Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1368C Spartan-II FPGA: High-Performance FPGA by Xilinx

Product Details

The XC2S200-6FGG1368C is a high-performance, cost-optimized field-programmable gate array (FPGA) from Xilinx’s Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and a massive 1368-pin FBGA package with up to 514 user I/O pins, this device is engineered for high-volume, logic-intensive applications where both performance and board-level flexibility are critical.

Built on Xilinx’s proven 0.18-micron, 6-layer metal CMOS process, the XC2S200-6FGG1368C operates at a 2.5V core voltage and supports a wide range of I/O standards, making it a versatile choice for communications, DSP, industrial control, and embedded system designs.


XC2S200-6FGG1368C Key Specifications

Parameter Value
Part Number XC2S200-6FGG1368C
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 42 x 42
Block RAM 56 x 4Kb (224Kb total)
Distributed SelectRAM 57,344 bits
Max User I/O 514
Package 1368-FBGA
Speed Grade -6
Core Voltage 2.5V
Process Technology 0.18µm, 6-layer metal
Max System Clock 200 MHz
Operating Temperature 0°C to 85°C (Commercial)
Configuration Memory SRAM
Mounting Type Surface Mount

XC2S200-6FGG1368C: Spartan-II FPGA Family Overview

The Spartan-II FPGA family was designed by Xilinx to deliver high gate density at the lowest possible cost, targeting high-volume production environments. The XC2S200 sits at the top of the Spartan-II lineup, offering the maximum available resources within the family.

Spartan-II Family Comparison Table

Device System Gates Logic Cells CLB Array Block RAMs Max I/O
XC2S15 15,000 432 12×12 4 86
XC2S30 30,000 972 18×18 8 132
XC2S50 50,000 1,728 24×24 12 176
XC2S100 100,000 2,700 30×30 24 260
XC2S150 150,000 3,888 36×36 36 260
XC2S200 200,000 5,292 42×42 56 514

The XC2S200-6FGG1368C is the largest and most capable device in the Spartan-II series, making it the preferred choice when maximum logic density and I/O count are required.


XC2S200-6FGG1368C Architecture and Logic Resources

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG1368C is built around a 42×42 array of Configurable Logic Blocks (CLBs). Each CLB contains:

  • 4 slices per CLB

  • 2 four-input Look-Up Tables (LUTs) per slice

  • 2 flip-flops per slice

  • Dedicated fast carry chain logic

  • Arithmetic logic support

  • SRL16 shift register mode support

This architecture enables efficient implementation of both combinational and sequential logic, arithmetic functions, and shift registers without consuming additional resources.

SelectRAM+ Block Memory

The XC2S200-6FGG1368C includes 56 block RAMs, each 4Kb in size, totaling 224Kb of on-chip block RAM. These can be configured as:

  • Single-port or dual-port RAM

  • ROM

  • FIFO buffers

In addition, 57,344 bits of distributed SelectRAM are available within the CLB fabric for smaller, distributed memory needs.

Clock Management with Delay-Locked Loops (DLL)

The device features 4 Delay-Locked Loops (DLLs) and 4 dedicated global clock buffers, providing:

  • Zero clock skew distribution

  • Frequency synthesis and multiplication

  • Phase shifting capabilities

  • Jitter reduction for high-speed interfaces


XC2S200-6FGG1368C I/O Capabilities and Supported Standards

With 514 user I/O pins in the 1368-FBGA package, the XC2S200-6FGG1368C offers exceptional connectivity. The I/O banks support a wide range of industry-standard interfaces:

I/O Standard Description
LVTTL Low-Voltage TTL (3.3V)
LVCMOS2 / LVCMOS3 Low-Voltage CMOS
PCI 3.3V PCI bus compatible
GTL / GTLP Gunning Transceiver Logic
HSTL High-Speed Transceiver Logic
SSTL2 / SSTL3 Stub Series Terminated Logic

This broad I/O standard support makes the XC2S200-6FGG1368C compatible with a wide range of processors, memory interfaces, and peripheral devices.


XC2S200-6FGG1368C Configuration Methods

As an SRAM-based FPGA, the XC2S200-6FGG1368C requires configuration on every power-up. Supported configuration modes include:

  • JTAG (IEEE 1149.1 boundary scan) — for in-system programming and debugging

  • Master Serial — using an external serial PROM

  • Slave Serial — driven by an external controller

  • Slave Parallel (SelectMAP) — for fast parallel configuration

Configuration data is typically stored in an external flash memory or Xilinx Platform Flash PROM and loaded automatically at startup.


XC2S200-6FGG1368C Package Information

Package Pins User I/O Body Size
FG456 456 284 23×23 mm
FG676 676 408 27×27 mm
FG1368 1368 514 37×37 mm

The FGG1368 package (used in the XC2S200-6FGG1368C) is the largest available option for this device, providing the maximum I/O count of 514 pins — ideal for designs requiring dense interconnects or multiple high-speed buses.


XC2S200-6FGG1368C Speed Grade Comparison

Speed Grade Max Frequency Logic Delay Typical Use Case
-5 ~170 MHz Slower Cost-sensitive, lower-speed designs
-6 ~200 MHz Standard General-purpose, balanced performance
-7 ~220 MHz Fastest High-speed, timing-critical designs

The -6 speed grade of the XC2S200-6FGG1368C offers a solid balance between performance and cost, supporting system clocks up to 200 MHz — sufficient for the vast majority of communications and DSP workloads.


XC2S200-6FGG1368C Applications

The XC2S200-6FGG1368C Spartan-II FPGA is widely used across multiple industries:

Communications and Networking

  • Protocol bridging and conversion

  • Line card logic

  • Packet processing and filtering

Digital Signal Processing (DSP)

  • FIR/IIR filter implementation

  • FFT engines

  • Image and video processing pipelines

Industrial and Embedded Control

  • Motor control logic

  • Sensor interface aggregation

  • Real-time control loops

Consumer Electronics

  • Set-top box logic

  • Display controllers

  • Audio processing

Automotive

  • ADAS sensor interfacing

  • CAN/LIN bus controllers

  • Functional safety logic


Why Choose the XC2S200-6FGG1368C?

The XC2S200-6FGG1368C stands out in the Spartan-II lineup for several reasons:

  • Highest gate count (200K) in the Spartan-II family

  • Maximum I/O availability (514 pins) via the 1368-FBGA package

  • Proven 0.18µm process with mature toolchain support (Xilinx ISE)

  • Broad I/O standard compatibility reduces external level-shifting components

  • JTAG support simplifies in-system debugging and production testing

  • Long-term availability for legacy and industrial designs

For engineers sourcing Xilinx programmable logic devices, the full range of options is available at Xilinx FPGA.


XC2S200-6FGG1368C Ordering Information

Part Number Package Speed Grade Temperature Status
XC2S200-6FGG1368C 1368-FBGA -6 Commercial (0°C~85°C) Active
XC2S200-5FGG1368C 1368-FBGA -5 Commercial (0°C~85°C) Active
XC2S200-7FGG1368C 1368-FBGA -7 Commercial (0°C~85°C) Active
XC2S200-6FGG1368I 1368-FBGA -6 Industrial (-40°C~100°C) Active

XC2S200-6FGG1368C Technical Summary

The XC2S200-6FGG1368C Spartan-II FPGA delivers 200,000 system gates, 5,292 logic cells, 224Kb of block RAM, and 514 I/O pins in a 1368-FBGA package — all running at up to 200 MHz on a 2.5V core. It supports JTAG, serial, and parallel configuration, a wide range of I/O standards, and four on-chip DLLs for robust clock management. Whether you’re building communications infrastructure, DSP pipelines, or industrial control systems, the XC2S200-6FGG1368C provides the logic density and I/O flexibility to get the job done.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.