Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1363C: High-Performance Spartan-II FPGA from Xilinx

Product Details

The XC2S200-6FGG1363C is a high-performance FPGA (Field Programmable Gate Array) from the Xilinx Spartan-II family, designed for cost-sensitive embedded applications and prototyping. It offers a robust combination of logic resources, IO capabilities, and speed grades, making it ideal for digital signal processing, telecommunications, and consumer electronics.

This device reflects Xilinx’s tradition of delivering flexible, programmable silicon optimized for low power and high integration density.


Key Features of XC2S200-6FGG1363C

Feature Description
FPGA Family Spartan-II
Logic Cells 200K system gates equivalence
Package Type FGG (Fine-pitch Grid Array)
Package Size 1363 Pins
Speed Grade -6 (Higher speed, suitable for fast logic)
Core Voltage 3.3V
I/O Pins Multiple I/O banks with flexible standards
Embedded RAM Block RAM available for efficient memory use
Power Consumption Optimized for low power applications

Why Choose XC2S200-6FGG1363C?

High Logic Density and Performance

  • 200K system gates provide ample digital logic resources, enabling complex designs with multiple functions integrated into a single device.

  • The -6 speed grade delivers fast switching speeds suitable for advanced signal processing.

Flexible I/O Capabilities

  • Supported interfaces include LVTTL, LVCMOS, and others, facilitating integration with a wide range of peripherals and memory devices.

  • The 1363-pin FGG package ensures enough physical IO pins for diverse connectivity requirements.

Power Efficiency

  • Designed with Spartan-II family low-power features, the XC2S200-6FGG1363C is well-suited for battery-powered and thermally sensitive environments.


XC2S200-6FGG1363C Technical Specifications

Specification Value
Total System Gates 200,000
Logic Cells Approximately 2770
Block RAM 180 Kbits
Multipliers 12 (18×18-bit) multiplier blocks
Max Frequency Up to 200 MHz (depending on design)
Voltage Supply 3.3V core and I/O
Package Dimensions 25 x 25 mm (FGG package)
Operating Temp Range -40°C to 85°C

Applications for XC2S200-6FGG1363C

  • Digital signal processing: Real-time DSP tasks such as filtering, modulation, and encoding.

  • Embedded systems: Microcontroller offload or custom peripheral control.

  • Communications: Protocol bridging, data packet processing, and network interface controllers.

  • Consumer electronics: Video processing, image sensors, or user interface management.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.