The XC2S200-6FGG1474C Spartan-II FPGA is a high-density field-programmable gate array designed for engineers who need reliable programmable logic, fast prototyping, and cost-efficient digital system design. Built on Xilinx’s proven Spartan-II architecture, this FPGA delivers a strong balance of performance, flexibility, and industrial-grade reliability for embedded control, telecommunications, automotive electronics, and digital signal processing applications.
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What is XC2S200-6FGG1474C FPGA?
The XC2S200-6FGG1474C FPGA is part of the Xilinx Spartan-II family, offering approximately 200,000 system gates and 5,000+ logic cells. It is designed to replace fixed-function ASICs with a reprogrammable hardware platform, enabling rapid development and field upgrades without hardware redesign.
This makes it ideal for:
- Embedded system development
- Industrial automation controllers
- Digital signal processing (DSP) systems
- Communication infrastructure
- Automotive electronics
XC2S200-6FGG1474C Key Features & Benefits
Core Advantages of Spartan-II FPGA Architecture
| Feature |
Description |
| Programmable Logic |
Reconfigurable hardware for flexible design |
| Gate Capacity |
~200,000 system gates |
| Logic Cells |
~5,000+ configurable logic blocks |
| Voltage |
2.5V core supply architecture |
| Process Technology |
0.18μm CMOS technology |
| Performance |
High-speed embedded system processing |
XC2S200-6FGG1474C Technical Specifications
Electrical & Performance Overview
| Specification |
Value |
| Device Family |
Spartan-II |
| Model |
XC2S200-6FGG1474C |
| System Gates |
~200K |
| Logic Cells |
~5292 |
| Core Voltage |
2.5V |
| Technology Node |
0.18μm CMOS |
| Speed Grade |
-6 (High-performance grade) |
| Package Type |
Fine-pitch BGA (FGG1474) |
| Typical Applications |
Embedded, telecom, industrial control |
Why Choose XC2S200-6FGG1474C FPGA?
1. High Flexibility for Hardware Design
Unlike fixed ASIC chips, the XC2S200-6FGG1474C FPGA allows full reconfiguration, making it ideal for iterative development and system upgrades.
2. Cost-Effective Prototyping Solution
It reduces development time and manufacturing costs by eliminating the need for custom silicon fabrication.
3. Industrial-Grade Reliability
Designed for robust operation in:
- Industrial environments
- Automotive systems
- Mission-critical embedded platforms
4. Fast Time-to-Market
Engineers can design, test, and deploy hardware systems much faster compared to traditional hardware development cycles.
XC2S200-6FGG1474C Applications
Embedded Systems
- Microcontroller enhancement
- Custom logic processing
- Real-time control systems
Telecommunications
- Signal routing
- Data packet processing
- Network switching logic
Industrial Automation
- PLC control systems
- Sensor data processing
- Machine control logic
Automotive Electronics
- Engine control modules
- Safety systems
- Digital instrumentation
XC2S200-6FGG1474C Package & Design Advantages
| Parameter |
Description |
| Package Type |
Fine-pitch BGA (FGG1474) |
| I/O Capability |
High-density I/O routing |
| Layout Efficiency |
Compact PCB integration |
| Signal Integrity |
Optimized for high-speed digital signals |
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