Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

The XC2S200-6FGG1337C Xilinx Spartan-II FPGA: Technical Specifications and Overview

Product Details

The XC2S200-6FGG1337C is a prominent member of the Xilinx Spartan-II Field Programmable Gate Array (FPGA) family. Designed to deliver a cost-effective alternative to high-end gate arrays, this component provides the flexibility of programmable logic with the performance levels required for high-volume consumer electronics and industrial applications.

As part of the Xilinx FPGA lineup, the Spartan-II series is engineered using a 0.15-micron process, offering a perfect balance between power efficiency and gate density. Below is a detailed breakdown of its features, specifications, and use cases to help you understand why this specific part remains a staple in legacy and cost-sensitive designs.


Key Features of the XC2S200-6FGG1337C

The Spartan-II XC2S200 series is defined by its “Fit, Form, and Function” reliability. Here are the core highlights of this FPGA:

  • High Logic Density: Features 200,000 system gates, making it suitable for complex logic integration.

  • Advanced Architecture: Built on the Virtex-derived architecture, it supports multiple I/O standards and high-speed networking.

  • Flexible Power Management: Operates with a 2.5V core voltage, reducing overall power consumption compared to older 5V or 3.3V architectures.

  • Integrated Memory: Features dedicated Block RAM for efficient data buffering and storage.

  • Speed Grade -6: Offers optimized timing and clock speeds for demanding digital signal processing tasks.


Technical Specifications Table

To provide a clear understanding of the XC2S200-6FGG1337C capabilities, the following table outlines its primary technical parameters:

Table 1: Core Performance Specifications

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array (Rows x Cols) 28 x 42
Total Distributed RAM Bits 75,264
Total Block RAM Bits 56,384
Maximum User I/O 284
Core Voltage 2.5V

Table 2: Environmental and Physical Characteristics

Attribute Details
Package Type FGG (Fine-Pitch Ball Grid Array)
Pin Count 1337 (Variant Dependent)
Speed Grade -6
Operating Temperature 0°C ~ 85°C (Commercial)
Process Technology 0.15µm

Why Choose the XC2S200-6FGG1337C?

Versatile I/O Support

One of the major advantages of the XC2S200-6FGG1337C is its support for 16 different I/O standards. This versatility allows engineers to interface the FPGA with various external components without needing complex level shifters. It supports LVTTL, LVCMOS2, PCI, GTL, and more.

Cost-Optimized Programmability

In the modern semiconductor market, balancing cost and performance is vital. The Spartan-II series was specifically designed to compete with traditional ASICs. By using the XC2S200-6FGG1337C, developers can avoid the high NRE (Non-Recurring Engineering) costs associated with custom silicon while maintaining the ability to update hardware in the field.

Robust Logic Resources

With over 5,000 logic cells and significant Block RAM, this FPGA can handle tasks ranging from simple glue logic to sophisticated state machines and digital controllers.


Common Applications for Spartan-II FPGAs

The XC2S200-6FGG1337C is widely utilized across several industries due to its reliability and proven architecture.

  1. Industrial Automation: Used in motor control systems, PLC communication modules, and sensor interfacing.

  2. Consumer Electronics: Ideal for set-top boxes, digital displays, and home networking equipment.

  3. Telecommunications: Frequently found in base station controllers and interface bridging hardware.

  4. Legacy System Maintenance: A go-to component for repairing or upgrading older industrial systems that require 2.5V logic compatibility.


Conclusion

The XC2S200-6FGG1337C remains a powerful solution for designers looking for a high-gate-count FPGA at a competitive price point. Its combination of Spartan-II efficiency and Xilinx’s robust development ecosystem makes it a reliable choice for both new designs and long-term maintenance projects.

Whether you are looking for high-speed logic processing or versatile I/O capabilities, this FPGA delivers consistent performance. For those seeking the latest in programmable logic technology, exploring the broader range of Xilinx FPGA solutions is highly recommended to find the perfect fit for your specific application requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.