The XC2S200-6FGG1374C is a high-performance programmable logic device from Xilinx’s Spartan-II FPGA family. Designed for cost-sensitive, high-volume applications, this FPGA delivers robust logic density, flexible I/O, and reliable performance — making it a go-to solution for embedded systems, communications, and industrial designs.
Whether you’re prototyping or deploying in production, the XC2S200-6FGG1374C offers the balance of speed, capacity, and power efficiency that engineers demand.
What Is the XC2S200-6FGG1374C?
The XC2S200-6FGG1374C belongs to Xilinx’s Spartan-II series, a family of FPGAs built on a 0.18µm process technology. The “200” in the part number refers to approximately 200,000 system gates, while “6” denotes the speed grade, and “FGG1374” identifies the Fine-Pitch Ball Grid Array (FBGA) package with 1374 pins.
This device is ideal for applications requiring:
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High logic density in a compact package
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Deterministic timing with a -6 speed grade
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Large pin-count connectivity via the FGG1374 package
XC2S200-6FGG1374C Key Specifications
| Parameter |
Value |
| Part Number |
XC2S200-6FGG1374C |
| FPGA Family |
Spartan-II |
| Manufacturer |
Xilinx (AMD) |
| Logic Gates |
~200,000 |
| CLB Slices |
1,176 |
| Flip-Flops |
4,704 |
| Maximum User I/O |
284 |
| Block RAM |
14 x 4Kb blocks (56Kb total) |
| Speed Grade |
-6 |
| Package Type |
FBGA (FGG1374) |
| Pin Count |
1374 |
| Supply Voltage (VCC) |
2.5V |
| Process Technology |
0.18µm |
| Operating Temperature |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Yes |
XC2S200-6FGG1374C Pin Configuration and Package Details
FGG1374 Package Overview
The FGG1374 package is a Fine-Pitch Ball Grid Array format, offering a high-density footprint suitable for space-constrained PCB designs. With 1374 total balls, this package supports a large number of user I/O pins while maintaining signal integrity at higher frequencies.
| Package Attribute |
Detail |
| Package Code |
FGG1374 |
| Package Type |
Fine-Pitch BGA |
| Total Ball Count |
1374 |
| User I/O Pins |
Up to 284 |
| PCB Mount Type |
Surface Mount |
| Ball Pitch |
1.0mm |
Spartan-II FPGA Architecture: Inside the XC2S200
Configurable Logic Blocks (CLBs)
The XC2S200 contains 1,176 CLBs, each consisting of two slices. Every slice includes:
This architecture enables efficient implementation of both combinational and sequential logic.
Block RAM
The device includes 14 block RAM modules, each 4Kb in size, totaling 56Kb of on-chip memory. Block RAM supports:
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Dual-port access
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Synchronous read/write operations
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Configurable data widths (1, 2, 4, 8, or 16 bits)
I/O Blocks (IOBs)
Each I/O block in the XC2S200-6FGG1374C supports multiple I/O standards:
| Supported I/O Standard |
Description |
| LVTTL |
Low Voltage TTL |
| LVCMOS2 |
Low Voltage CMOS 2.5V |
| PCI |
3.3V PCI compliant |
| GTL / GTL+ |
Gunning Transceiver Logic |
| HSTL |
High-Speed Transceiver Logic |
| SSTL2 / SSTL3 |
Stub Series Terminated Logic |
Digital Clock Manager (DCM)
The Spartan-II includes delay-locked loops (DLLs) for:
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Clock deskewing
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Frequency synthesis
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Phase shifting
XC2S200-6FGG1374C Performance and Speed Grade
The -6 speed grade indicates the device’s timing performance tier within the Spartan-II family. A higher speed grade number means faster propagation delays and higher maximum clock frequencies.
| Speed Parameter |
-6 Grade Value |
| Maximum System Clock (Fmax) |
~200 MHz (typical) |
| Minimum Clock-to-Output (Tco) |
~3.5ns |
| Setup Time (Tsu) |
~0.5ns |
| Logic Propagation Delay |
~0.4ns per LUT |
Applications of the XC2S200-6FGG1374C
The XC2S200-6FGG1374C Spartan-II FPGA is widely used across multiple industries:
Industrial Automation
Communications
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Protocol bridging (UART, SPI, I2C, PCIe)
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Network packet processing
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Wireless baseband processing
Consumer Electronics
Embedded Systems
Why Choose the XC2S200-6FGG1374C Spartan-II FPGA?
| Advantage |
Benefit |
| High gate density (200K gates) |
Supports complex logic designs |
| 284 user I/O pins |
Flexible system integration |
| 56Kb block RAM |
Efficient on-chip data buffering |
| -6 speed grade |
Reliable high-frequency operation |
| 2.5V core voltage |
Lower power consumption |
| FGG1374 BGA package |
Compact, high-density PCB footprint |
| Xilinx ISE design tools |
Mature, well-documented toolchain |
XC2S200-6FGG1374C vs Other Spartan-II Devices
| Part Number |
Gates |
CLB Slices |
Max I/O |
Block RAM |
Speed Grade |
| XC2S50-6FGG256C |
50K |
300 |
176 |
4 x 4Kb |
-6 |
| XC2S100-6FGG456C |
100K |
600 |
260 |
7 x 4Kb |
-6 |
| XC2S200-6FGG1374C |
200K |
1,176 |
284 |
14 x 4Kb |
-6 |
| XC2S300E-6FGG456C |
300K |
1,536 |
329 |
16 x 4Kb |
-6 |
The XC2S200-6FGG1374C sits in the mid-to-upper range of the Spartan-II lineup, offering a strong balance of capacity and cost for demanding designs.
Programming and Design Tools
Xilinx supports the XC2S200-6FGG1374C through its ISE Design Suite, which includes:
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XST — Xilinx Synthesis Technology for HDL synthesis
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PACE — Pin and Area Constraints Editor
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ChipScope Pro — In-system logic analysis
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iMPACT — Device programming and configuration
Design entry supports both VHDL and Verilog HDL, with a well-established ecosystem of IP cores and reference designs.
Ordering Information
| Field |
Detail |
| Full Part Number |
XC2S200-6FGG1374C |
| Manufacturer |
Xilinx / AMD |
| RoHS Status |
Compliant |
| Lifecycle Status |
Not Recommended for New Designs (NRND) |
| Suggested Replacement |
Xilinx Spartan-6 or Artix-7 series |
For sourcing and availability of the XC2S200-6FGG1374C, explore the full range of Xilinx FPGA solutions including modern alternatives from the Spartan-6 and Artix-7 families.
Frequently Asked Questions (FAQ)
What does XC2S200-6FGG1374C mean?
The part number breaks down as: XC2S = Spartan-II family, 200 = ~200K gates, 6 = speed grade -6, FGG1374 = 1374-pin FBGA package, C = commercial temperature range.
Is the XC2S200-6FGG1374C still in production?
The Spartan-II family is classified as Not Recommended for New Designs (NRND). Xilinx recommends migrating to Spartan-6 or Artix-7 for new projects.
What voltage does the XC2S200-6FGG1374C operate at?
The core supply voltage is 2.5V (VCCINT), with I/O banks supporting 3.3V or 2.5V depending on the I/O standard selected.
What programming language is used with this FPGA?
The XC2S200-6FGG1374C supports design entry in VHDL, Verilog, and schematic capture via Xilinx ISE.