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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1462C Xilinx Spartan-II FPGA: High-Performance 200K-Gate Programmable Logic Solution for Embedded & Industrial Designs

Product Details

The XC2S200-6FGG1462C belongs to the well-established Spartan-II FPGA family, originally developed by Xilinx (now part of AMD). This device is engineered to deliver cost-effective programmable logic, making it suitable for embedded systems, industrial automation, and communication applications.

Built on a 0.18µm CMOS process, the XC2S200 series combines flexibility, performance, and scalability, allowing engineers to replace traditional ASIC designs with a reprogrammable alternative that reduces development time and cost.


Key Features of XC2S200-6FGG1462C

High Logic Density & Performance

The XC2S200-6FGG1462C provides strong logic capacity and efficient architecture for complex digital designs.

Feature Specification
System Gates 200,000
Logic Cells 5,292
CLBs (Configurable Logic Blocks) 1,176
Max User I/O Up to 284
Max Frequency ~200–263 MHz
Process Technology 0.18 µm CMOS

These features make it ideal for high-speed signal processing and control systems.


Advanced Memory Architecture

The FPGA integrates both distributed and block memory for flexible data handling.

Memory Type Capacity
Distributed RAM ~75 Kbits
Block RAM ~56 Kbits
Dual-Port RAM Supported

This memory structure allows efficient buffering, caching, and real-time data processing.


Clock Management & Timing Control

The XC2S200-6FGG1462C includes advanced clocking resources to ensure stable system performance.

Feature Description
DLLs (Delay-Locked Loops) 4 (corner-based placement)
Global Clock Networks Multiple low-skew lines
Timing Optimization Clock deskew & phase alignment

These features enable precise timing control in high-frequency designs.


Package & Electrical Characteristics

The FGG package (Fine-Pitch Ball Grid Array) ensures compact design and excellent electrical performance.

Parameter Value
Package Type FBGA (FGG series)
Mounting Surface Mount
Core Voltage 2.5V
I/O Voltage 3.3V compatible
Operating Temp 0°C to 85°C

The package design enhances signal integrity, thermal performance, and PCB density.


Applications of XC2S200-6FGG1462C

Thanks to its balance of cost and performance, this FPGA is widely used in:

  • Embedded control systems
  • Industrial automation equipment
  • Telecommunications infrastructure
  • Automotive electronics
  • Digital signal processing (DSP)

Its field-programmable nature allows hardware updates without redesign, which is a major advantage over ASIC solutions.


Advantages of Spartan-II FPGA Architecture

Flexible Programmability

Unlike fixed-function ASICs, the XC2S200 can be reprogrammed multiple times, enabling rapid prototyping and iterative development.

Cost Efficiency

Spartan-II devices are designed for high-volume, low-cost applications, making them attractive for commercial deployment.

Rich Feature Set

  • Built-in RAM blocks
  • Fast carry logic for arithmetic
  • Boundary scan (IEEE 1149.1)
  • Multiple I/O standards support

XC2S200-6FGG1462C vs ASIC Solutions

Feature XC2S200 FPGA Traditional ASIC
Development Time Short Long
Upgradability Reprogrammable Fixed
Initial Cost Low High
Flexibility High Low

This comparison highlights why FPGAs like XC2S200 remain popular in rapid development environments.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.