XC2S200-6FGG456C: Xilinx Spartan-II FPGA with 200K System Gates

The XC2S200-6FGG456C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. This programmable logic device delivers exceptional value for engineers seeking reliable, cost-effective solutions for digital design applications. With 200,000 system gates and advanced features, the XC2S200-6FGG456C serves as an ideal ASIC replacement in high-volume production environments.

XC2S200-6FGG456C Key Features and Benefits

The XC2S200-6FGG456C combines powerful processing capabilities with flexible I/O options. This Spartan-II device operates at frequencies up to 263MHz while consuming minimal power at 2.5V core voltage. The 456-pin Fine Pitch Ball Grid Array (FBGA) package provides excellent thermal performance and reliable solder connections for demanding applications.

Engineers choose this Xilinx FPGA for its unlimited in-system reprogrammability, which eliminates the high costs and lengthy development cycles associated with traditional ASICs. Field upgrades require no hardware replacement, significantly reducing total cost of ownership.

XC2S200-6FGG456C Technical Specifications

XC2S200-6FGG456C Memory Resources

Block RAM Configuration

The XC2S200-6FGG456C integrates substantial on-chip memory resources for high-speed data processing applications.

Each block RAM cell operates as a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The data widths of the two ports can be configured independently, providing built-in flexibility for various memory architectures.

Distributed RAM Features

The distributed RAM implementation uses 16 bits per Look-Up Table (LUT), enabling designers to create small, fast memory structures directly within the CLB fabric. This approach optimizes timing for latency-sensitive applications.

XC2S200-6FGG456C I/O Capabilities

Maximum User I/O Count

Supported I/O Standards

The XC2S200-6FGG456C supports multiple I/O voltage standards for seamless system integration:

The FGG456 package provides eight independent VCCO supplies, allowing designers to mix compatible I/O standards across different banks.

XC2S200-6FGG456C Clock Management

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG456C includes four Delay-Locked Loops positioned at each corner of the die. These DLLs provide:

• Clock deskewing across the device
• Board-level clock synchronization when used as a clock mirror
• Phase shifting capabilities for timing optimization
• System clock validation before FPGA startup after configuration

The four dedicated global clock nets can drive all IOB, CLB, and block RAM clock pins, ensuring consistent timing throughout the device.

XC2S200-6FGG456C Architecture Overview

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG456C CLB array consists of 1,176 Configurable Logic Blocks arranged in a 28 x 42 matrix. Each CLB contains:

• Four Logic Cells (LCs) organized in two slices
• Four-input Look-Up Tables (LUTs) for function generation
• D-type flip-flops or level-sensitive latches
• Fast carry logic for arithmetic operations
• F5 multiplexer outputs for implementing 6-input functions or 8:1 multiplexers

Input/Output Block (IOB) Features

Each IOB includes three registers (input, output, and 3-state) that can function as D-type flip-flops or level-sensitive latches. The IOBs share a common clock signal with independent Clock Enable signals for each register.

XC2S200-6FGG456C Configuration Options

The XC2S200-6FGG456C supports multiple configuration modes for flexible system integration:

Configuration data is stored in internal static memory cells, enabling unlimited reprogramming cycles without wear-out concerns.

XC2S200-6FGG456C vs ASIC Solutions

The XC2S200-6FGG456C offers significant advantages over mask-programmed ASICs:

XC2S200-6FGG456C Applications

The XC2S200-6FGG456C excels in numerous industrial and commercial applications:

• Telecommunications equipment – Protocol conversion and signal processing
• Industrial automation – Motor control and process monitoring
• Consumer electronics – Video processing and display controllers
• Automotive systems – Body electronics and lighting control
• Test and measurement – Data acquisition and instrument control
• Medical devices – Imaging systems and patient monitoring
• Networking equipment – Packet processing and routing

XC2S200-6FGG456C Part Number Breakdown

Understanding the part number structure helps identify device specifications:

XC2S200-6FGG456C Development Tools

Designers can develop for the XC2S200-6FGG456C using Xilinx ISE Design Suite, which provides comprehensive synthesis, implementation, and verification capabilities. The development flow includes:

• HDL synthesis (VHDL/Verilog)
• Place and route optimization
• Timing analysis and verification
• Bitstream generation
• In-system programming and debugging

XC2S200-6FGG456C Ordering Information

The “G” designation in “FGG” indicates Pb-free (RoHS compliant) packaging for environmentally conscious designs.

Conclusion

The XC2S200-6FGG456C delivers exceptional value for engineers requiring a proven, reliable FPGA solution with substantial logic capacity and flexible I/O capabilities. Its combination of 200K system gates, 5,292 logic cells, integrated block RAM, and multiple I/O standards makes it suitable for diverse applications from telecommunications to industrial automation. The Spartan-II architecture provides cost-effective programmable logic with unlimited reprogrammability, eliminating the risks and costs associated with ASIC development while accelerating time-to-market for new products.