Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1360C FPGA – High-Performance Xilinx Spartan-II Device

Product Details

The XC2S200-6FGG1360C is a member of the renowned Spartan-II family from Xilinx, designed to deliver cost-effective, high-performance, and power-efficient FPGA solutions for a broad range of digital logic applications. This device balances capacity and speed to meet the requirements of embedded systems, communications, and consumer electronics.


Overview of XC2S200-6FGG1360C Spartan-II FPGA

The XC2S200-6FGG1360C offers a robust feature set suitable for medium complexity digital designs. Leveraging Xilinx’s Spartan-II technology, it provides:

  • Moderate logic resources

  • Versatile I/O capabilities

  • Flexible packaging options

  • Low power consumption

  • Affordable pricing for volume deployment

This makes it a popular choice for engineering teams seeking reliable FPGA solutions for prototyping and production environments.


Key Specifications of XC2S200-6FGG1360C

Feature Description
Device Family Spartan-II
Logic Cells 200k system gates equivalent
Speed Grade -6 (Moderate speed)
Package Type FGG1360 (Fine-pitch Ball Grid Array)
Max Operating Frequency Up to 250 MHz (application dependent)
I/O Pins 136 I/O lines
Core Voltage 3.3 V
Power Consumption Low power, optimized for cost-sensitive apps
Programming Technology SRAM-based with JTAG support

Features and Benefits

Flexible Logic and High-Speed Performance

  • Built with 200k system gates offering adequate logic density for diverse embedded applications.

  • Supports moderate clock speeds up to 250 MHz, ideal for synchronous digital designs.

  • Suitable for designs requiring multiple I/Os, thanks to 136 configurable pins.

Packaging and Integration

  • Utilizes a FGG1360 BGA package, providing robust thermal performance and easy integration on compact PCBs.

  • Compatible with industry-standard programming tools and flows.

Cost-Effective and Power-Efficient

  • Spartan-II devices are known for low power consumption, beneficial for battery-powered and portable devices.

  • Offers an excellent balance between price and performance.


XC2S200-6FGG1360C Use Cases

Application Area Description
Consumer Electronics Media players, gaming consoles, interface logic
Embedded Systems Control units, signal processing
Communications Data routing, protocol bridging
Prototyping & Development FPGA-based test platforms, rapid prototyping

Why Choose Spartan-II FPGAs Like XC2S200-6FGG1360C?

  • Mature and well-supported architecture with extensive development resources.

  • Wide availability and cost competitiveness for bulk projects.

  • Strong community and Xilinx ecosystem support.

For engineers looking for a reliable, well-documented FPGA, the XC2S200-6FGG1360C is a solid choice.


Learn More About Xilinx FPGA Solutions

To explore a broader range of Xilinx FPGA devices and related solutions, visit the comprehensive Xilinx FPGA LINK.


Summary

Parameter Value
Device XC2S200-6FGG1360C
Family Spartan-II
Logic Capacity 200k system gates equivalent
Speed Grade -6
Package FGG1360 BGA
I/O Pins 136
Operating Voltage 3.3 V
Max Frequency 250 MHz (estimated max)
Programming SRAM-based, JTAG

The XC2S200-6FGG1360C offers a compelling mix of performance, power efficiency, and affordability that fits diverse FPGA applications across industries.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.