Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1374C Spartan-II FPGA: High-Performance FPGA by Xilinx

Product Details

The XC2S200-6FGG1374C is a high-performance programmable logic device from Xilinx’s Spartan-II FPGA family. Designed for cost-sensitive, high-volume applications, this FPGA delivers robust logic density, flexible I/O, and reliable performance — making it a go-to solution for embedded systems, communications, and industrial designs.

Whether you’re prototyping or deploying in production, the XC2S200-6FGG1374C offers the balance of speed, capacity, and power efficiency that engineers demand.


What Is the XC2S200-6FGG1374C?

The XC2S200-6FGG1374C belongs to Xilinx’s Spartan-II series, a family of FPGAs built on a 0.18µm process technology. The “200” in the part number refers to approximately 200,000 system gates, while “6” denotes the speed grade, and “FGG1374” identifies the Fine-Pitch Ball Grid Array (FBGA) package with 1374 pins.

This device is ideal for applications requiring:

  • High logic density in a compact package

  • Deterministic timing with a -6 speed grade

  • Large pin-count connectivity via the FGG1374 package


XC2S200-6FGG1374C Key Specifications

Parameter Value
Part Number XC2S200-6FGG1374C
FPGA Family Spartan-II
Manufacturer Xilinx (AMD)
Logic Gates ~200,000
CLB Slices 1,176
Flip-Flops 4,704
Maximum User I/O 284
Block RAM 14 x 4Kb blocks (56Kb total)
Speed Grade -6
Package Type FBGA (FGG1374)
Pin Count 1374
Supply Voltage (VCC) 2.5V
Process Technology 0.18µm
Operating Temperature Commercial (0°C to +85°C)
RoHS Compliance Yes

XC2S200-6FGG1374C Pin Configuration and Package Details

FGG1374 Package Overview

The FGG1374 package is a Fine-Pitch Ball Grid Array format, offering a high-density footprint suitable for space-constrained PCB designs. With 1374 total balls, this package supports a large number of user I/O pins while maintaining signal integrity at higher frequencies.

Package Attribute Detail
Package Code FGG1374
Package Type Fine-Pitch BGA
Total Ball Count 1374
User I/O Pins Up to 284
PCB Mount Type Surface Mount
Ball Pitch 1.0mm

Spartan-II FPGA Architecture: Inside the XC2S200

Configurable Logic Blocks (CLBs)

The XC2S200 contains 1,176 CLBs, each consisting of two slices. Every slice includes:

  • Two 4-input Look-Up Tables (LUTs)

  • Two D-type flip-flops

  • Fast carry and arithmetic logic

This architecture enables efficient implementation of both combinational and sequential logic.

Block RAM

The device includes 14 block RAM modules, each 4Kb in size, totaling 56Kb of on-chip memory. Block RAM supports:

  • Dual-port access

  • Synchronous read/write operations

  • Configurable data widths (1, 2, 4, 8, or 16 bits)

I/O Blocks (IOBs)

Each I/O block in the XC2S200-6FGG1374C supports multiple I/O standards:

Supported I/O Standard Description
LVTTL Low Voltage TTL
LVCMOS2 Low Voltage CMOS 2.5V
PCI 3.3V PCI compliant
GTL / GTL+ Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic
SSTL2 / SSTL3 Stub Series Terminated Logic

Digital Clock Manager (DCM)

The Spartan-II includes delay-locked loops (DLLs) for:

  • Clock deskewing

  • Frequency synthesis

  • Phase shifting


XC2S200-6FGG1374C Performance and Speed Grade

The -6 speed grade indicates the device’s timing performance tier within the Spartan-II family. A higher speed grade number means faster propagation delays and higher maximum clock frequencies.

Speed Parameter -6 Grade Value
Maximum System Clock (Fmax) ~200 MHz (typical)
Minimum Clock-to-Output (Tco) ~3.5ns
Setup Time (Tsu) ~0.5ns
Logic Propagation Delay ~0.4ns per LUT

Applications of the XC2S200-6FGG1374C

The XC2S200-6FGG1374C Spartan-II FPGA is widely used across multiple industries:

Industrial Automation

  • Motor control systems

  • Sensor fusion and data acquisition

  • Real-time control loops

Communications

  • Protocol bridging (UART, SPI, I2C, PCIe)

  • Network packet processing

  • Wireless baseband processing

Consumer Electronics

  • Display controllers

  • Image and video processing pipelines

  • Set-top box logic

Embedded Systems

  • Co-processing alongside microcontrollers

  • Custom peripheral implementation

  • Hardware acceleration


Why Choose the XC2S200-6FGG1374C Spartan-II FPGA?

Advantage Benefit
High gate density (200K gates) Supports complex logic designs
284 user I/O pins Flexible system integration
56Kb block RAM Efficient on-chip data buffering
-6 speed grade Reliable high-frequency operation
2.5V core voltage Lower power consumption
FGG1374 BGA package Compact, high-density PCB footprint
Xilinx ISE design tools Mature, well-documented toolchain

XC2S200-6FGG1374C vs Other Spartan-II Devices

Part Number Gates CLB Slices Max I/O Block RAM Speed Grade
XC2S50-6FGG256C 50K 300 176 4 x 4Kb -6
XC2S100-6FGG456C 100K 600 260 7 x 4Kb -6
XC2S200-6FGG1374C 200K 1,176 284 14 x 4Kb -6
XC2S300E-6FGG456C 300K 1,536 329 16 x 4Kb -6

The XC2S200-6FGG1374C sits in the mid-to-upper range of the Spartan-II lineup, offering a strong balance of capacity and cost for demanding designs.


Programming and Design Tools

Xilinx supports the XC2S200-6FGG1374C through its ISE Design Suite, which includes:

  • XST — Xilinx Synthesis Technology for HDL synthesis

  • PACE — Pin and Area Constraints Editor

  • ChipScope Pro — In-system logic analysis

  • iMPACT — Device programming and configuration

Design entry supports both VHDL and Verilog HDL, with a well-established ecosystem of IP cores and reference designs.


Ordering Information

Field Detail
Full Part Number XC2S200-6FGG1374C
Manufacturer Xilinx / AMD
RoHS Status Compliant
Lifecycle Status Not Recommended for New Designs (NRND)
Suggested Replacement Xilinx Spartan-6 or Artix-7 series

For sourcing and availability of the XC2S200-6FGG1374C, explore the full range of Xilinx FPGA solutions including modern alternatives from the Spartan-6 and Artix-7 families.


Frequently Asked Questions (FAQ)

What does XC2S200-6FGG1374C mean?

The part number breaks down as: XC2S = Spartan-II family, 200 = ~200K gates, 6 = speed grade -6, FGG1374 = 1374-pin FBGA package, C = commercial temperature range.

Is the XC2S200-6FGG1374C still in production?

The Spartan-II family is classified as Not Recommended for New Designs (NRND). Xilinx recommends migrating to Spartan-6 or Artix-7 for new projects.

What voltage does the XC2S200-6FGG1374C operate at?

The core supply voltage is 2.5V (VCCINT), with I/O banks supporting 3.3V or 2.5V depending on the I/O standard selected.

What programming language is used with this FPGA?

The XC2S200-6FGG1374C supports design entry in VHDL, Verilog, and schematic capture via Xilinx ISE.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.