

Documentation Resources

Engineers working with this FPGA have access to extensive documentation including datasheets, user guides, and application notes from the AMD/Xilinx technical library.


Why Choose XC2S200-6FGG457C

Cost-Effective ASIC Alternative

The XC2S200-6FGG457C eliminates the high NRE costs and lengthy development cycles associated with custom ASIC designs. Field programmability allows design modifications and upgrades without hardware replacement.

Proven Technology

The Spartan-II architecture represents mature, well-documented FPGA technology with extensive design resources and application support.

Design Flexibility

With 200,000 system gates and comprehensive I/O options, this FPGA accommodates a wide range of design requirements in a single device.


Conclusion

The XC2S200-6FGG457C Xilinx Spartan-II FPGA delivers an optimal combination of performance, flexibility, and value. With 200K system gates, 5,292 logic cells, and 284 user I/Os in a compact 456-ball BGA package, this programmable logic device meets the demands of industrial, telecommunications, and embedded applications. The -6 speed grade ensures maximum performance for time-critical designs, while Pb-free packaging supports environmental compliance requirements.

For engineers seeking reliable FPGA solutions, the XC2S200-6FGG457C provides the programmable logic resources and performance characteristics necessary for successful product development.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.