Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1389C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1389C is a prominent member of the Xilinx Spartan-II Field Programmable Gate Array (FPGA) family. Designed to bridge the gap between high-cost high-end FPGAs and low-capacity CPLDs, this device offers a robust solution for high-volume, cost-sensitive electronic applications. By leveraging a 0.18-micron process technology, the XC2S200-6FGG1389C provides a perfect balance of performance, power efficiency, and density.

Whether you are working on industrial control systems, telecommunications, or consumer electronics, understanding the capabilities of the Xilinx FPGA architecture is essential for optimizing your hardware design.


Key Features of XC2S200-6FGG1389C

The XC2S200-6FGG1389C is engineered to provide flexible logic integration. Furthermore, it incorporates several architectural enhancements that improve system-level performance.

  • System Gate Density: Offers up to 200,000 system gates, allowing for complex logic implementation.

  • Low Power Consumption: Optimized for 2.5V core voltage operations, reducing thermal management requirements.

  • Flexible I/O Standards: Supports multiple I/O signaling standards, including LVTTL, LVCMOS, and PCI.

  • On-Chip Memory: Features dedicated block RAM and distributed RAM for efficient data buffering.

  • Clock Management: Integrated Delay-Locked Loops (DLLs) for precise clock conditioning and skew elimination.


Technical Specifications and Parameters

When selecting an FPGA for your project, reviewing the technical parameters is a critical step. Below is a detailed breakdown of the XC2S200-6FGG1389C specifications.

Table 1: Core Technical Parameters

Parameter Specification
Product Series Spartan-II
Logic Cells 5,292
System Gates 200,000
CLB Array (Rows x Cols) 28 x 42
Total Distributed RAM Bits 75,264
Total Block RAM Bits 56,320
Maximum User I/O Variable based on package (Up to 284)
Speed Grade -6 (High Speed)
Operating Temperature 0°C to 85°C (Commercial Grade)

Understanding the XC2S200-6FGG1389C Architecture

The architecture of the XC2S200-6FGG1389C is based on the proven Virtex-E technology, adapted for cost-effectiveness. It consists of an inner configurable logic block (CLB) matrix surrounded by a ring of programmable Input/Output Blocks (IOBs).

Configurable Logic Blocks (CLBs)

The CLBs are the heart of the XC2S200-6FGG1389C. Each CLB contains four logic cells, organized in two slices. These slices provide the necessary logic functions, including combinatorial logic and synchronous elements like flip-flops. Consequently, designers can implement complex state machines and arithmetic functions with high efficiency.

Versatile Memory Solutions

In addition to logic, this FPGA provides versatile memory resources. The Block RAM is ideal for creating deep buffers or FIFOs, while the distributed RAM is perfect for small look-up tables (LUTs) or shallow memory structures.


Applications of the Spartan-II XC2S200 Series

Due to its versatility, the XC2S200-6FGG1389C is utilized across various industries. Because it offers high gate counts at a low price point, it remains a favorite for legacy support and mid-range performance needs.

Common Industry Use Cases:

  1. Industrial Automation: Handling real-time motor control and sensor interface protocols.

  2. Communication Infrastructure: Managing high-speed data packet processing and protocol conversion.

  3. Video Processing: Implementing basic image filtering and display interface logic.

  4. Legacy System Support: Replacing obsolete logic components in older hardware revisions to extend product lifecycles.


Package and Ordering Information

The XC2S200-6FGG1389C utilizes a Fine-pitch Ball Grid Array (FBGA) package. This packaging technology ensures high pin density while maintaining a compact footprint on the Printed Circuit Board (PCB).

Table 2: Packaging and Environmental Details

Detail Description
Package Type FGG1389 (Fine-pitch Ball Grid Array)
Pin Count 1389 Pins
Lead Status Pb-Free (RoHS Compliant)
Mounting Type Surface Mount (SMD/SMT)
Package Material Plastic

Why Choose XC2S200-6FGG1389C for Your Design?

Choosing the XC2S200-6FGG1389C provides several advantages for hardware engineers. First, the Spartan-II series has a mature ecosystem of development tools, including Xilinx ISE. Second, the device’s reliability is well-documented in millions of deployed units worldwide.

Moreover, if you are transitioning from older CPLDs, the XC2S200-6FGG1389C offers a significant boost in logic capacity without a massive increase in cost. In conclusion, it remains a robust, reliable, and cost-effective choice for modern digital design requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.