Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1390C Spartan-II FPGA: Technical Specifications and Features

Product Details

The XC2S200-6FGG1390C belongs to the renowned Xilinx Spartan-II family, a series designed to provide a cost-effective, high-volume solution for logic integration. This Field Programmable Gate Array (FPGA) offers a perfect balance between performance, density, and price, making it an ideal choice for consumer electronics, industrial control, and telecommunications.

In this guide, we will explore the detailed specifications, key features, and application scenarios for the XC2S200-6FGG1390C to help you understand why it remains a reliable choice for legacy and specialized digital designs.

Understanding the XC2S200-6FGG1390C Architecture

The architecture of the XC2S200-6FGG1390C is built upon a flexible 0.22µm / 0.18µm CMOS process. It leverages a segmented routing structure that ensures high-speed signal propagation while maintaining low power consumption. As a member of the Spartan-II series, it provides the benefits of the Virtex architecture at a significantly lower price point.

Key Performance Metrics

The “6” in the part number indicates the speed grade, while “C” signifies the commercial temperature range. Below is a detailed breakdown of the logic and memory capabilities of this specific device.

Feature Specification
System Gates 200,000
Logic Cells 5,292
CLB Array (Rows x Cols) 28 x 42
Total Distributed RAM Bits 75,264
Total Block RAM Bits 57,344
Maximum User I/O Up to 284 (Package Dependent)

Technical Features of XC2S200-6FGG1390C

Advanced Memory Hierarchy

The XC2S200-6FGG1390C features a dual-layered memory approach. It utilizes Distributed RAM for small, fast storage elements and Block RAM for larger data buffering requirements. This dual approach allows designers to optimize their internal data flow without exhausting logic resources.

Versatile I/O Standards

Modern digital systems require compatibility with various signaling standards. The Spartan-II series supports a wide array of I/O interfaces, including:

  • LVTTL and LVCMOS: For standard digital logic.

  • PCI Support: Full 33MHz and 66MHz PCI compliance.

  • Differential Signaling: Support for high-speed data transfer interfaces.

Clock Management with DLLs

To ensure synchronous performance across the entire chip, the XC2S200-6FGG1390C includes Delay-Locked Loops (DLLs). These components provide zero-propagation delay, low clock skew, and frequency multiplication/division, which are essential for high-speed digital processing.

Why Choose Xilinx Spartan-II for Your Project?

Choosing the right FPGA involves balancing logic density with system power requirements. The XC2S200-6FGG1390C is specifically optimized for 2.5V core operation, which reduces thermal output compared to older 5V or 3.3V logic devices.

Furthermore, if you are looking for alternatives or supplementary components, exploring the broader Xilinx FPGA catalog is recommended for comparing modern successors and legacy parts.

Comprehensive Electrical Characteristics

Parameter Value
Core Supply Voltage (Vccint) 2.5V ± 5%
I/O Supply Voltage (Vcco) 1.5V to 3.3V
Operating Temperature 0°C to +85°C (Commercial)
Speed Grade -6 (High Speed)
Package Type FGG1390 (Fine-Pitch Ball Grid Array)

Common Applications for XC2S200-6FGG1390C

The versatility of the Spartan-II series makes it suitable for various industries. Because of its 200,000 system gates, it can handle moderately complex logic tasks that were previously reserved for more expensive ASICs.

Industrial Automation

In industrial settings, the XC2S200-6FGG1390C is often used for motor control, sensor interfacing, and real-time data acquisition. Its robust I/O capabilities allow it to communicate with various peripheral sensors simultaneously.

Telecommunications

The device is frequently found in network interface cards and base station controllers. Its ability to implement custom protocols and handle high-speed bitstreams makes it a staple in the telecommunications infrastructure.

Consumer Electronics

From set-top boxes to digital imaging equipment, the Spartan-II series provides the logic flexibility required to adapt to changing consumer standards without the high NRE (Non-Recurring Engineering) costs of custom silicon.

Conclusion

The XC2S200-6FGG1390C remains a powerful and cost-efficient solution for designers needing 200k system gates. By offering a stable architecture, comprehensive I/O support, and efficient power management, it ensures that your digital designs are both performant and reliable. Whether you are maintaining a legacy system or developing a specialized low-cost application, this Xilinx Spartan-II FPGA is a proven choice.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.