Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1339C: High-Performance Xilinx Spartan-II FPGA Overview

Product Details

The XC2S200-6FGG1339C is a prominent member of the Xilinx Spartan-II family, designed to provide a cost-effective, high-performance solution for programmable logic needs. As the industry transitioned toward more complex digital designs, the Spartan-II series became a cornerstone for engineers requiring a balance between price and power.

This specific Field Programmable Gate Array (FPGA) offers a versatile architecture that supports high-speed logic, advanced memory features, and flexible I/O standards. Whether you are working on industrial control systems or consumer electronics, understanding the capabilities of the XC2S200-6FGG1339C is essential for optimizing your hardware design.

For those looking for a reliable source of high-quality components, you can explore more options via this Xilinx FPGA link.


Key Features of the XC2S200-6FGG1339C FPGA

The XC2S200-6FGG1339C is engineered using a 0.22µm process with five layers of metal, ensuring efficient power consumption and high logic density. Below are the standout features that define this component:

  • High Logic Capacity: With 200,000 system gates, it provides ample space for complex digital circuits.

  • Flexible I/O Standards: Supports multiple signaling standards, including LVTTL, LVCMOS, and PCI.

  • On-Chip Block RAM: Integrated memory blocks for efficient data storage and buffering.

  • Low Power Consumption: Operates on a 2.5V core voltage, reducing the thermal footprint of your PCB.

  • Advanced Clock Management: Features four dedicated Delay-Locked Loops (DLLs) for precise clock distribution and deskewing.


Technical Specifications Table

To better understand the hardware limits and capabilities of the XC2S200-6FGG1339C, refer to the detailed technical specifications below.

Table 1: Core Architecture Specifications

Feature Specification
System Gates 200,000
Logic Cells 5,292
CLB Array (Rows x Columns) 28 x 42
Total CLBs 1,176
Maximum User I/O Up to 284
Block RAM Bits 57,344
Distributed RAM Bits 75,264

Table 2: Operating Conditions and Performance

Parameter Value
Core Supply Voltage (Vccint) 2.5V
I/O Supply Voltage (Vcco) 1.5V to 3.3V
Speed Grade -6 (High Speed)
Package Type FGG1339 (Fine-pitch Ball Grid Array)
Operating Temperature 0°C to +85°C (Commercial)

Why Choose the Spartan-II XC2S200-6FGG1339C?

Versatility in Industrial Applications

The XC2S200-6FGG1339C is frequently utilized in industrial automation and communication infrastructure. Its ability to handle high-speed data processing while maintaining low latency makes it ideal for real-time control systems.

Cost-Efficiency and Time-to-Market

By using the Xilinx Spartan-II series, developers can significantly reduce the overall Bill of Materials (BOM) cost. The reprogrammable nature of the FPGA allows for rapid prototyping and easy firmware updates, shortening the time-to-market for new products.

Superior Memory Management

With its combination of Block RAM and Distributed RAM, this FPGA handles data-intensive tasks efficiently. This memory hierarchy is particularly useful for implementing FIFOs, dual-port buffers, and small lookup tables without exhausting logic resources.


Applications of the XC2S200-6FGG1339C

The flexibility of the XC2S200-6FGG1339C allows it to be integrated into a wide variety of sectors:

  1. Consumer Electronics: Used in high-definition displays and set-top boxes for video processing.

  2. Automotive Systems: Ideal for advanced driver-assistance systems (ADAS) and infotainment units.

  3. Telecommunications: Employed in networking switches and routers for packet processing.

  4. Legacy System Support: A perfect fit for maintaining and upgrading older hardware that requires 5V-tolerant I/Os (via external clamping).

Implementing High-Speed Interfaces

Thanks to the built-in DLLs and support for the PCI bus standard, the XC2S200-6FGG1339C can interface seamlessly with high-speed peripherals. This ensures that your system remains bottleneck-free during heavy data transfers.


Conclusion

The XC2S200-6FGG1339C remains a powerful and relevant choice for designers who need a stable, well-documented, and high-performance FPGA. Its robust feature set, including 200k system gates and sophisticated clock management, ensures it can meet the demands of modern digital design while remaining budget-friendly.

When sourcing components for your next project, ensure you select genuine Xilinx parts to guarantee reliability and performance standards. By leveraging the Spartan-II architecture, you are investing in a proven technology that balances innovation with cost-effectiveness.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.