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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1380C Xilinx Spartan-II FPGA: Features, Specs, and Technical Overview

Product Details

The XC2S200-6FGG1380C is a prominent member of the Xilinx Spartan-II Field Programmable Gate Array (FPGA) family. Designed to provide a high-volume, low-cost solution for logic integration, this specific component balances performance and power efficiency. Whether you are working on industrial control systems, telecommunications, or consumer electronics, the XC2S200-6FGG1380C offers a flexible architecture to meet demanding design requirements.

What is the XC2S200-6FGG1380C FPGA?

The XC2S200-6FGG1380C is a 200,000-system-gate FPGA optimized for high-speed logic and efficient silicon utilization. Built on a 0.22µm/0.18µm CMOS process, it bridges the gap between expensive high-end FPGAs and restrictive ASICs. By leveraging the proven Virtex architecture, the Spartan-II series provides advanced features like block RAM and Delay-Locked Loops (DLLs) at a fraction of the cost.

If you are looking for reliable sourcing and technical support for these components, you can explore the Xilinx FPGA link for more detailed inventory information.

Key Specifications of XC2S200-6FGG1380C

To help engineers and procurement specialists, the following table summarizes the core technical parameters of the XC2S200-6FGG1380C.

Table 1: Core Technical Parameters

Feature Specification
Series Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total Distributed RAM Bits 75,264
Block RAM Bits 57,344
Max User I/O 284
Core Voltage 2.5V
Speed Grade -6

Advanced Architecture and Performance

The XC2S200-6FGG1380C architecture is designed to handle complex digital signal processing and high-speed data routing. Below are the primary architectural pillars that define its performance.

Flexible Logic Resources

The Configurable Logic Blocks (CLBs) are the heart of the XC2S200. Each CLB contains four logic cells, organized as two slices. This structure allows for efficient implementation of both combinatorial logic and synchronous state machines.

Memory Hierarchy and Storage

This FPGA features a dual-layered memory approach:

  1. Distributed RAM: Ideal for small FIFO buffers and shift registers.

  2. Block RAM: Dedicated 4,096-bit blocks for larger data storage, such as packet buffers or look-up tables.

Clock Management with DLLs

Managing clock skew is critical in high-frequency designs. The XC2S200-6FGG1380C includes on-chip Delay-Locked Loops (DLLs) that provide precise clock synchronization and frequency synthesis, ensuring that high-speed data remains aligned across the entire chip.

Operating Conditions and Electrical Characteristics

Understanding the electrical limits is essential for PCB design and thermal management. The XC2S200-6FGG1380C is designed for commercial temperature ranges.

Table 2: Electrical and Thermal Limits

Parameter Range/Value
Operating Temperature (Commercial) 0°C to +85°C
Supply Voltage (Vccint) 2.375V to 2.625V
I/O Supply Voltage (Vcco) 1.2V to 3.3V
Input Threshold LVTTL, LVCMOS2, PCI, etc.
Package Type Fine-Pitch Ball Grid Array (FBGA)

Why Choose the Spartan-II XC2S200 Series?

Selecting the XC2S200-6FGG1380C for your project offers several strategic advantages:

  • Cost Efficiency: It provides an ASIC-like price point with the flexibility of reconfigurable hardware.

  • Versatile I/O Support: Supports up to 16 high-performance I/O standards, including PCI, LVTTL, and LVCMOS, making it easy to interface with various external components.

  • Rapid Development: Compatible with Xilinx ISE and other major EDA tools, allowing for fast prototyping and shorter time-to-market.

  • Low Power Consumption: The 2.5V core voltage reduces overall power dissipation compared to older 3.3V or 5V logic families.

Applications of XC2S200-6FGG1380C

Due to its balanced gate count and high I/O density, the XC2S200-6FGG1380C is frequently used in:

  • Legacy System Maintenance: Replacing obsolete logic in industrial machinery.

  • Data Communications: Handling protocol conversion and frame buffering.

  • Video Processing: Basic image filtering and display driving.

  • Embedded Control: Managing complex timing sequences in medical and automotive applications.

Conclusion

The XC2S200-6FGG1380C remains a versatile and dependable choice for designers who require the reliability of the Xilinx Spartan-II family. By offering a robust set of logic cells, dedicated block RAM, and advanced clock management, it simplifies the design of complex digital systems while keeping costs under control. For those integrating this FPGA into modern designs, ensure that your power delivery network (PDN) is optimized for the 2.5V core and that the multi-standard I/Os are correctly configured for your peripheral devices.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.