Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG1331C: High-Performance Xilinx Spartan-II FPGA Product Overview

Product Details

The XC2S200-6FGG1331C is a prominent member of the Xilinx Spartan-II family, designed to provide a high-volume, cost-effective solution for logic integration. By leveraging advanced 0.18-micron process technology, this Field Programmable Gate Array (FPGA) offers a perfect balance between performance and affordability.

In this guide, we will explore the technical specifications, key features, and typical applications of the XC2S200-6FGG1331C to help you determine if it is the right fit for your next embedded system design.

Key Features of the XC2S200-6FGG1331C FPGA

The Spartan-II series is renowned for its versatility. The XC2S200-6FGG1331C specifically delivers approximately 200,000 system gates, making it suitable for complex digital signal processing and bridge logic tasks.

  • Cost-Optimized Architecture: Optimized for high-volume consumer electronics and industrial applications.

  • Flexible I/O Standards: Supports multiple voltage levels and signaling standards (LVTTL, LVCMOS, PCI, etc.).

  • Abundant Memory Resources: Features dedicated Block RAM for efficient data buffering.

  • Low Power Consumption: Designed with power-saving modes to extend the life of portable devices.

Technical Specifications for XC2S200-6FGG1331C

To better understand the capabilities of this device, refer to the detailed technical specifications table below.

Table 1: Core Parameters of XC2S200-6FGG1331C

Parameter Specification
Logic Cells 5,292
System Gates 200,000
CLB Array (Row x Col) 28 x 42
Total CLBs 1,176
Block RAM Bits 57,344
Maximum User I/O 284
Speed Grade -6
Operating Temperature 0°C to 85°C (Commercial)

Understanding the XC2S200-6FGG1331C Architecture

The architecture of the XC2S200-6FGG1331C is based on the proven Virtex technology, which ensures a reliable development path. Furthermore, the inclusion of Delay-Locked Loops (DLLs) allows for precise clock management and deskewing, which is critical for high-speed synchronous designs.

Distributed and Block RAM

One of the standout features of this Xilinx FPGA is its dual-tier memory approach. Users can utilize Distributed RAM for small, fast look-up tables, while the Block RAM is ideal for larger data structures like FIFOs and video buffers.

Table 2: Comparison of Memory Resources

Memory Type Benefit Typical Use Case
Distributed RAM Extremely fast access, low overhead Small registers, state machines
Block RAM High density, dedicated logic Frame buffers, circular queues

Common Applications for the Spartan-II XC2S200 Series

The XC2S200-6FGG1331C is a versatile component found in various industries. Because it offers a high gate count at a low price point, it is frequently used in:

  1. Industrial Automation: Handling sensor fusion and motor control logic.

  2. Consumer Electronics: Powering set-top boxes and digital displays.

  3. Communication Systems: Implementing protocol converters and high-speed interfaces.

  4. Legacy System Support: Replacing obsolete ASIC designs with programmable logic.

Why Choose XC2S200-6FGG1331C for Your Project?

Choosing the right FPGA involves balancing performance, power, and cost. The XC2S200-6FGG1331C is particularly effective because it provides a bridge between low-end CPLDs and high-end Virtex FPGAs. Consequently, developers can implement sophisticated logic without the high overhead of premium silicon.

Speed Grade and Packaging

The “-6” speed grade indicates a high-performance timing specification within the Spartan-II family. The “FGG1331” package provides a high number of pins in a Fine-pitch Ball Grid Array (FBGA), ensuring plenty of connectivity for complex I/O requirements.

Conclusion

The Xilinx XC2S200-6FGG1331C remains a reliable choice for engineers looking for a stable and cost-effective FPGA solution. With its rich feature set and flexible architecture, it continues to support a wide array of modern and legacy digital systems.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.