Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1373C Spartan-II FPGA: High-Performance FPGA by Xilinx

Product Details

The XC2S200-6FGG1373C Spartan-II FPGA is a versatile, high-performance Field Programmable Gate Array (FPGA) developed by Xilinx. Designed for cost-sensitive applications that demand efficient logic performance, this FPGA blends flexibility with robustness, making it ideal for embedded system designers and engineers.

What is XC2S200-6FGG1373C Spartan-II FPGA?

The XC2S200-6FGG1373C belongs to Xilinx’s Spartan-II family of FPGAs. Spartan-II devices are well-regarded for their low power consumption and moderate logic density, targeting applications in communications, industrial controls, and consumer electronics.

  • Device family: Spartan-II

  • Model: XC2S200-6FGG1373C

  • Package type: FGG (Fine-pitch Ball Grid Array)

  • Speed grade: -6 (fast)

Key Features of XC2S200-6FGG1373C Spartan-II FPGA

Feature Description
Logic Cells 2,000 configurable logic cells
I/O Pins 121 input/output pins
Embedded Block RAM 48 Kbits
Speed Grade -6 (Fastest in Spartan-II family)
Package 1373 FGGA (Fine-pitch ball grid array, 1373 pins)
Voltage 3.3V operation
Temperature Range Commercial and industrial grade available
Power Consumption Low power, optimized for cost-sensitive designs

Why Choose Spartan-II FPGA XC2S200-6FGG1373C?

  • Cost-effective solution: Spartan-II provides excellent balance between performance and price, suitable for budget-sensitive designs.

  • Flexible reconfiguration: Modify FPGA logic with multiple reprogramming cycles.

  • Reliable package: The FGG1373 package ensures good heat dissipation and compact footprint.

  • Performance: Speed grade -6 ensures fast switching and efficient timing performance.

  • Broad application scope: Widely used in telecommunications, signal processing, and embedded control.

Technical Specifications

Specification Details
Logic Cells 2,000
Slices 400 (each slice contains 2 LUTs and 2 flip-flops)
Block RAM 48 Kbits SRAM
Multipliers 0
Max I/O pins 121
Package Type Fine-pitch Ball Grid Array (FGG1373)
Core Voltage 3.3V
Speed Grade -6
Operating Temperature -40°C to 85°C (industrial available)
JTAG Support Yes

Common Applications of XC2S200-6FGG1373C Spartan-II FPGA

  • Digital signal processing (DSP)

  • Embedded system prototyping

  • Communication interface design

  • Consumer electronics control

  • Industrial automation systems

Buying Guide & Where to Purchase

If you’re looking to procure the XC2S200-6FGG1373C Spartan-II FPGA, ensure you buy from reliable distributors with verified authenticity. Always verify the package and speed grade to match your design requirements.

For deeper insights and product comparisons, visit the comprehensive resource on Xilinx FPGA to explore the Spartan-II portfolio and other FPGA families.


Summary

The XC2S200-6FGG1373C Spartan-II FPGA by Xilinx is a powerful yet affordable FPGA solution that balances performance, power consumption, and footprint. Its 2,000 logic cells in a compact FGG1373 package make it ideal for embedded and industrial applications requiring reliable and high-speed configurability.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.