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Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1365C Spartan-II FPGA: High-Performance FPGA by Xilinx

Product Details

Overview of XC2S200-6FGG1365C Spartan-II FPGA

The XC2S200-6FGG1365C Spartan-II FPGA is a versatile, cost-effective Field Programmable Gate Array (FPGA) developed by Xilinx. Designed to deliver powerful logic performance combined with low power consumption, this FPGA is ideal for embedded system developers, digital circuit designers, and engineers seeking high reliability and flexibility for a variety of applications.

Built on the Spartan-II family architecture, the XC2S200-6FGG1365C offers an excellent balance between performance, density, and cost-efficiency, making it suitable for advanced digital signal processing, communications, and control system designs.


Key Features of XC2S200-6FGG1365C Spartan-II FPGA

Feature Description
Logic Cells 2,000 Equivalent Logic Gates
Fabric Technology 0.18 µm CMOS Process
Package Type 1365-pin Fine-pitch Ball Grid Array (FBGA)
Speed Grade -6 (Fastest speed performance within Spartan-II)
Configurable I/O Pins Up to 136
Operating Voltage Core: 3.3 V; I/O: 3.3 V
Power Consumption Low power, suitable for portable and embedded systems
Operating Temperature Commercial and Industrial Grade ranges

Detailed Specifications

FPGA Architecture and Performance

Specification Details
Logic Blocks 324 Slices (Each contains 2 LUTs and 2 flip-flops)
Block RAM 72 Kbits RAM
Multipliers Up to 2 Embedded Multipliers (18×18 bits)
Clock Management Phase-Locked Loop (PLL)
I/O Standards Supported LVTTL, LVCMOS, PCI, SSTL

Packaging and Speed Grade

Item Details
Package FGG1365 (Fine-pitch BGA)
Dimensions Approx. 20mm x 20mm
Speed Grade -6 (Fast)
Junction Temperature -40°C to +100°C (Industrial Range)

Why Choose XC2S200-6FGG1365C Spartan-II FPGA?

  • Robust Performance: The Spartan-II family combines high-density logic and memory with fast-speed capabilities, making it suitable for resource-intensive applications.

  • Cost-Effective Solution: Competitive pricing with high integration levels provides great value for embedded system designers looking for performance without excessive cost.

  • Flexible I/O Support: Multiple configurable I/O pins support diverse peripheral interfacing requirements.

  • Low Power Consumption: Ideal for portable electronics and energy-efficient designs.

  • Reliable Operation: Manufactured by Xilinx, the global leader in programmable logic devices, ensuring quality and long-term availability.


Application Areas for XC2S200-6FGG1365C

  • Digital Signal Processing (DSP)

  • Communication Systems and Network Equipment

  • Embedded System Prototyping

  • Industrial Automation and Control

  • Data Acquisition and Monitoring

  • Custom Logic and Interface Adapters


Additional Resources

For further details and purchasing options, explore more FPGA models and technical guides at the trusted Xilinx FPGA LINK.


Summary Table: XC2S200-6FGG1365C Spartan-II FPGA at a Glance

Attribute Value
Model XC2S200-6FGG1365C
Family Spartan-II
Logic Cells 2000
Package FGG1365 (BGA)
Speed Grade -6
I/O Pins Up to 136
Technology 0.18 µm CMOS
Embedded Memory 72 Kbits
Multipliers 2
Power Low
Operating Temp. -40°C to +100°C

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.